The Improvement of 2nd Level Solder Joint Reliability fur Flip Chip Ball Grid Array |
Kim, Kyung-Seob
(Dept. of Electronics, Yeojoo Institute of Technology)
Lee, Suk (Dept. of Mechanical Engineering, Chung-Ang University) Chang, Eui-Goo (Dept. of Electrical Engineering, Chung-Ang University) |
1 |
Enhancement of Under-fill Encapsulants for Flip-Chip Technology
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2 |
An Investigation into the Fracture of Silicon Die used in Flip Chip Application
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3 |
2nd Level Reliability Investigation of Memory Package using Power Cycling Test
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4 |
Fast-Flow Underfill Encapsulant;flow Rate and Coefficient of Thermal Expansion
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5 |
Fundamentals of Microsystems Packaging
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6 |
The Effects of Underfill on the Reliability of Flip Chip Solder Joints
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DOI |
7 |
Effect of Underfill on BGA Reliability
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