1 |
S. Hudgens and B. Johnson, MRS, 29 (2004).
|
2 |
S. H. Lee, M. K. Kim, B. K. Cheong, J. Y. Kim, J. W. Lee, and S. Tiwari, IEICE Trans. on Electronics, 94-C, 676 (2011) [DOI: http://dx.doi.org/10.1587/transele.E94.C.676].
|
3 |
F. P. Incropera and D. P. Dewitt, Fundamentals of Heat and Mass Transfer, 4th ed. (John Wiley & Sons, New York, 1996)
|
4 |
R. Warren, K. Goodson et el, "Compact Thermal Model of Phase Memory Nanodevices" (ITHERM 2008. 11th Intersociety Conf., 2008) p. 1018.
|
5 |
International Technology Roadmap for Semiconductors (ITRS), 2009. Available [http://public.itrs/net].
|
6 |
H.S.P. Wong, S. Raoux, S. Kim, J. Liang, J. P. Reifenberg, B. Rajendran, M. Asheghi, and K. E. Goodson, Proc. of the IEEE, 98, 2201 (2010).
DOI
|
7 |
M. K. Kim, S. D. Chae, H. S. Chae, J. H. Kim, Y. S. Jeong, J. W. Lee, H. Silva, C. W. Kim, and S. Tiwari, IEEE Trans. on Nanotechnology, 417 (2004).
|