• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.11
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• pp.61-66
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• 2005

This paper describes a 10-bit 210MHz CMOS current-mode Digital-to-Analog Converter (DAC) consisting of 6 bit MSB current cell matrix Sub-DAC, 2 bit mSB unary current source Sub-DAC, and 2 bit LSB binary weighting Sub-DAC for Wireless LAN application. A new deglitch circuit is proposed to control a crossing point of signals and minimize a glitch energy. The proposed 10-bit CMOS current mode DAC was designed by a $0.35{\mu}m$ CMOS double-poly four-metal technology rate of 210MHz, DNL/INL of ${\pm}0.7LSB/{\pm}1.1LSB$, a glitch energy of $76pV{\cdot}sec$, a SNR of 50dB, a SFDR of 53dB at 200MHz sampling clock and power dissipation of 83mW at 3.3V

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.9
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• pp.13-19
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• 1999

This paper describes a design of an 8-bit 100KSPS 1mW CMOS A/D Converter. Using a novel systematic offset cancellation technique, we reduce the systematic offset voltage of operational amplifiers. Further, a new Gain amplifier is proposed. The proposed A/D Converter is fabricated with a $0.6{\mu}m$ single-poly triple-metal n-well CMOS technology. INL and DNL is within ${\pm}1LSB$, and SNR is about 43dB at the sampling frequency of 100KHz. The power consumption is $980{\mu}W$ at +3V power supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.12 s.354
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• pp.65-73
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• 2006

This work presents a 14b 200KS/s $0.87mm^2$ 1.2mW 0.18um CMOS algorithmic A/D converter (ADC) for intelligent sensors control systems, battery-powered system applications simultaneously requiring high resolution, low power, and small area. The proposed algorithmic ADC not using a conventional sample-and-hold amplifier employs efficient switched-bias power-reduction techniques in analog circuits, a clock selective sampling-capacitor switching in the multiplying D/A converter, and ultra low-power on-chip current and voltage references to optimize sampling rate, resolution, power consumption, and chip area. The prototype ADC implemented in a 0.18um 1P6M CMOS process shows a measured DNL and INL of maximum 0.98LSB and 15.72LSB, respectively. The ADC demonstrates a maximum SNDR and SFDR of 54dB and 69dB, respectively, and a power consumption of 1.2mW at 200KS/s and 1.8V. The occupied active die area is $0.87mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.4
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• pp.53-63
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• 2009

This work proposes a 10b 100MS/s 27.2mW $0.8mm^2$ 0.18um CMOS ADC for WLAN such as an IEEE 802.11n standard. The proposed ADC employs a three-stage pipeline architecture and minimizes power consumption and chip area by sharing as many circuits as possible. Two multiplying DACs share a single amplifier without MOS switches connected in series while the shared amplifier does not show a conventional memory effect. All three flash ADCs use only one resistor ladder while the second and third flash ADCs share all pre-amps to further reduce power consumption and chip area. The interpolation circuit employed in the flash ADCs halves the required number of pre-amps and an input-output isolated dynamic latch reduces the increased kickback noise caused by the pre-amp sharing. The prototype ADC implemented in a 0.18um n-well 1P6M CMOS process shows the DNL and INL within 0.83LSB and 1.52LSB at 10b, respectively. The ADC measures an SNDR of 52.1dB and an SFDR of 67.6dB at a sampling rate of 100MS/s. The ADC with an active die area of $0.8mm^2$ consumes 27.2mW at 1.8V and 100MS/s.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.3
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• pp.77-85
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• 2008

This work proposes a 12b 130MS/s 108mW $1.8mm^2$ 0.18um CMOS ADC for high-quality video systems such as TFT-LCD displays and digital TVs requiring simultaneously high resolution, low power, and small size at high speed. The proposed ADC optimizes power consumption and chip area at the target resolution and sampling rate based on a three-step pipeline architecture. The input SHA with gate-bootstrapped sampling switches and a properly controlled trans-conductance ratio of two amplifier stages achieves a high gain and phase margin for 12b input accuracy at the Nyquist frequency. A signal-insensitive 3D-fully symmetric layout reduces a capacitor and device mismatch of two MDACs. The proposed supply- and temperature- insensitive current and voltage references are implemented on chip with a small number of transistors. The prototype ADC in a 0.18um 1P6M CMOS technology demonstrates a measured DNL and INL within 0.69LSB and 2.12LSB, respectively. The ADC shows a maximum SNDR of 53dB and 51dB and a maximum SFDR of 68dB and 66dB at 120MS/s and 130MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 108mW at 130MS/s and 1.8V.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.569-572
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• 2004

