Browse > Article

A Study on Reliability-driven Device Placement Using Simulated Annealing Algorithm  

Kim, Joo-Nyun (Korea Aerospace Research Institute)
Kim, Bo-Gwan (Chungnam National University)
Publication Information
Journal of the Institute of Electronics Engineers of Korea SD / v.44, no.5, 2007 , pp. 42-49 More about this Journal
Abstract
This paper introduces a study on reliability-driven device placement using simulated annealing algorithm which can be applicable to MCM or electronic systems embedded in a spacecraft running at thermal conduction environment. Reliability of the unit's has been predicted with the devices' junction temperatures calculated from FDM solver and optimized by simulated annealing algorithm. Simulated annealing in this paper adopts swapping devices method as a perturbation. This paper describes and compares the optimization simulation results with respect to two objective functions: minimization of failure rate and minimization of average junction temperature. Annealing temperature variation simulation case and equilibrium coefficient variation simulation case are also presented at the two respective objective functions. This paper proposes a new approach for reliability optimization of MCM and electronic systems considering those simulation results.
Keywords
Reliability Optimization; Simulated Annealing; Junction Temperature; Thermal Analysis; Finite Differential Method;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Milton Oring, Reliability and Failure of Electronic Materials and Devices, Academic Press, 1998
2 Pradeep Lall, 'Tutorial: Temperature As an Input to Microelectronics-Reliability Models,' IEEE Transactions on Reliability, vol. 45, no. 1, pp. 3-9, March 1996   DOI   ScienceOn
3 Frank P. Incroperat and David P. Dewitt, Fundamentals of Heat and Mass Transfer, 4th edition John Wiley&Sons, pp. 211-219, 1996
4 김주년, 김보관, '열전도 환경을 고려한 전장탑재물의 소자 열 해석' 전자공학회논문지 제43권SC편 제5호 pp.60-67, 2006년9월   과학기술학회마을
5 Kirkpatrick, S., Gelatt Jr., C.D., & Vecchi, M. P.. 'Optimization by simulated annealing,' Science, pp. 220, 671. 1983   DOI   ScienceOn
6 Jilla, C., Simulated Annealing, MIT 16.899 Multidisciplinary System Design Optimization Lecture Notes, 2002
7 Ching-Han Tsai and Sung-Mo Kang, 'Macrocell Placement with Temperature Profile Optimization,' Proceedings of the 1999 IEEE ISCAS, vol. 6, pp. 390-394. Jul 1999   DOI
8 Ching-Han Tsai and Sung-Mo Kang, 'Cell-Level Placement for Improving Substrate Thermal Distribution,' IEEE Transactions on CAD of Integrated Circuits and Systems, vol. 19, no. 2, pp. 253-266, Feb. 2000   DOI   ScienceOn
9 Jing Lee, 'Thermal Placement Algorithm Based on Heat Conduction Analogy,' IEEE Transactions on Components and Packaging Technologies, vol. 26, no. 2, pp. 473-483, Jun. 2003.   DOI   ScienceOn
10 Jing Lee, 'General Thermal Force With Experimental Studies,' IEEE Transactions on Component and Packaging Technologies, vol. 29, no. 1, pp20-29, March 2006   DOI
11 MIL-HDBK-217F Reliability Prediction of Electronic Equipment, DoD USA, 1991
12 Michael D. Osterman and Michael G. Pecht, 'Placement for Reliability and Routability of Convectively Cooled PWB's', IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 9, no. 7. pp. 734-744, Jul. 1990   DOI   ScienceOn