• Title/Summary/Keyword: nitride

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Pulsed DC Bias Effects on Substrate in TiNx Thin Film Deposition by Reactive RF Magnetron Sputtering at Room Temperature (반응성 RF 마그네트론 스퍼터링에 의한 TiNx 상온 성막에 있어서 기판 상의 펄스상 직류 바이어스 인가 효과)

  • Kim, Seiki
    • Journal of Surface Science and Engineering
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    • v.52 no.6
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    • pp.342-349
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    • 2019
  • Titanium nitride(TiN) thin films have been deposited on PEN(Polyethylene naphthalate) substrate by reactive RF(13.56 MHz) magnetron sputtering in a 25% N2/Ar mixed gas atmosphere. The pulsed DC bias voltage of -50V on substrates was applied with a frequency of 350 kHz, and duty ratio of 40%(1.1 ㎲). The effects of pulsed DC substrate bias voltage on the crystallinity, color, electrical properties of TiNx films have been investigated using XRD, SEM, XPS and measurement of the electrical properties such as electrical conductivity, carrier concentration, mobility. The deposition rates of TiNx films was decreased with application of the pulsed DC substrate bias voltage. The TiNx films deposited without and with pulsed bias of -50V to substrate exhibits gray and gold colors, respectively. XPS depth profiling revealed that the introduction of the substrate bias voltage resulted in decreasing oxygen concentration in TiNx films, and increasing the electrical conductivities, carrier concentration, and mobility to about 10 times, 5 times, and 2 times degree, respectively.

Preparation and characterization of AiN Thin Films by RF sputtering method (고주파 때려내기법에 의한 질화알루미늄 박막의 제작과 특성)

  • 정성훈;김영호;문동찬;김선태
    • Electrical & Electronic Materials
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    • v.10 no.7
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    • pp.706-712
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    • 1997
  • AlN(Aluminium Nitride) thin films were prepared using by RF sputtering method on the Si(100) and Si(111) substrates as the parameters of the substrate temperature, RF power, sputtering duration and the $N_2$/Ar ratio and investigated by X-ray diffraction, IR spectrometry, n&k analyzer. For the Si(100) substrate, the AlN thin films of (101) orientation were obtained under the conditions of room temperature and the nitrogen of 60 vol.%. For the Si(111) substrate, the (002) AlN thin films were obtained under the nitrogen of 100 vol.%. In case of the thin film prepared in the condition of above 60 vol.% of the nitrogen, the average value of the surface roughness of the film was 151$\AA$. From the changes of the half widths of E$_1$[TO] phonon bands at the wavenumber of 680$cm^{-1}$ /, it were compared of the crystallinities of the films which were grown under the different conditions. The thicknesses of AlN films were decreased dramatically in the region of the nitrogen of 40~60 vol.%. Its due to the nitridation of the Al target surface and getting low of the sputtering yield by the $N_2$/Ar ratio being increased.

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Study on the Optimization of HSS STI-CMP Process (HSS STI-CMP 공정의 최적화에 관한 연구)

  • Jeong, So-Young;Seo, Yong-Jin;Park, Sung-Woo;Kim, Chul-Bok;Kim, Sang-Yong;Lee, Woo-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.149-153
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    • 2003
  • Chemical mechanical polishing (CMP) technology for global planarization of multi-level inter-connection structure has been widely studied for the next generation devices. CMP process has been paid attention to planarized pre-metal dielectric (PMD), inter-layer dielectric (ILD) interconnections. Expecially, shallow trench isolation (STI) used to CMP process on essential. Recently, the direct STI-CMP process without the conventional complex reverse moat etch process has established by using slurry additive with the high selectivity between $SiO_2$ and $Si_3N_4$ films for the purpose of process simplification and n-situ end point detection(EPD). However, STI-CMP process has various defects such as nitride residue, tom oxide and damage of silicon active region. To solve these problems, in this paper, we studied the planarization characteristics using a high selectivity slurry(HSS). As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of HSS STI-CMP process.

