Highly Manufacturable 65nm McFET (Multi-channel Field Effect Transistor) SRAM Cell with Extremely High Performance

  • Kim, Sung-Min (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Yoon, Eun-Jung (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Kim, Min-Sang (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Li, Ming (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Oh, Chang-Woo (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Lee, Sung-Young (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Yeo, Kyoung-Hwan (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Kim, Sung-Hwan (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Choe, Dong-Uk (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Suk, Sung-Dae (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Kim, Dong-Won (Device Research Team, R&D Center, Samsung Electronics Co.) ;
  • Park, Dong-Gun (Device Research Team, R&D Center, Samsung Electronics Co.)
  • Published : 2006.03.31

Abstract

We demonstrate highly manufacturable Multi-channel Field Effect Transistor (McFET) on bulk Si wafer. McFET shows excellent transistor characteristics, such as $5{\sim}6 times higher drive current than planar MOSFET, ideal subthreshold swing, low drain induced barrier lowering (DIBL) without pocket implantation and negligible body bias dependency, maintaining the same source/drain resistance as that of a planar transistor due to the unique feature of McFET. And suitable threshold voltage ($V_T$) for SRAM operation and high static noise margin (SNM) are achieved by using TiN metal gate electrode.

Keywords

References

  1. T. Park, S. Choi, D. H. Lee, J. R. Yoo, B. C. Lee, J. Y. Kim, C. G. Lee, K. K. Chi, S. H. Hong, S. J. Hyun, Y. G. Shin, J. N. Han, I. S. Park, U I. Chung, J. T. Moon, E. Yoon, and J. H. Lee., 'Fabrication of body-tied FinFETs (Omega MOSFETs) using bulk Si wafers.' Technical Digest of VLSI, pp.135-136, 2003
  2. I. Cho; T. Park; S. Choi; J.D. Lee, J.H. Lee., 'Body-Tied Double-Gate SONOS Flash (Omega Flash) Memory built on Bulk Si.' Technical Digest of DRC, pp.133-134, 2003
  3. F. Yang, H. Chen, F. Chen, C. Huang, C. Chang, H. Chiu, C. Lee, C. Chen, H. Huang, C. Chen, H. Tao, Y. Yeo, M. Liang, and C. Hu., '25 nm CMOS Omega FETs.' Technical Digest of IEDM., pp. 255-258 , 2002 https://doi.org/10.1109/IEDM.2002.1175826
  4. E. Yoon, S. Lee, S. Kim, M. Kim, S. H. Kim, L. Ming, S. Suk, K. Yeo, C. W. Oh, J. Choe, D. Choi, D. Kim, D. Park, K. Kim, and B. Ryu., 'Sub 30 nm multi-bridge-channel MOSFET(MBCFET) with metal gate electrode for ultra high performance application' Technical Digest of IEDM., pp.627-630., 2004 https://doi.org/10.1109/IEDM.2004.1419244
  5. D. Ha, H. Takeuchi, Y. Choi, T. King, W. P. Bai, D. Kwong, A. Agarwal, and M. Ameen., 'Molybdenum-gate HfO2 CMOS finFET technology,' Technical Digest of IEDM., pp.643-646, 2004 https://doi.org/10.1109/IEDM.2004.1419248
  6. C. Cabral, Jr., J. Kedzierski, B. Linder, S. Zafar, V. Narayanan, S. Fang, A. Steegen, P. Kozlowski, R. Carruthers , and R. Jammy., 'Dual workfunction fully silicided metal gates.', Technical Digest of VLSI, pp184-185, 2004 https://doi.org/10.1109/VLSIT.2004.1345469
  7. S. M. Kim, E. J. Yoon, H. J. Jo, M. Li, C. W. Oh, S. Y. Lee, K. H. Yeo, M. S. Kim, S. H. Kim, D. U. Choe, J. D. Choe, S. D. Suk, D. Kim, D. Park, K. Kim, and B. Ryu., 'A novel multi-channel field effect transistor(McFET) on bulk Si for high performance sub-80nm application', Technical Digest of IEDM., pp639-642, 2004 https://doi.org/10.1109/IEDM.2004.1419247
  8. S. M. Kim, E. J. Yoon, H. J. Jo, M. Li, C. W. Oh, S. Y. Lee, K. H. Yeo, M. S. Kim, S. H. Kim, D. U. Choe, J. D. Choe, S. D. Suk, D. Kim, D. Park, K. Kim, and B. Ryu., 'Fully working high performance Multi-channe Field Effect Transistor (McFET) SRAM cell on bulk Si substrate using TiN single metal gate.' Technical Digest of VLSI, pp.196-197, 2005 https://doi.org/10.1109/.2005.1469265