• JSTS:Journal of Semiconductor Technology and Science
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• 제10권2호
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• pp.143-151
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• 2010

In this work, we propose a single electron memory 'SEM' design which consist of two key blocs: A memory bloc, with a voltage source $V_{Mem}$, a pure capacitor connected to a tunnel junction through a metallic memory node coupled to the second bloc which is a Single Electron Transistor "SET" through a coupling capacitance. The "SET" detects the potential variation of the memory node by the injection of electrons one by one in which the drainsource current is presented during the memory charge and discharge phases. We verify the design of the SET/SEM cell by the SIMON tool. Finally, we have developed a MAPLE code to predict the retention time and nonvolatility of various SEM structures with a wide operating temperature range.

• Transactions on Electrical and Electronic Materials
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• 제15권1호
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• pp.37-40
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• 2014

A novel memory is reported, in which $Ge_2Sb_2Te_5$ (GST) has been used as a floating gate. The threshold voltage was shifted due to the phase transition of the GST layer, and the hysteretic behavior is opposite to that arising from charge trapping. Finite Element Modeling (FEM) was adapted, and a new simulation program was developed using c-interpreter, in order to analyze the small shift of threshold voltage. The results show that GST undergoes a partial phase transformation during the process of RESET or SET operation. A large $V_{TH}$ shift was observed when the thickness of the GST layer was scaled down from 50 nm to 25 nm. The novel 1 transistor PCM (1TPCM) can achieve a faster write time, maintaining a smaller cell size.

• JSTS:Journal of Semiconductor Technology and Science
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• 제6권1호
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• pp.22-29
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• 2006

We demonstrate highly manufacturable Multi-channel Field Effect Transistor (McFET) on bulk Si wafer. McFET shows excellent transistor characteristics, such as $5{\sim}6 times higher drive current than planar MOSFET, ideal subthreshold swing, low drain induced barrier lowering (DIBL) without pocket implantation and negligible body bias dependency, maintaining the same source/drain resistance as that of a planar transistor due to the unique feature of McFET. And suitable threshold voltage ($V_T$) for SRAM operation and high static noise margin (SNM) are achieved by using TiN metal gate electrode.

• 한국전자파학회논문지
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• 제16권5호
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• pp.482-487
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• 2005

본 연구에서는 distributed amplifer를 구성하는 cascode 단위이득단의 공통게이트의 게이트 단자에 가변 커패시터를 연결함으로써 출력 저항 값을 조절하는 방법을 제안한다. Cascode 이득단은 공통 소스 이득단에 비해 높은 이득, 높은 출력저항, 부성저항을 제공하는 등 여러 장점이 있지만 설계시 사용한 트랜지스터 모델이 부정확하고 공정변수가 달라진다면 이득이 떨어지기 시작하는 band edge에서 발진할 위험이 있다. 그러므로 회로가 제작된 이후에도 발진을 막을 수 있는 조절회로가 필요하게 되는데, cascode단위 이득단의 공통 게이트 단자에 연결된 가변 커패시터가 그 역할을 할 수 있다. 제작한 distributed amplifier를 측정해본 결과 가변 커패시터를 조절함으로써 이득 특성을 변화시킬 수 있었으며, 이는 회로의 안정도를 보장할 수 있음을 알 수 있었다. 49GHz의 밴드폭내에서 이득은 $8.92\pm0.82 dB$이며, 군지연은 41GHz 이내에서 $\pm9.3 psec$ 범위 이내였다. 사용된 모든 transistor는 GaAs 기반의 $0.15{\mu}m$ 게이트 길이를 가지 는 p-HEMT이며, distributed amplifier는 총 4개의 이득단으로 구성되어 있다.

• 한국전기전자재료학회논문지
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• 제33권2호
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• pp.105-108
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• 2020

In this study, experiments and simulations were conducted for a 1,200-V-class trench Si insulated-gate bipolar transistor (IGBT) with a small cell pitch below 2.5 ㎛. Presently, as a power device, the 1,200-V-class trench Si IGBT is used for automotives including electric vehicles, hybrid electric vehicles, and industrial motors. We obtained a breakdown voltage of 1,440 V, threshold of 6 V, and state voltage drop of 1.75 V. This device is superior to conventional IGBTs featuring a planar gate. To derive its electrical characteristics, we extracted design and process parameters. The cell pitch was 0.95 ㎛ and total wafer thickness was 140 ㎛ with a resistivity of 60 Ω·cm. We will apply these results to achieve fine-pitch gate power devices suitable for electrical automotive industries.

