• 제목/요약/키워드: bipolar transistor

검색결과 332건 처리시간 0.028초

고속 Bipolar 소자를 이용한 comparator 설계 (Comparator design using high speed Bipolar device)

  • 박진우;조정호;구용서;안철
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2004년도 하계종합학술대회 논문집(2)
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    • pp.351-354
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    • 2004
  • This thesis presents Bipolar transistor with SAVEN(Self-Aligned VErtical Nitride) structure as a high-speed device which is essential for high-speed system such as optical storage system or mobile communication system, and proposes 0.8${\mu}m$ BiCMOS Process which integrates LDD nMOS, LDD pMOS and SAVEN bipolar transistor into one-chip. The SPICE parameters of LDD nMOS, LDD pMOS and SAVEN Bipolar transistor are extracted, and comparator operating at 500MHz sampling frequency is designed with them. The small Parasitic capacitances of SAVEN bipolar transistor have a direct effect on decreasing recovery time and regeneration time, which is helpful to improve the speed of the comparator. Therefore the SAVEN bipolar transistor with high cutoff frequency is expected to be used in high-speed system.

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복합 BiCMOS 트랜지스터의 회로 분석 및 그로 구성된 차동 증폭기의 설계기법에 관한 연구 (A Study on the Circuit Analysis of Composite BiCMOS Transistor and the Design Methodology of BiCMOS Differential Amplifier)

  • 송민규;김민규;박성진;김원찬
    • 대한전자공학회논문지
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    • 제26권9호
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    • pp.1359-1368
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    • 1989
  • In this paper, the composite BiCMOS transistor which combines a bipolar transistor and a MOS transistor in a cascade type, is analyzed in terms of I-V characteristics and small signal equivalent circuit. As a result, it has a larger driving capability than MOS transistor and a more extended rante of input voltage than bipolar transistor. Next, a BiCMOS differential amplifier as its application example is designed and compared with the CMOS one and the bipolar one. It increases the driving capability of the CMOS differential amp and improves the linear operation region of the bipolar differential amp.

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다양한 펄스 반복률에서의 NPN BJT (Bipolar Junction Transistor)의 파괴 특성에 관한 연구 (A Study on Destruction Characteristics of BJT (Bipolar Junction Transistor) at Different Pulse Repetition Rate)

  • 방정주;허창수;이종원
    • 한국전기전자재료학회논문지
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    • 제27권3호
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    • pp.167-171
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    • 2014
  • This paper examines the destruction behavior of NPN BJT (bipolar junction transistor) by repetition pulse. The injected pulse has a rise time of 1 ns and the maximum peak voltage of 2 kV. Pulse was injected into the base of transistor. Transistor was destroyed, current flows even when the base power is turned off. Cause the destruction of the transistor is damaged by heat. Breakdown voltage of the transistor is 975 V at single pulse, and repetition pulse is 525~575 V. Pulse repetition rate increases, the DT (destruction threshold) is reduced. Pulse Repetition rate is high, level of transistor destruction is more serious.

Impact of Gamma Irradiation Effects on IGBT and Design Parameter Considerations

  • Lho, Young-Hwan
    • ETRI Journal
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    • 제31권5호
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    • pp.604-606
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    • 2009
  • The primary dose effects on an insulated gate bipolar transistor (IGBT) irradiated with a $^{60}Co$ gamma-ray source are found in both of the components of the threshold shifting due to oxide charge trapping in the MOS and the reduction of current gain in the bipolar transistor. In this letter, the IGBT macro-model incorporating irradiation is implemented, and the electrical characteristics are analyzed by SPICE simulation and experiments. In addition, the collector current characteristics as a function of gate emitter voltage, VGE, are compared with the model considering the radiation damage of different doses under positive biases.

80V BICMOS 소자의 공정개발에 관한 연구 (A Study on the 80V BICMOS Device Fabrication Technology)

  • 박치선;차승익;최연익;정원영;박용
    • 전자공학회논문지A
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    • 제28A권10호
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    • pp.821-829
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    • 1991
  • In this paper, a BICMOS technology that has CMOS devices for digital application and bipolar devices for high voltage (80V) analog applications is presented. Basic concept to design BICMOS device is simple process technology without making too many performance trade-offs. The base line process is poly gate p-well CMOS process and three additional masking steps are added to improve bipolar characteristics. The key ingredients of bipolar integration are n+ buried layer process, up/down isolation process and p-well base process. The bipolar base region is formed simultaneously with the region of CMOS p-well area to reduce mask and heat cycle steps. As a result, hFE value of NPN bipolar transistor is 100-150(Ic=1mA). Collector resistance value is 138 ohm in case of bent type collector structure. Breakdown voltage of BVebo, BVcbo and BVceo are 21V, 115V and78V respectively. Threshold voltage is ${\pm}$1.0V for NMOS and PMOS transistor. Breakdown voltage of NMOS and PMOS transistor is obtained 22V and 19V respectively. 41 stage CMOS ring oscillator has 0.8ns delay time.