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Thin film transistor with pulsed laser deposited ZnO active channel layer (펄스 레이저 증착법으로 제작한 ZnO를 채널층으로 한 박막트랜지스터)

  • Shin, P.K.;Kim, C.J.;Song, J.H.;Kim, S.J.;Kim, J.T.;Cho, J.S.;Lee, B.S.;Ebihara, Kenji
    • Proceedings of the KIEE Conference
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    • 2005.07c
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    • pp.1884-1886
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    • 2005
  • KrF 펄스 레이저 증착법(pulsed laser deposition: PLD)으로 ZnO 박막을 증착하여 평판 디스플레이 소자 구동용 박막 트랜지스터(thin film transistor) 소자를 제작하였다. 전도성이 높은 실리콘웨이퍼(c-Si, 하부전극) 기판 위에 LPCVD 법으로 silicon nitride 박막을 절연막으로 형성하고, 다양한 공정 조건에서 펄스 레이저 증착법으로 제작한 ZnO 박막을 증착하여 채널층으로 하였으며, Al 박막을 증착하고 패터닝하여 소스 및 드레인 전극으로 하였다. ZnO 박막의 증착 시에 기판 온도를 다양하게 조절하고 산소 분압을 변화시켜 ZnO 박막의 특성을 조절하였다. 제작된 박막의 표면특성은 AFM(atomic force microscopy)로 분석하고, 결정특성은 XRD(X-ray diffraction)로 조사하였다. ZnO 박막의 전기적 특성은 Hall-van der Pauw 법으로 측정하였고, 광학 투과도(optical transparency)를 UV-visible photometer로 조사하였다. ZnO-TFT 소자는 $10^6$ 수준의 on-off ratio와 $2.4{\sim}6.1cm^2/V{\cdot}s$의 전계효과이동도(field effect mobility)를 보였다.

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Removal of Laser Damage in Electrode Formed by Plating in Crystalline Silicon Solar Cells (결정질 실리콘 태양전지에서 도금을 이용한 전극 형성 시 발생되는 레이저 손상 제거)

  • Jeong, Myeong Sang;Kang, Min Gu;Lee, Jeong In;Song, Hee-eun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.6
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    • pp.370-375
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    • 2016
  • In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

Mechanical Properties of High-Hardness TiNX Thin Films Deposited by Pure Nitrogen Plasma Using Magnetron Sputtering Deposition (마그네트론 스퍼터링 증착법을 사용하여 순수한 질소 플라즈마에 의해 성막된 고경도 TiNX 박막의 역학적 특성)

  • Lee, Chang-Hyun;Rhee, Byung-Roh;Bae, Kang;Park, Chang-Hwan;Kim, Hwa-Min
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.8
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    • pp.514-519
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    • 2017
  • TiN (titanium nitride) films were prepared using the RF magnetron sputtering technique. The films were deposited by pure $N_2$ plasma sputtering. Their mechanical properties, such as nano-indentation hardness, friction coefficient, and surface wettability, have been investigated. X-ray diffraction (XRD) studies revealed that the orientation of $TiN_X$ films changed towards the (111) orientation with decreasing working pressure due to a strong compressive stress during deposition. The strongest TiN (111) orientation was found when the film was deposited at a working pressure of 1 Pa. This film showed the largest hardness (16 GPa) and smallest friction coefficient (0.17) among the studied samples. Moreover, this film was found to be accompanied by a water-repellent surface with water contact angle more than $100^{\circ}$.

