• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.277-282
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• 2008

A fully integrated inductorless CMOS impulse radio ultra-wideband (IR-UWB) receiver is implemented using $0.18\;{\mu}m$ CMOS technology for 3-5 GHz application. The UWB receiver adopts the non-coherent architecture, which removes the complexity of RF architecture and reduces power consumption. The receiver consists of inductorless differential three stage LNA, envelope detector, variable gain amplifier (VGA), and comparator. The measured sensitivity is -70 dBm in the condition of 5 Mbps and BER of $10^{-3}$. The receiver chip size is only $1.8\;mm\;{\times}\;0.9\;mm$. The consumed current is 15 mA with 1.8 V supply.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.302-308
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• 2011

In this paper, we have proposed a new approach for optical failure analysis which employs a CMOS photon-emitting circuitry, consisting of a flip-flop based on a sense amplifier and a photon-emitting device. This method can be used even with deep-submicron processes where conventional optical failure analyses are difficult to use due to the low sensitivity in the near infrared (NIR) region of the spectrum. The effectiveness of our approach has been proved by the failure analysis of a prototype designed and fabricated in 0.18 ${\mu}m$ CMOS process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.810-817
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• 2014

An on-chip current sensor with fast response time for the peak-current-mode buck regulator is proposed. The initial operating points of the peak current sensor are determined in advance by the valley current level, which is sensed by a valley current sensor. As a result, the proposed current sensor achieves a fast response time of less than 20 ns, and a sensing accuracy of over 90%. Applying the proposed current sensor, the peak-current-mode buck regulator for the mobile application is realized with an operating frequency of 2 MHz, an output voltage of 0.8 V, a maximum load current of 500 mA, and a peak efficiency of over 83%.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.8
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• pp.62-71
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• 1994

A novel semiconductor device is proposed to be used as a processing element for the implementation of pulse-mode neural networks which consists of alternating n' GaAs quantum wells and undoped AlGaAs barriers sandwitched between n' GaAs cathode and P' GaAs anode and in simple circuit in conjunction with a parallel capacitive and resistive load the trigger circuit generates neuron-like pulse train output mimicking the function of axon hillock of biological neuron. It showed the sigmoidal relationship between the frequency of the pulse-train and the applied input DC voltage. In conjunction with MQWIMD the various neural circuits are proposed especially a neural chip monolithically integrated with photodetectors in order to perfrom the pattern recognition.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.1
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• pp.131-137
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• 2014

A 120 GHz voltage controlled oscillator (VCO) with a divider chain including an injection locked frequency divider (ILFD) and six static frequency dividers is demonstrated using 65-nm CMOS technology. The VCO is designed based on the LC cross-coupled push-push structure and operates around 120 GHz. The 60 GHz ILFD at the first stage of the frequency divider chain is based on a similar topology as the core of the VCO to ensure the frequency alignment between the two circuit blocks. The static divider chain is composed of D-flip flops, providing a 64 division ratio. The entire circuit consumes a DC power of 68.5 mW with the chip size of $1385{\times}835{\mu}m^2$.

• ETRI Journal
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• v.44 no.3
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• pp.491-503
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• 2022

Metal-oxide-semiconductor field-effect transistors (MOSFETs) are continuously scaling down in the nanoscale region to improve the functionality of integrated circuits. The scaling down of MOSFET devices causes short-channel effects in the nanoscale region. In nanoscale region, leakage current components are increasing, resulting in substantial power dissipation. Very large-scale integration designers are constantly exploring different effective methods of mitigating the power dissipation. In this study, a transistor-level input-controlled stacking (ICS) approach is proposed for minimizing significant power dissipation. A low-power ICS approach is extensively discussed to verify its importance in low-power applications. Circuit reliability is monitored for process and voltage and temperature variations. The ICS approach is designed and simulated using Cadence's tools and compared with existing low-power and high-speed techniques at a 22-nm technology node. The ICS approach decreases power dissipation by 84.95% at a cost of 5.89 times increase in propagation delay, and improves energy dissipation reliability by 82.54% compared with conventional circuit for a ring oscillator comprising 5-inverters.

• ETRI Journal
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• v.36 no.4
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• pp.635-642
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• 2014

Three-dimensional integrated circuits (3D ICs) implement heterogeneous systems in the same platform by stacking several planar chips vertically with through-silicon via (TSV) technology. 3D ICs have some advantages, including shorter interconnect lengths, higher integration density, and improved performance. Thermal-aware design would enhance the reliability and performance of the interconnects and devices. In this paper, we propose thermal-aware floorplanning with min-cut die partitioning for 3D ICs. The proposed min-cut die partition methodology minimizes the number of connections between partitions based on the min-cut theorem and minimizes the number of TSVs by considering a complementary set from the set of connections between two partitions when assigning the partitions to dies. Also, thermal-aware floorplanning methodology ensures a more even power distribution in the dies and reduces the peak temperature of the chip. The simulation results show that the proposed methodologies reduced the number of TSVs and the peak temperature effectively while also reducing the run-time.

• The Transactions of the Korean Institute of Power Electronics
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• v.27 no.3
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• pp.206-213
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• 2022

This paper presents setting up a laboratory-scale testbed to estimate the aging of power MOSFET devices and integrated power modules by measuring its on-state voltage and current. Based on the aging mechanisms of the component inside the power module (e.g., bond-wire, solder layer, and semiconductor chip), a system to measure the on-state resistance of device-under-test (DUT) is designed and experimented: a full-bridge circuit applies current stress to DUT, and a temperature chamber controls the ambient temperature of DUT during the aging test. The on-state resistance of SiC MOSFET measured by the proposed testbed was increased by 2.5%-3% after 44-hour of the aging test.

• Korean Journal of Optics and Photonics
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• v.14 no.4
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• pp.454-459
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• 2003

We report the first demonstration of 10 Gb/s wavelength conversion in a Mach-Zehnder interferometric wavelength converter monolithically integrated with a loss-coupled DFB probe source. The integrated device is fabricated using a BRS (buried ridge stripe) structure with an undoped InP clad layer on the top of a passive waveguide to reduce high propagation loss. The device exhibited a static extinction ratio of 11 dB. Good performance at 10 Gb/s is obtained with an extinction ratio of 7 dB and a power penalty of 2.8 dB at a 10$^{-9}$ bit error rate.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.4
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• pp.47-56
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• 2000

Because of the junior college students' learning ability stands on a relatively low level, this research is accomplished to inspire students with further desires, considering students' learning ability and desire. The curriculum of junior college is organized with three parts(electronic communication tool, micro processer, integrated circuit design): the electronic communication tool and micro processer is carried out, and the training for the design skill on semiconductor devices will be focused. The main focus is reflected on the worldwide trend on the design engineering of semiconductor devices and considered for the market establishment on design engineers trained by the lab-oriented practice as well as fundamental of semiconductor technology.