• 제목/요약/키워드: annealing furnace

검색결과 249건 처리시간 0.034초

실리콘 박막에서 이온 질량 도핑에 의해 주입된 인의 전기적 활성화에 관한 연구 (A study on the electrical activation of ion mass doped phosphorous on silicon films)

  • 김진호;주승기;최덕균
    • 전자공학회논문지A
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    • 제32A권1호
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    • pp.179-184
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    • 1995
  • Phosphorous was deped in silicon thin films by Ion Mass Doping and Changes in the electrical resistance with respect tko heat treatments were investigated. SOI(Silicon On Insulator) thin films which contain few grain boundaries prepared by ZMR(Zone Melting Recrystallization) of polysilicon films, polysilicon films which have about 1500 $A^{\rarw}$ of grain size prepared by LPCVD at 625.deg. C, and amorphous silicon thin films prepared by LPCVD at low temperature were used as substrates and thermal behavior of phosphorous after RTA(Rapid Thermal Annealing) and furnace annealing was carefully studied. Amorphous thin films showed about 10$^{6}$ .OMEGA./ㅁbefore any heat treatment, while polycrystalline and SOI films about 10$^{3}$.OMEGA./¤. All these films, however, showed about 10.OMEGA./ㅁafter furnace annealing at 700.deg. C for 3hrs and RTA showed about the same trend. Films with grain boundaries showed a certain range of heat treatment which rendered increase of the electrical resistance upon annealing, which could not be observed in amorphous films and segregation of doped phosphorous by diffusion with annealing was thought to be responsible for this abnormal behavior.

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Application of Modified Rapid Thermal Annealing to Doped Polycrystalline Si Thin Films Towards Low Temperature Si Transistors

  • So, Byung-Soo;Kim, Hyeong-June;Kim, Young-Hwan;Hwang, Jin-Ha
    • 한국재료학회지
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    • 제18권10호
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    • pp.552-556
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    • 2008
  • Modified thermal annealing was applied to the activation of the polycrystalline silicon films doped as p-type through implantation of $B_2H_6$. The statistical design of experiments was successfully employed to investigate the effect of rapid thermal annealing on activation of polycrystalline Si doped as p-type. In this design, the input variables are furnace temperature, power of halogen lamps, and alternating magnetic field. The degree of ion activation was evaluated as a function of processing variables, using Hall effect measurements and Raman spectroscopy. The main effects were estimated to be furnace temperature and RTA power in increasing conductivity, explained by recrystallization of doped ions and change of an amorphous Si into a crystalline Si lattice. The ion activation using rapid thermal annealing is proven to be a highly efficient process in low temperature polycrystalline Si technology.

박막 소자 개발과 보론 확산 시뮬레이터 설계 (Shallow Junction Device Formation and the Design of Boron Diffusion Simulator)

  • 한명석;박성종;김재영
    • 대한공업교육학회지
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    • 제33권1호
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    • pp.249-264
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    • 2008
  • 본 연구에서는 저 에너지 이온 주입과 이중 열처리를 통하여 박막 $p^+-n$ 접합을 형성하였고, 보론 확산 모델을 가지고 새로운 시뮬레이터를 설계하여 이온 주입과 열처리 후의 보론 분포를 재현하였다. $BF_2$ 이온을 가지고 실리콘 기판에 저 에너지 이온 주입을 하였고, 이후 RTA(Rapid Thermal Annealing)와 FA(Furnace Annealing)를 통하여 열처리 과정을 수행하였다. 시뮬레이션을 위한 확산 모델은 점결함의 생성과 재결합, BI 쌍의 생성, 보론의 활성화와 침전 현상 등을 고려하였다. FA+RTA 열처리가 RTA+FA 보다 면저항 측면의 접합 특성에서 우수한 결과를 나타내었고, 시뮬레이터에서도 동일한 결과를 나타내었다. 따라서 본 연구를 통하여 박막접합을 형성할 때 열적 효율성을 고려하면 제안된 확산 시뮬레이터와 FA+RTA 공정 방법의 유용성을 기대할 수 있다.

Improvement of Device Characteristic on Solution-Processed InGaZnO Thin-Film-Transistor (TFTs) using Microwave Irradiation

  • Moon, Sung-Wan;Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제15권2호
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    • pp.249-254
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    • 2015
  • Solution-derived amorphous indium-gallium-zinc oxide (a-IGZO) thin-film-transistor (TFTs) were developed using a microwave irradiation treatment at low process temperature below $300^{\circ}C$. Compared to conventional furnace-annealing, the a-IGZO TFTs annealed by microwave irradiation exhibited better electrical characteristics in terms of field effect mobility, SS, and on/off current ratio, although the annealing temperature of microwave irradiation is much lower than that of furnace annealing. The microwave irradiated TFTs showed a smaller $V_{th}$ shift under the positive gate bias stress (PGBS) and negative gate bias stress (NGBS) tests owing to a lower ratio of oxygen vacancies, surface absorbed oxygen molecules, and reduced interface trapping in a-IGZO. Therefore, microwave irradiation is very promising to low-temperature process.