A Study on the Si-SiO$_2$Interface State Characteristics of Nonvolatile SNOS FET Memories using The Charge Pumping Method (Charge Pumping 방법을 이용한 비휘발성 SNOS FET기억소자의 Si-SiO$_2$계면상태 특성에 관한 연구)

  • 조성두;이상배;문동찬;서광열
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1992.05a
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    • pp.82-85
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    • 1992
  • In this study, charge pumping method was used to investigate the Si-SiO$_2$interface characteristics of the nonvolatile SNOSFET memory devices, fabricated using the CMOS 1 Mbit processes (1.2$\mu\textrm{m}$ design rule), with thin oxide layer of 30${\AA}$ thick and nitride layer of 525${\AA}$ thick on the n-type silicon substrate (p-channel). Charge pumping current characteristics with the pulse base level were measured for various frequencies, falling times and rising times. By means of the charge dynamics in a non-steady state, the average Si-SiO$_2$interface state density and capture cross section were determined to be 3.565${\times}$10$\^$11/cm$\^$-2/eV$\^$-1/ and 4.834${\times}$10$\^$-16/$\textrm{cm}^2$, respectively. However Si-SiO$_2$ interface state densities were disributed 2.8${\times}$10$\^$-11/~5.6${\times}$10$\^$11/cm$\^$-2/~6${\times}$10$\^$11/cm$\^$-2/eV$\^$-1/ in the lover half of energy gap.

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Development of a Coating System for Producing Clean Enriched Rice (청결 영양강화미 제조를 위한 코팅시스템 개발)

  • 정종훈;이양봉;엄천일
    • Journal of Biosystems Engineering
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    • v.29 no.4
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    • pp.307-316
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    • 2004
  • This study was conducted to develop a coating system for producing clean enriched rice. The nutritional components of such as brown rice, white rice, clean white rice, enriched rice of US, black rice of China, and rice with perfume of China, were analyzed and compared. Total protein lipid md minerals in brown rice were higher than those in the other rices. A nutrition premix with lysine, thiamine, niacine, calcium lactate, ferrous lactate, and rice starch was made for enriching white rice. A coating device consisted of a tumbler, two spraying nozzles, a rice mixer, etc was developed with the capacity of 1 ton/h. And far-infrared dryers of batch and continuous types were developed to dry hygienically the wet enriched rice. The percentages of lysine, thiamine, amino acid nitride, and Ca and Fe of the enriched rice samples produced in this study were, respectively, 4, 3, 3. 2, and 10 times higher than those of white rice, respectively.

Development of The Magnetic Abrasive Using Ba-Ferrite and GC, CBN (Ba-Ferrite와 GC, CBN을 이용한 자기 연마재 개발)

  • Kim, Hee-Nam;Yun, Yeo-Kwon
    • Journal of the Korean Society of Safety
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    • v.23 no.5
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    • pp.43-48
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    • 2008
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision polishing techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are only few researchers in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using Ba-Ferrite. In this development, abrasive grain GC and CBN has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Ba-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only GC, CBN and Ba-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that GC, CBN abrasive and Ba-Ferrite were strongly bonding with each other.

High-Frequency GaN HEMTs Based Point-of-Load Synchronous Buck Converter with Zero-Voltage Switching

  • Lee, Woongkul;Han, Di;Morris, Casey T.;Sarlioglu, Bulent
    • Journal of Power Electronics
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    • v.17 no.3
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    • pp.601-609
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    • 2017
  • Gallium nitride (GaN) power switching devices are promising candidates for high switching frequency and high efficiency power conversion due to their fast switching, low on-state resistance, and high-temperature operation capability. In order to facilitate the use of these new devices better, it is required to investigate the device characteristics and performance in detail preferably by comparing with various conventional silicon (Si) devices. This paper presents a comprehensive study of GaN high electron mobility transistor (HEMT) based non-isolated point-of-load (POL) synchronous buck converter operating at 2.7 MHz with a high step-down ratio (24 V to 3.3 V). The characteristics and performance of GaN HEMT and three different Si devices are analytically investigated and the optimal operating point for GaN HEMT is discussed. Zero-voltage switching (ZVS) is implemented to minimize switching loss in high switching frequency operation. The prototype circuit and experimental data support the validity of analytical and simulation results.