This paper presents a 12-Bit 250MHz CMOS current-mode Digital to Analog Converter(DAC) with current scalers and dividers. It consist of 4 MSB current scaler, 4 MLSB current divider, and 4 LSB current divider. The simulation results show a conversion rate of 250MHz, DNL/INL of ${\pm}5LSB/{\pm}7LSB$, die area of $0.55mm^2$ and Power dissipation of 27mW at 3.3V

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.518-521
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• 1998

This paper describes a 3.3V-65MHz 12BIT CMOS current-mode DAC designed with a 8 MSB current matirx stage and a 4 LSB binary weighting stage. The linearity errors caused by a voltage drop of the ground line and a threshold voltage mismatch of transistors have been reduced by the symmetrical routing method with ground line and the tree structure bias circuit, respectively. In order to realize a low glitch energy, a cascode current switch ahs been employed. The simulation results of the designed DAC show a coversion rate of 65MHz, a powr dissipation of 71.7mW, a DNL of .+-.0.2LSB and an INL of .+-.0.8LSB with a single powr supply of 3.3V for a CMOS 0.6.mu.m n-well technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.376-382
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• 2014

In this paper, a 9-bit 1GS/s high precision folding A/D converter with a 45 nm CMOS technology is proposed. In order to improve the asymmetrical boundary condition error of a conventional folding ADC, a novel scheme with an odd number of folding blocks is proposed. Further, a new digital encoding technique is described to implement the odd number of folding technique. The proposed ADC employs a digital error correction circuit to minimize device mismatch and external noise. The chip has been fabricated with 1.1V 45nm Samsung CMOS technology. The effective chip area is $2.99mm^2$ and the power dissipation is about 120 mW. The measured result of SNDR is 45.35 dB, when the input frequency is 150 MHz at the sampling frequency of 1 GHz. The measured INL is within +7 LSB/-3 LSB and DNL is within +1.5 LSB/-1 LSB.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.8
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• pp.10-21
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• 1999

This paper describes a 12bit CMOS current cell matrix D/A converter which shows a conversion rate of 65MHz and a power supply of 3.3V. Designed D/A converter utilizes current cell matrix structure with good monotonicity characteristic and fast settling time, and it is implemented by using the tree structure bias circuit, the symmetrical routing method with ground line and the cascode current switch to reduce the errors of the conventional D/A converter caused by a threshold voltage mismatch of current cells and a voltage drop of the ground line. The designed D/A converter was implemented with a $0.6{\mu}m$ CMOS n-well technology. The measured data shows a settling time of 20ns, a conversion rate of 50 MHz and a power dissipation of 35.6mW with a single power supply of 3.3V. The experimental SNR, DNL, and INL of the D/A converter is measured to be 55dB, ${\pm}0.5LSB$, and ${\pm}2LSB$, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.8
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• pp.61-70
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• 2009

A 10b 30MS/s pipelined ADC operating under 1V power supply is presented. It utilizes a switched-RC based input sampling circuit and a resistive loop to reset the feedback capacitor in the multiplying digital-to-analog converter (MDAC) for the low-voltage operation. Cascaded switched-RC branches are used to achieve accurate grain of the MDAC for the first stage and separate switched-RC circuits are used in the sub-ADC to suppress the switching noise coupling to the MDAC input The measured differential and integral non-linearities of the prototype ADC fabricated in a 0.13${\mu}m$, CMOS process are less than 0.54LSB and 1.75LSB, respectively. The prototype ADC achieves 54.1dB SNDR and 70.4dB SFDR with 1V supply and 30MHz sampling frequency while consuming 17mW power.