열처리 방식에 따른 실리콘 산화아연 박막의 물성 분석 (Characterization of Silicon-Zinc-Oxide films by thermal annealing methods)

  • 이상혁;전현식;박진석
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2015년도 제46회 하계학술대회
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    • pp.1151-1152
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    • 2015
  • Silicon zinc oxide (SZO) thin films were deposited via co-sputtering. Two kinds of post-treatment, furnace annealing and hot pressing, were carried out on the deposited SZO films. The effects of the post-treatment on the chemical bond and surface roughness of the deposited SZO films were analyzed as functions of the post-treatment conditions that were used. It was observed from the X-ray photoelectron spectroscopy (XPS) results that the amount of Si-O bonds in the SZO film drastically increased after the low-temperature furnace annealing. The experiment results showed that the hot pressing method would be favorable as it could improve the electrical characteristics of the SZO-TFTs.

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Development Status of Equipment for Mass Production of AMOLED Panels Using 'Super Grain Silicon' Technology

  • Hong, Jong-Won;Na, Heung-Yeol;Chang, Seok-Rak;Lee, Ki-Yong;Kim, Sang-Soo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.1136-1139
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    • 2009
  • Recently, various Ni doping systems and thermal annealing systems have been developed for fabrication of polycrystalline silicon film using SGS (super grain silicon) for medium and largesize AMOLED panels. In this study, we compare the potential of Ni doping systems including ALD (atomic layer deposition), AMD (atmospheric metal deposition), in-line sputter, and crystallization annealing systems including batch type furnace, inline furnace, and RTA (rapid thermal annealing) developed for the SGS method. Additional requirements for those systems to be used for mass production of large AMOLED TVs are suggested based on evaluation results for both poly-Si films and TFT backplanes.

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Hi-CON/H2 BAF와 HNx BAF의 소둔사이클 제어온도에 관한 연구 (A Study on Annealing Cycle Control Temperature of Hi - CON/2 BAF and HNx BAF)

  • 김문경
    • Journal of Advanced Marine Engineering and Technology
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    • 제18권1호
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    • pp.114-122
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    • 1994
  • A cold temperature control system for the BAF(batch annealing furnace) has been established in order to reduce energy consumption to imrpove productivity and stabilize the properties of products. Therefore we confirmed a relation between annealing cycle time and atmospheric gas, changing annealing cycle time according to BAF temperature with time during heating and actual temperature measurements cold spot during soaking. The results of the temperature variation effect on the batch annealing are as follows. 1) Cooling rate is increasing gradually with increasing atmospheric gas flow, but heating rate is hardly increasing without atmospheric gas component. Heating time is reduced to one half with increasing atmospheric gas flow rate and changing of atmospheric gas component from HNx to Ax gas and annealing cycle time is reduce to 2.7 times. 2) With enlarging the difference between furnace temperature and soaking temperature at the HNx BAF, heating time becomes short, but cooling time is indifferent. 3) If temperature difference of 300.deg. C in the temperature change of cold spot according to the annealing cycle control temperature, Hi-CON/H2BAF is interchanging at each other at 26hours, but HNxBAF at 50 hours. 4) Soaking time at batch annealing cycle determination is made a decision by the input coil width, and soaking time for quality homogenization of 1219 mm width coil must be 2.5 hours longer then that of 914mm width coil for the same coil weight at Hi-CON/H2BAF. But, it is necessary to make 2 hours longer at HNxBAF.

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열처리 방법에 따른 이종절연층 실리콘 기판쌍의 직접접합 (Direct Bonding of Heterogeneous Insulator Silicon Pairs using Various Annealing Method)

  • 송오성;이기영
    • 한국전기전자재료학회논문지
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    • 제16권10호
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    • pp.859-864
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    • 2003
  • We prepared SOI(silicon-on-insulator) wafer pairs of Si II SiO$_2$/Si$_3$N$_4$ II Si using wafer direct bonding with an electric furnace annealing(EFA), a fast linear annealing(FLA), and a rapid thermal annealing(RTA), respectively, by varying the annealing temperatures at a given annealing process. We measured the bonding area and the bonding strength with processes. EFA and FLA showed almost identical bonding area and theoretical bonding strength at the elevated temperature. RTA was not bonded at all due to warpage, We report that FLA process was superior to other annealing processes in aspects of surface temperature, annealing time, and bonding strength.

Enhanced Blue Emission in Er3+/Yb33+ Doped Glass-ceramics Containing Ag Nanoparticles and ZnO Nanocrystals

  • Bae, Chang-hyuck;Lim, Ki-Soo
    • Current Optics and Photonics
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    • 제3권2호
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    • pp.135-142
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    • 2019
  • We report the precipitation of ZnO nanocrystals, Ag-clusters, and Ag nanoparticles in Ag/Er/Yb doped borate glasses by furnace annealing and $CO_2$ laser annealing. The XRD analysis revealed the precipitation of ZnO and Ag phases. The absorption spectra, the TEM and energy dispersive spectroscopy (EDS) revealed the incorporation of Er and Yb ions into ZnO nanocrystals formed by a laser technique and showed the surface plasmon band of Ag nanoparticles. The down-converted blue emission intensity of $Er^{3+}$ ions obtained under 365 nm excitation was enhanced by more than a hundred times in the glass treated by furnace annealing, mainly due to the energy transfer from Ag-clusters. Moreover, we discussed the contribution of Ag nanoparticles and defects to emission characteristics in the glasses treated by two annealing techniques. Up-conversion emissions of the $Er^{3+}$ ions under 980 nm excitation were enhanced due to the incorporation of $Er^{3+}$ and $Yb^{3+}$ ions into ZnO nanocrystals after thermal treatments.