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The Improvement of 2nd Level Solder Joint Reliability fur Flip Chip Ball Grid Array  

Kim, Kyung-Seob (Dept. of Electronics, Yeojoo Institute of Technology)
Lee, Suk (Dept. of Mechanical Engineering, Chung-Ang University)
Chang, Eui-Goo (Dept. of Electrical Engineering, Chung-Ang University)
Publication Information
Journal of Welding and Joining / v.20, no.2, 2002 , pp. 90-94 More about this Journal
Abstract
FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.
Keywords
Flip chip; Solder joint; Underfill; Warpage; Finite element analysis;
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