Design and fabrication for high breakdown voltage on 1000V bipolar junction transistor

1000V 급 바이폴라 접합 트랜지스터에 대한 고내압화의 설계 및 제작

  • 허창수 (인하대 공대 전기공학과) ;
  • 추은상 (인하대 대학원 전기공학과) ;
  • 박종문 (한국전기연구소 전기재료연구부) ;
  • 김상철 (한국전기연구소 전기재료연구부)
  • Published : 1995.04.01

Abstract

A bipolar junction transistor which exihibits 1000V breakdown voltage is designed and fabricated using FLR (Field Limiting Rings). Three dimensional effects on the breakdown voltage is investigated in the cylindrical coordinate and the simulation results are compared with the results in the rectangular coordinate. Breakdown voltage of the device with 3 FLR is simulated to be 1420V in the cylindrical coordinate while it is 1580V in rectangular coordinate. Bipolar junction transistor has been fabricated using the epitaxial wafer of which resistivity is 86 .OMEGA.cm and thickness is 105 .mu.m. Si$_{3}$N$_{4}$ and glass are employed for the passivation. Breakdown of the fabricated device is measured to be 1442V which shows better greement with the simulation results in cylindrical coordination.

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