• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1442-1447
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• 2003

Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.143-148
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• 2019

Numerous pipe lines can be found on various plant-based industrial sites. These pipelines should be periodically checked for defects. Most of these pipelines are internally inaccessible and difficult to visually inspect. Therefore, the inspection is being carried out with the help of non-contact inspection equipment such as ultrasonic flaw detection equipment. The use of ultrasonic flaw detection equipment can raise time and efficiency issues. In order to solve this problem, we will study the basic technology necessary for the development of automated inspection system equipped with ultrasonic measuring equipment and verify the validity through the fabrication of the demonstration device.

• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.15-20
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• 2019

Inspection and measurement of surface quality is one of the most critical processes for manufacturing products such as semiconductor wafers, sapphire substrates, and display panels. The vibrations of the inspection and measurement devices are supposed to be the most dominant factors for severe measurement errors and longer measuring time. In this study, dynamic characteristics of an inspection and measurement device are analyzed through frequency response experiment and computer simulation to obtain parameters such as frequencies, magnitudes, mode shapes, and periods of vibrations. And then an active damper which consists of sensor, interface board, and actuator is designed based on the parameters to formulate the most effective reaction signal to suppress the vibrations which is generated by an interface board, and provided by an actuator. If the vibrations are measured by the sensor, the active damper immediately generates and provides the corresponding reaction signal to inspection and measurement device. The result shows that the active damper can suppress structural vibrations effectively and reduce measuring time of the device and enhance the productivity.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.1
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• pp.34-40
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• 2012

We have developed a highly sensitive inspection technique based on an electron beam inspection for detecting the contact failure of a poly-Si plugged layer. It was difficult to distinguish the contact failure from normal landing plugs with high impedance. Normally, the thermal annealing method has been used to decrease the impedance of poly-Si plugs and this method increases the difference of charged characteristics and voltage contrast. However, the additional process made the loss of time and broke down the device characteristics. Here, the interval scanning method without thermal annealing was effectively applied to enhance the difference of surface voltage between well-contacted poly-Si plugs and incomplete contact plugs. It is extremely useful to detect the contact failures of non-annealed plug contacts with high impedance.

• Journal of the Semiconductor & Display Technology
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• v.20 no.2
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• pp.126-130
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• 2021

The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

• Journal of the Semiconductor & Display Technology
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• v.11 no.3
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• pp.39-44
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• 2012

Electronics in modern lives have become more miniaturized and precise. Multi Layered Ceramic Capacitor (MLCC) occupies 50% of electronic components consisting of electronics. This high volume of the production needs high speed and more precise machine performances. The dominate parts of the production equipments are the module transporting components and the visual inspection module. Most visual inspection has been off-line because of the image processing time. In this paper, a new image processing method is proposed to reduce thousands of matrix calculation for image processing and realize on-line high speed inspection.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.1
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• pp.105-114
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• 2004

In this paper, we design the circuits for DC parameter test of semiconductor devices. The DC parameter tester is the system which inspects the DC parameters of semiconductor devices. In the designed circuits, voltage(current) forcing current(voltage) sensing methods are used to inspect the parameters. The designed circuits are simulated by OR-CAD. The simulation results have good performance.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.1
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• pp.15-19
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• 2001

Current leakage is the major failure mode of semiconductor device characteristic failures. Conventionally, failures such as short circuit breaks and gate breakdowns have been analyzed and the detected causes have been reflected in the fabrication process. By using a wafer-level emission-leakage failure analysis method (in-line QC), we analyzed leakage mode failure, which is the major failure detected during the probe inspection process for LSIs, typically DRAMs and CMOS logic LSIs. We have thus developed a new technique that copes with the critical structural failures and random failures that directly affect probe yields.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.6
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• pp.45-54
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• 2004

Usually, according as accumulation degree of semi-conductor element increases, dynamic mistake test time increases sharply, and use of pattern generator is essential at manufacturing process to solve these problem. In this paper, we designed the PLD(Programmable Logic Device) circuit of pattern generator to examine dynamic mistake of semi-conductor element. Such all item got result that is worth verified action of return trip and function through simulation, and satisfy.