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턴-오프 시 PT-IGBT의 애노드 전압 강하 모델링 (Modeling of Anode Voltage Drop for PT-IGBT at Turn-off)

  • 류세환;이호길;안형근;한득영
    • 한국전기전자재료학회논문지
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    • 제21권1호
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    • pp.23-28
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    • 2008
  • In this paper, transient characteristics of the Punch Through Insulated Gate Bipolar Transistor (PT-IGBT) have been studied. On the contrary to Non-Punch Through Insulated Gate Bipolar Transistor(NPT-IGBT), it has a buffer layer and reduces switching power loss. It has a simple drive circuit controlled by the gate voltage of the MOSFET and low on-state resistance of the bipolar junction transistor. The transient characteristics of the PT-IGBT have been analyzed analytically. Excess minority carrier and charge distribution in active base region, the rate of anode voltage with time are expressed analytically by adding the influence of buffer layer. The experimental data is obtained from manufacturer. The theoretical predictions of the analysis have been compared with the experimental data obtained from the measurement of a device(600 V, 15 A) and show good agreement.

1000V 급 바이폴라 접합 트랜지스터에 대한 고내압화의 설계 및 제작 (Design and fabrication for high breakdown voltage on 1000V bipolar junction transistor)

  • 허창수;추은상;박종문;김상철
    • 대한전기학회논문지
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    • 제44권4호
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    • pp.490-495
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    • 1995
  • A bipolar junction transistor which exihibits 1000V breakdown voltage is designed and fabricated using FLR (Field Limiting Rings). Three dimensional effects on the breakdown voltage is investigated in the cylindrical coordinate and the simulation results are compared with the results in the rectangular coordinate. Breakdown voltage of the device with 3 FLR is simulated to be 1420V in the cylindrical coordinate while it is 1580V in rectangular coordinate. Bipolar junction transistor has been fabricated using the epitaxial wafer of which resistivity is 86 .OMEGA.cm and thickness is 105 .mu.m. Si$_{3}$N$_{4}$ and glass are employed for the passivation. Breakdown of the fabricated device is measured to be 1442V which shows better greement with the simulation results in cylindrical coordination.

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스너버를 고려한 IGBT의 병렬운전 특성해석 (Analysis for the parallel operation of IGBT considering snubber circuit)

  • 김윤호;윤병도;이장선;이상섭
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1993년도 하계학술대회 논문집 B
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    • pp.777-780
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    • 1993
  • An insulated gate bipolar transistor(IGBT) is a MOS gate turn on/off bipolar transistor which combines the attributes of the MOSFET and bipolar transistor. Because of its limitation of power capability compared to thyristor or GTO, some parallel connection of IGBT has been studied to improve the limitation of current capabillity. In this paper, the switching effects from the unbalance of internal parameters of IGBT and the turn-off snubber characteristics are investigated using SPICE program.

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PT-IGBT의 온도에 따른 과도특성해석 (Transient Analysis of PT-IGBT with Different Temperature)

  • 이호길;류세환;이용국;안형근;한득영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 하계학술대회 논문집
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    • pp.25-28
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    • 2000
  • In this study, Transient Characteristics of the Punch-Through Insulated Gate Bipolar Transistor (PT-IGBT) has been studied. On the contraty to Non-Punch Through Insulated Gate Bipolar Transistor(NPT-IGBT), PT-IGBT has buffer layer It has a simple drive circuit controlled by the gate voltage of the MOSFET and the low on-state resistance of the bipolar junction transistor. In this paper, the transient characteristics with temperature of the PT-IGBT has been analyzed analytically. PT-IGBT is made to reduce switching power loss. Excess Minority carrier distribution inactive base region and base charge, the rate of voltage with time is expressed analytically to include buffer layer.

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