• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.77-86
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• 1998

A two-chip humidity sensor system has been developed which consists of a capacitive sense element die and a CMOS interface chip. The sense element was fabricated using thin polyimide films on (100) silicon substrate and showed excellent linearity(0.72%FS), low hysteresis (<3%) and low temperature coefficient(-0.0285 ~-0.0542pF/K) over a wide range of relative humidity and temperature. The capacitance-relative humidity characteristic exhibited a drift of 2~3% after 9 weeks of exposure to 4$0^{\circ}C$/90%RH. The signal-conditioning circuitry was fabricated using an 1.2- ${\mu}{\textrm}{m}$, one poly double metal CMOS process. The measured output voltage of the sensor system was directly proportional to relative humidity and showed good agreement with theory.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.289-294
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• 2008

A 77 GHz 3-stage low noise amplifier (LNA) employing one common source and two cascode stages is developed using $0.13{\mu}m$ CMOS process. To compensate for the low gain which is caused by lossy silicon substrate and parasitic element of CMOS transistor, positive feedback technique using parasitic inductance of bypass capacitor is adopted to cascode stages. The developed LNA shows gain of 7.2 dB, Sl1 of -16.5 dB and S22 of -19.8 dB at 77 GHz. The return loss bandwidth of LNA is 71.6 to 80.9 GHz (12%). The die size is as small as $0.7mm\times0.8mm$ by using bias line as inter-stage matching networks. This LNA shows possibility of 77 GHz automotive RADAR system using $0.13{\mu}m$ CMOS process, which has advantage in cost compared to sub-100 nm CMOS process.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Design & Manufacturing
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• v.16 no.1
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• pp.43-49
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• 2022

As technologies in various industrial fields develop, high-quality parts are required. In the past, precision parts were produced by the contact machining method, but the contact machining method has clear limitations. In order to solve this problem, research on a non-contact processing method has been conducted, and laser processing and electric discharge processing are representative. However, the non-contact method has a problem in that productivity is insufficient, and there is a problem that it takes a lot of time to continuously process microholes. Researchers have developed an electron beam drilling equipment for continuous processing of fine holes, and a vaporization amplification sheet to increase the processing efficiency of the equipment. In this study, a cylindrical vaporization amplification sheet using room temperature curing type silicon was fabricated, and the metal distribution and thickness uniformity of the produced sheet were analyzed. In order to manufacture a cylindrical vaporization amplification sheet, an equipment capable of using centrifugal force was developed, and a sample in which metal powder was evenly distributed and a constant thickness was produced.

• Design & Manufacturing
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• v.17 no.2
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• pp.15-21
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• 2023

In this study, a diamond turning machine and a laser-assisted machining module were utilized for the complex combined cutting of aspheric shapes and fine patterns on the surface of high-hardness brittle material, silicon. The analysis of material's form accuracy and corrective machining was conducted based on key factors such as laser output, rotational speed, feed rate, and cutting depth to achieve form accuracy below 1 ㎛ and surface roughness below 0.1 ㎛. The cutting condition and corrective machining methods were investigated to achieve the desired form accuracy and surface roughness. The rotational speed of the spindle and the linear feed rate of the diamond turning machine were varied in five stages for the cutting condition test. Surface roughness and form accuracy were measured using both a contact surface profilometer and a non-contact surface profilometer. The experimental results revealed a tendency of improved surface roughness with increased rotational speed of the workpiece, and the best surface roughness and form accuracy were observed at a feed rate of 5 mm/min. Furthermore, based on the cutting condition experiments, corrective machining was performed. The experimental results demonstrated an improvement in form accuracy from 0.94 ㎛ to 0.31 ㎛ and a significant reduction in the average value of the surface roughness curve from 0.234 ㎛ to 0.061 ㎛. This research serves as a foundation for future studies focusing on the machinability in relation to laser output parameters.

