열충격시험을 통한 LED 박리 평가법에 관한 연구

LED Delamination Evaluating Method by Thermal Shock Test

This paper proposed a new concept of estimating method for LED(light-emitting diode) delamination with high accuracy. Usually, The LED is composed several materials which are LED chips, gold wire, phosphor, epoxy resin, adhesive, reflector and lead frame. These different materials are usually delaminated in a trouble conditions which are huge temperature difference, hot and humid or mechanical shocked. When the components are delaminated, a luminance will be lost, moisture be absorbed easily and a thermal resistance be increased attendantly. As a conventional method to estimate a delamination of LEDs, a solution immersing method is usually used in a field of LED manufacturing companies or researching institutes. This method has an advantage of simplicity but it is only shown that the existence of delamination or not. In this paper, we have proposed an estimating method for LEDs delamination using the polishing and the electron microscope. New proposed method has shown the result of confirming delamination without destruction and enabled quantitative analysis for LED delamination.