• 마이크로전자및패키징학회지
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• 제27권1호
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• pp.45-54
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• 2020

최근 PCB의 소형화, 박형화 및 고밀도화가 크게 요구되면서 MSAP (Modified Semi Additive Process) 기술을 이용한 SLP (Substrate Like PCB) 기술이 큰 주목을 받고 있다. 특히 SLP 기술은 스마트폰의 고용량 배터리 개발과 5G 기술에 꼭 필요한 기술이다. 본 연구에서는 기존의 HDI 기술과 MSAP 기술을 혼합하여 제작한 하이브리드 방식의 SLP의 신뢰성을 실험과 수치해석을 이용하여 분석하였다. 특히 최적의 SLP 설계를 위하여 프리프레그(prepreg)의 물성, 두께, 층수, 마이크로비아(microvia)의 크기 및 misalignment가 마이크로비아의 신뢰성에 미치는 영향을 IST(Interconnect Stress Test) 시험을 이용한 열사이클링 신뢰성 실험과 유한요소 수치해석을 통하여 고찰하였다. SLP 소재인 프리프레그의 열팽창계수가 적을수록 마이크로비아의 신뢰성은 크게 증가하며, 프리프레그의 두께가 얇을수록 신뢰성이 증가된다. 마이크로비아 홀의 크기 및 패드의 크기가 증가하면 응력이 완화되어 신뢰성은 향상된다. 반면 프리프레그의 층수가 증가할수록 마이크로비아의 신뢰성은 감소된다. 또한 misalignment가 크면 신뢰성은 감소하였다. 특히 이들 인자들 중에서 프리프레그의 열팽창계수가 마이크로비아의 신뢰성에 가장 큰 영향을 미친다. 수치 응력해석 결과도 실험 결과와 잘 일치하였으며, 응력이 낮을수록 마이크로비아의 신뢰성은 증가하였다. 본 실험과 수치해석의 결과는 향후 SLP 기판 제작 및 신뢰성 향상을 위한 유용한 설계 가이드라인으로 활용될 것으로 판단된다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 추계학술대회 논문집 전기물성,응용부문
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• pp.57-58
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• 2006

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys and thermal distributions form experiments.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• 한국신뢰성학회지:신뢰성응용연구
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• 제14권3호
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• pp.176-181
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• 2014

In these days, new and renewable energy is getting popular around globe and wind power generator is one of the renewable energy. In this study, we conducted a study on defect detection of composite material blade for wind power generator by applying active infrared thermography and produced a defect test piece by applying composite material used for blade of wind power generator. An infrared thermal camera and 2 kW halogen lamp are used for the purpose of research as equipments. Also, we analyzed temperature characteristic by using infrared thermal camera after checking a heat source on a test piece and found effectiveness of infrared thermography to blade of wind power generator by detecting defects resulting from temperature difference of a test piece, which eventually improve the safety and reliability of the composite material blade.

• 한국세라믹학회지
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• 제35권3호
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• pp.219-230
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• 1998

Various interlayer materials have been tested for active metal(Cusil ABA) brazing of Si3N4/S. S316 joint. In general multilayer joint had higher strength(80-150 MPa) and better reliability than monolayered one. The joint with Cu(0.2)/Mo(0.3)/Cu(0.2mm) interlayer showed the highest bending strength of abou 490 MPa and the joint with Cu(0.2)/Mo(0.3mm) interlayer the best reliability (14.6 Weibull modulus). The stresses distributed in joint materials during 4-point bending test were estimated by CAE von Mises analysis; the estimated stresses were In good agreement with the measured data. In multilayer joint Cu was though to reduce the residual stresses induced by the difference in thermal expansion coefficient between the ceramic Mo and metal It apperared that a Cu/Mo was optimum interlayer material for Si3N4/S. S316 joint with high bending strength (420 MPa) and reliability. In addition the various shapes and types of compound were examined by EPMA in joining interface.

• Journal of Welding and Joining
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• 제20권2호
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 대한전자공학회논문지SD
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• 제44권5호
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• pp.42-49
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• 2007

본 논문에서는 열전도 환경하의 MCM과 진공에서 작동하는 우주전자 장비의 신뢰도 최적화를 위한 부품 배치 연구에 관해 기술하고 있다. 최적배치를 위해 초기 부품 배치 후 FDM을 solver로 이용하여 부품의 접합온도를 계산하였으며 접합온도를 이용하여 전자장치의 신뢰도를 예측한 후 시뮬레이티드 어닐링 방법을 통해 신뢰도 최적배치 결과가 기술되었다. 시뮬레이티드 어닐링 적용 시 흔들기는 부품 치환방식을 이용하였으며 온도 감소계수 및 열 평형 계수의 변화에 따른 시뮬레이션 결과를 기술하였으며 특히 장치의 고장률 최소화 목적함수와 평균 접합온도 최소화 목적함수에 대해 각 적용결과에 대한 비교분석을 통하여 새로운 신뢰도 최적화 접근방법을 제안하였다.

• Nuclear Engineering and Technology
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• 제54권8호
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• pp.2915-2923
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• 2022

There is an increasing interest in passive safety systems to minimize the need for operator intervention or external power sources in nuclear power plants. Because a passive system has a weak driving force, there is greater uncertainty in the performance compared with an active system. In previous studies, several methods have been suggested to evaluate passive system reliability, and many of them estimated the failure probability using thermal-hydraulic analyses and the Monte Carlo method. However, if the functional failure of a passive system is rare, it is difficult to estimate the failure probability using conventional methods owing to their high computational time. In this paper, a procedure for the application of the Chernoff bound to the evaluation of passive system reliability is proposed. A feasibility study of the procedure was conducted on a passive decay heat removal system of a micro modular reactor in its conceptual design phase, and it was demonstrated that the passive system reliability can be evaluated without performing a large number of thermal-hydraulic analyses or Monte Carlo simulations when the system has a small failure probability. Accordingly, the advantages and constraints of applying the Chernoff bound for passive system reliability evaluation are discussed in this paper.

• 공학기술논문지
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• 제6권2호
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• pp.121-124
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• 2013

This paper proposed a new concept of estimating method for LED(light-emitting diode) delamination with high accuracy. Usually, The LED is composed several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in a trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost, moisture be absorbed easily and a thermal resistance be increased attendantly. As a conventional method to estimate a delamination of LEDs, a solution immersing method is usually used in a field of LED manufacturing companies or researching institutes. This method has an advantage of simplicity but it is only shown that the existence of delamination or not. In this paper, we have proposed an estimating method for LEDs delamination using the polishing and the electron microscope. New proposed method has shown the result of confirming delamination without destruction and enabled quantitative analysis for LED delamination.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.1-26
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• 2004

The implementation of Pb-free solder technology is making good progress in electronic industry. Further understanding on fundamental issues on Pb-free solders/processes is required to reduce reliability risk factors of Pb-free solder joints. Several reliability issues including thermal fatigue, impact reliability, IMC growth, spalling, void formation are reviewed for Pb-free solder joints. Several applications of Pb-free technology are discussed, such as Pb-free, CBGA, CuCGA, flip chips, and wafer bumping by IMS.