• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.11
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• pp.2444-2450
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• 2011

In this paper, we propose the low fractional spur phase-locked loop(PLL) with multiple phase-frequency detector(PFD). The fractional spurs are suppressed by using a new PFD. The new PFD architecture with two different edge detection methods is used to suppress the fractional spur by limiting a maximum width of the output signals of PFD. The proposed PLL was simulated by HSPICE using a 0.35m CMOS parameters. The simulation results show that the proposed PLL is able to suppress fractional spurs with fast locking.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.6 s.360
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• pp.89-93
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• 2007

This paper presents the design and the implementation of input/output (I/O) interface circuits for 2.5 Gbps operation in a 3.3V 0.35um CMOS technology. Due to the differential transmission technique and low voltage swing, LVDS(low-voltage differential signaling) has been widely used for high speed transmission with low power consumption. This interface circuit is fully compatible with the LVDS standard. The LVDS proposed in this paper utilizes a telescopic amplifier. This circuit is operated up to 2.3 Gbps. The circuit has a power consumption of 25. 5mW. This circuit is designed with Samsung $0.35{\mu}m$ CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.5 s.335
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• pp.47-54
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• 2005

In this paper, novel test patterns and on-chip data are presented to indicate that the variation of coupling capacitance, ${\Delta}Cc$ by crosstalk can be larger than static coupling capacitance, Cc. It is also shown that ${\Delta}Cc$ is strongly dependent on the phase of aggressive lines. for anti-phase crosstalk ${\Delta}Cc$ is always larger than Cc while for in-phase crosstalk ${\Delta}Cc$ is smaller than Cc. HSPICE simulation shows good agreement with the measurement data.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.11
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• pp.41-48
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• 2005

The crosstalk effects that can be observed in the very dee submicron semiconductor chips are due to the coupling capacitances between interconnect lines. The accuracy of the full-chip timing analysis is determined by the accuracy of the estimated propagation delays of cells and interconnects within the chip. This paper presents a CMOS cell driver model and delay calculation algerian capturing the crosstalk effects due to the coupling capacitances. The proposed model and algorithm were implemented in a delay calculation program and used to estimate the propagation delays of the benchmark circuits extracted from a chip layout. We observed that the average discrepancy from HSPICE simulation results is within $1\%$ for the circuits with a victim affected by $0\~10$ aggressors.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.12
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• pp.75-84
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• 2001

Due to the high density of integration in current integrated circuit layouts, circuit elements must be designed to minimize the effect of parasitic elements and thereby minimize the factors which can degrade circuit performance. Thus, before making a chip, circuit designers should check whether the extracted netlist is correct, and verify from a simulation whether the circuit performance satisfies the design specifications. In this paper, we propose a new block disassembly technique which can extract the geometric parameters of stacked MOSFETs and the distributed RCs of layout blocks. After applying this to the layout of a folded-cascode CMOS operational amplifier, we verified the connectivity and the effect of the components by simulating the extracted netlist with HSPICE.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.1
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• pp.71-80
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• 2004

A new SSN(Simultaneous Switching Noise) model is presented, which can afford to investigate SSN due to integrated circuit package. It is shown that previous SSN models are not accurate enough to be practical since they do not take decoupling capacitor into account. In this paper, a new SSN model including the decoupling capacitor is developed. It is verified that the model has excellent agreement(within $5\%$ error) with HSPICE simulation which employs TSMC 0.18um CMOS process technology.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.2
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• pp.77-83
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• 2004

Cross-talk noise which can occur between on-chip interconnects is significant factor which influence signal integrity. Therefore, this paper presents an analytical method for estimating maximum cross-talk noise. We consider inductance effect of interconnects and use arbitary ramp inputs to estimate noise magnitude exactly. Also, we have used a virtual source for the easy of analytically caculating maximum cross-talk noise from complex cross-talk noise model. The accuracy of the has been shown that be within 4.3 percent maximum relative error compared with the results of HSPICE simulation. Hence, this study can be utilized in various CAD tools for guaranteeing signal integrity.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.8
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• pp.47-52
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• 2010

In this paper, a phase-locked loop with a self-noise suppressing voltage controlled oscillator to improve a phase noise characteristic has been proposed. The magnitude of the proposed transfer function is maximum 25dB lower than that of a conventional transfer function around a bandwidth. The proposed PLL has been designed based on a 1.8V $0.18{\mu}m$ CMOS process and proved by HSPICE simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.6
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• pp.51-56
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• 2010

In this paper, a novel Integer-N phase-delay locked loop(P DLL) architecture has been proposed using a voltage controlled delay line(VCDL). The P DLL can have the LF of one small capacitance instead of the conventional second or third-order LF. The size of chip is $255{\mu}m$ $\times$ $935.5{\mu}m$ including the LF. The proposed P DLL has been designed based on a 1.8V $0.18{\mu}m$ CMOS process and proved by HSPICE simulation.

• Journal of IKEEE
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• v.12 no.4
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• pp.211-216
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• 2008

This paper proposes an 8${\times}$8 bit parallel multiplier using MOS current-mode logic (MCML) circuit for low power consumption. The proposed circuit has a structure of low-power MOS current-mode logic circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to PMOS transistor to minimize the leakage current. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/50. The designed multiplier is achieved to reduce the power consumption by 10.5% and the power-delay-product by 11.6% compared with the conventional MOS current-model logic circuit. This circuit is designed with Samsung 0.35 ${\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation.