Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2004.09a
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- Pages.1-26
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- 2004
Recent Progress in Pb-free Solders and Soldering Technology: Fundamentals, Reliability Issues and Applications
Abstract
The implementation of Pb-free solder technology is making good progress in electronic industry. Further understanding on fundamental issues on Pb-free solders/processes is required to reduce reliability risk factors of Pb-free solder joints. Several reliability issues including thermal fatigue, impact reliability, IMC growth, spalling, void formation are reviewed for Pb-free solder joints. Several applications of Pb-free technology are discussed, such as Pb-free, CBGA, CuCGA, flip chips, and wafer bumping by IMS.
Keywords