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http://dx.doi.org/10.4313/JKEM.2017.30.8.514

Mechanical Properties of High-Hardness TiNX Thin Films Deposited by Pure Nitrogen Plasma Using Magnetron Sputtering Deposition  

Lee, Chang-Hyun (Department of Electronic & Electricity Engineering, Daegu Catholic University)
Rhee, Byung-Roh (Department of Applied Physics & Electronics, Sangji University)
Bae, Kang (Mijutech)
Park, Chang-Hwan (Department of Materials & Chemistries Engineering, Daegu Catholic University)
Kim, Hwa-Min (Department of Materials & Chemistries Engineering, Daegu Catholic University)
Publication Information
Journal of the Korean Institute of Electrical and Electronic Material Engineers / v.30, no.8, 2017 , pp. 514-519 More about this Journal
Abstract
TiN (titanium nitride) films were prepared using the RF magnetron sputtering technique. The films were deposited by pure $N_2$ plasma sputtering. Their mechanical properties, such as nano-indentation hardness, friction coefficient, and surface wettability, have been investigated. X-ray diffraction (XRD) studies revealed that the orientation of $TiN_X$ films changed towards the (111) orientation with decreasing working pressure due to a strong compressive stress during deposition. The strongest TiN (111) orientation was found when the film was deposited at a working pressure of 1 Pa. This film showed the largest hardness (16 GPa) and smallest friction coefficient (0.17) among the studied samples. Moreover, this film was found to be accompanied by a water-repellent surface with water contact angle more than $100^{\circ}$.
Keywords
$TiN_X$; RF magnetron sputter; Thin film; Pure $N_2$ plasma; Vacuum;
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1 U. Beck, G. Reiners, U. Kopacz, and H. A. Jehn, Surf. Coat. Technol., 60, 389 (1993). [DOI: https://doi.org/10.1016/0257-8972(93)90119-9]   DOI
2 J. E. Sundgren, Thin Solid Films, 128, 21 (1985). [DOI: https://doi.org/10.1016/0040-6090(85)90333-5]   DOI
3 M. Wittmer and H. Melchior, Thin Solid Films, 93, 397 (1982). [DOI: https://doi.org/10.1016/0040-6090(82)90145-6]   DOI
4 M. Stoiber, J. Wagner, C. Mitterer, K. Gammer, H. Hutter, C. Lugmair, and R. Kullmer, Surf. Coat. Technol., 174, 687 (2003). [DOI: https://doi.org/10.1016/S0257-8972(03)00353-0]
5 F. Vaz, P. Machado, L. Rebouta, P. Cerqueira, Ph. Goudeau, J. P. Riviere, E. Alves, K. Pischow, and J. de Rijk, Surf. Coat. Technol., 174, 375 (2003). [DOI: https://doi.org/10.1016/S0257-8972(03)00711-4]
6 S. J. Bull, D. S Rickerby, and A. Jain, Surf. Coat. Technol., 41, 269 (1990). [DOI: https://doi.org/10.1016/0257-8972(90)90138-3]   DOI
7 M.Stoiber, E. Badisch, C. Lugmair, and C. Mitterer, Surf, Coat, Technol., 163, 451 (2003). [DOI: https://doi.org/10.1016/S0257-8972(02)00642-4]
8 J. Pelleg, L. Z. Zevin, S. Lungo, and N. Croitoru, Thin Solid Films, 197, 117 (1991). [DOI: https://doi.org/10.1016/0040-6090(91)90225-M]   DOI
9 S. Y. Chun, J. Korean Phys. Soc., 52, 1227 (2008).   DOI
10 M. GoTo, A. Kasahara, M. Tosa, J. Hobely, M. Kishimoto, K. Yoshihara, and H. Fukumura, J. Vac. Sci. Technol., A, 20, 1458 (2002). [DOI: http://dx.doi.org/10.1116/1.1487873]   DOI
11 I. Petrov, L. Hultman, U. Helmersson, J. E. Sundgren, and J. E Greene, Thin Solid Films, 169, 299 (1989). [DOI: https://doi.org/10.1016/0040-6090(89)90713-X]   DOI
12 H. Ljungcrantz, L. Hultman, and J. E. Sundgren, and L. Karlsson, J. Appl. Phys., 78, 832 (1995). [DOI: http://dx.doi. org/10.1063/1.360272]   DOI
13 L. Hultman, U. Helmersson, S. A. Barnett, J. E. Sundgren, and J. E. Greene, J. Appl. Phys., 61, 552 (1987). [DOI: http://dx.doi.org/10.1063/1.338257]   DOI