• 한국정보통신학회논문지
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• 제13권12호
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• pp.2633-2640
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• 2009

본 논문에서는 터치스크린 컨트롤러용 IC를 위한 저면적, 저전력, 고속 EEPROM 회로 설계기술을 제안하였다. 저면적 EEPROM 기술로는 SSTC (Side-wall Selective Transistor Cell) 셀을 제안하였고 EEPROM 코어회로에서 반복되는고전압 스위칭 회로를 최적화하였다. 저전력 기술은 디지털 Data Bus 감지 증폭기 회로를 제안하였다. 그리고 고속 EEPROM 기술로는 Distributed DB 방식이 적용되었으며, Dual Power Supply를 사용하여 EEPROM 셀과 고전압 스위칭 회로의 구동전압은 로직전압 VDD(=1.8V)보다 높은 전압인 VDDP(=3.3V)를 사용하였다. 설계된 128Kb EEPROMIP(Intellectual Property)의 레이아웃 면적은 $662.31{\mu}m{\times}1314.89{\mu}m$이다.

• Journal of Magnetics
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• 제7권3호
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• pp.101-105
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• 2002

MRAM (Magnetoresistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. This paper is for testing the actual electrical parameters to adopt MRAM technology in the semiconductor based memory device. The discussed topics are an actual integration of MRAM core cell and its properties such as electrical tuning of MOS/MTJ for data sensing and control of magnetic switching for data writing. It will be also tested that limits of the MRAM technology for a high density memory.

• JSTS:Journal of Semiconductor Technology and Science
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• 제2권3호
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• pp.197-204
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• 2002

DRAM, SRAM, and FLASH memory are three major memory devices currently used in most electronic applications. But, they have very distinct attributes, therefore, each memory could be used only for limited applications. MRAM (Magneto-resistive Random Access Memory) is a promising candidate for a universal memory that meets all application needs with non-volatile, fast operational speed, and low power consumption. The simplest architecture of MRAM cell is a series of MTJ (Magnetic Tunnel Junction) as a data storage part and MOS transistor as a data selection part. To be a commercially competitive memory device, scalability is an important factor as well. This paper is testing the actual electrical parameters and the scaling factors to limit MRAM technology in the semiconductor based memory device by an actual integration of MRAM core cell. Electrical tuning of MOS/MTJ, and control of resistance are important factors for data sensing, and control of magnetic switching for data writing.

• 대한전자공학회논문지SD
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• 제47권3호
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• pp.7-17
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• 2010

본 논문은 4-트랜지스터 래치 셀을 이용한 저전력향 신개념의 SRAM을 제안한다. 4-트랜지스터 메모리 셀은 종래의 6-트랜지스터 SRAM 셀에서 access 트랜지스터를 제거한 형태로, PMOS 트랜지스터의 소스는 비트라인 쌍에 연결되고 NMOS 트랜지스터의 소스는 두개의 워드라인에 각각 연결된다. 동작시 워드라인에 일정크기의 전압을 인가할 때 비트라인에 흐르는 전류를 감지하여 읽기동작을 수행하고, 비트라인 쌍에 전압차이를 두고 워드라인에 일정크기의 전압을 인가하여 쓰기동작을 수행한다. 이는 공급전압 보다 낮은 소신호 전압으로 워드라인과 비트라인을 구동하여 메모리 셀의 데이터를 저장하고 읽어낼 수 있어서 동작 소비전력이 적다. 아울러 셀 누셀전류 경로의 감소로 인해 대기 소모전력 또한 개선되는 장점이 있다. 0.18-${\mu}m$ CMOS 공정으로 1.8-V, 16-kbit SRAM test chip을 제작하여 제안한 회로기술을 검증하였고, 칩 면적은 $0.2156\;mm^2$이며 access 속도는 17.5 ns 이다. 동일한 환경에서 구현한 종래의 6-트랜지스터 SRAM과 비교하여 읽기동작시 30% 쓰기동작시 42% 동작소비전력이 적고, 대기전력 또한 64% 적게 소비함을 관찰하였다.

• ETRI Journal
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• 제26권6호
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• pp.583-588
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• 2004

In this paper we investigate the effect of a shield metal line inserted between adjacent bit lines on the refresh time and noise margin in a planar DRAM cell. The DRAM cell consists of an access transistor, which is biased to 2.5V during operation, and an NMOS capacitor having the capacitance of 10fF per unit cell and a cell size of $3.63{\mu}m^2$. We designed a 1Mb DRAM with an open bit-line structure. It appears that the refresh time is increased from 4.5 ms to 12 ms when the shield metal line is inserted. Also, it appears that no failure occurs when $V_{cc}$ is increased from 2.2 V to 3 V during a bump up test, while it fails at 2.8 V without a shield metal line. Raphael simulation reveals that the coupling noise between adjacent bit lines is reduced to 1/24 when a shield metal line is inserted, while total capacitance per bit line is increased only by 10%.