• Design & Manufacturing
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• v.17 no.2
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• pp.27-32
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• 2023

Liquid silicon rubber (LSR) has fine thermal compatibility and is widely used in various fields such as medical care and automobiles because it is easy to implement products with good fluidity. With the recent development of flexible sensors, the focus has been on manufacturing conductive elastomers, such as silicone as elastic materials, and carbon black, CNT, and graphene are mainly used as nanomaterials that impart conductive phases. In this study, mechanical behavior and curing behavior were measured and analyzed to manufacture a CB-LSR complex by adding Carbon Black to LSR and to identify properties. As a result of the compression test, the elastic modulus tended to increase as carbon black was added. When the swelling test and the compression set test were conducted, the swelling rate tended to decrease as the content of carbon black increased, and the compression set tended to increase. In addition, DSC measurements showed that the total amount of reaction heat increased slightly as the carbon black content increased. It is considered that carbon black was involved in the crosslinking of LSR to increase the crosslinking density and have a positive effect on oil resistance reinforcement.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.1-8
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• 2004

This paper describes the design of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been designed in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3 metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$ and the estimated power dissipation is less than 900 ㎽ with a single 5 V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.11-17
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• 2004

This paper describes the implementation of monolithic optical transceiver circuitry being used as a part of the fiber optic modules. It has been fabricated in 0.6 ${\mu}{\textrm}{m}$ 2-poly 3-metal silicon CMOS analog technology and operates at 155.52 Mbps(STM-1) data rates. It drives laser diode to transmit intensity modulated optical signal according to 155.52 Mbps electrical data from system. Also, it receives 155.52 Mbps optical data that transmitted from other systems and converts it to electrical data using photo diode and amplifier. To avoid noise and interference between transmitter and receiver on one chip, layout techniques such as special placement, power supply separation, guard ring, and protection wall were used in the design. The die area is 4 ${\times}$ 4 $\textrm{mm}^2$, and it has 32.3 ps rms and 335.9 ps peak to peak jitter on loopback testing. the measured power dissipation of whole chip is 1.15 W(230 mW) with a single 5 V supply.

• YAKHAK HOEJI
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• v.36 no.6
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• pp.598-603
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• 1992

The purpose of this study was to assess the effect of three formulations; product A (polyethylene glycol was used as a main dispersing agent), product B (wax mixture was used as a main dispersing agent) and product C(silicon dioxide was used as a main dispersing agent) on bioavailability of acetaminophen soft gelatin capsules(softgels) and to develop an effective acetaminophen softgel which exhibits an excellent bioavailability. Acetaminophen softgels of various formulations were prepared as 4 minim round type by rotary die method. Four softgels of the three formulation (A, B, C), each of which contained 50 mg acetaminophen, were administered orally to 12 normal healthy rabbits using a three-way cross over design. Plasma acetaminophen concentrations were measured by HPLC. The results obtained in this study were as follows: 1. The Tmax rank order of acetaminophen softgel was C$(63.75{\pm}10.62\;min)$>A$(36.25{\pm}5.37\;min)$>B$(35{\pm}6.74\;min)$. 2. The decreasing Cmax order of softgel product was A$(93.51{\pm}0.55\;{\mu}g/ml)$>B$(3.16{\pm}0.37\;{\mu}g/ml)$>C$(2.6{\pm}0.55\;{\mu}g/ml)$. 3. The $[AUC]^{\infty}_0$ rank order for three acetaminophen softgel formulations was A $(14.89{\pm}1.56\;{\mu}g/ml{\cdot}min)$ >B$(14.39{\pm}1.43\;{\mu}g/ml{\cdot}min)$>C$(11.45{\pm}1.49\;{\mu}g/ml{\cdot}min)$. 4. Pharmacokinetic parameters such as Tmax, Cmax and $[AUC]^{\infty}_0$ of product A and B did not differ significantly(p>0.05). On the other hand, those of product C were significantly different(p>0.05).