Direct Bonding of Heterogeneous Insulator Silicon Pairs using Various Annealing Method |
송오성
(서울시립대학교 신소재공학과)
이기영 (서울시립대학교 신소재공학과) |
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Silicon-on-Insulator wafer bonding-wafer thining technological evaluation
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DOI |
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선형가열기를 이용한 Si <TEX>$SiO_{2}/Si_{3}N_{4}$</TEX>ⅡSi 이종기판쌍의 직접접합
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과학기술학회마을 DOI ScienceOn |
3 |
Smart-cut: a new silicon on insulator material technology based on hydrogen implantation and wafer bonding
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DOI |
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Fabrication of a SOI hall sensor using Si-Wafer direct bonding technology and its characteristics
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과학기술학회마을 |
6 |
Silicon-on-insulator technology : past achievements and future prospects
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7 |
Hystory of SLMOX material
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DOI |
8 |
Continuous on-chip micropumping through a microneedle
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9 |
Bonding of silicon wafers for silicon-on-insulator
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DOI |
10 |
Adhesion and debonding of multilayer thin film structures
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DOI ScienceOn |
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Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS
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DOI ScienceOn |
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Silicon-to-silicon direct bonding method
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DOI |
14 |
Bonding characteristics of directly bonded Si wafer and oxidized Si wafer by using linear annealing method
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과학기술학회마을 |
15 |
Wafer bonding for silicon-on-insulator technolgies
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DOI ScienceOn |
16 |
Field assisted glass-metal sealing
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The crack opening method in silicon wafer bonding. how useful is it?
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DOI ScienceOn |
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유리/실리콘 기판 직접 접합에서의 세정과 열처리 효과
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과학기술학회마을 DOI ScienceOn |