• Journal of Electrical Engineering and Technology
• /
• v.8 no.5
• /
• pp.1182-1187
• /
• 2013

Transient radiation is emitted during a nuclear explosion and causes fatal errors as upset and latch-up in CMOS circuits. This paper proposes the transient radiation SPICE models of NMOS, PMOS, and INVERTER based on the transient radiation analysis using TCAD (Technology Computer Aided Design). To make the SPICE model of a CMOS circuit, the photocurrent in the PN junction of NMOS and PMOS was replaced as current source, and a latch-up phenomenon in the inverter was applied using a parasitic thyristor. As an example, the proposed transient radiation SPICE model was applied to a CMOS NAND circuit. The CMOS NAND circuit was simulated by SPICE and TCAD using the 0.18um CMOS process model parameter. The simulated results show that the SPICE results were similar to the TCAD simulation and the test results of commercial CMOS NAND IC. The simulation time was reduced by 120 times compared to the TCAD simulation.

• Journal of Sensor Science and Technology
• /
• v.24 no.5
• /
• pp.353-357
• /
• 2015

A new SPICE-compatible model for a gate/body-tied PMOSFET photodetector (GBT PD) with an overlapping control gate is presented. The proposed SPICE-compatible model of a GBT PD with an overlapping control gate makes it possible to control the photocurrent. Research into GBT PD modeling was proposed previously. However, the analysis and simulation of GBT PDs is not lacking. This SPICE model concurs with the measurement results, and it is simpler than previous models. The general GBT PD model is a hybrid device composed of a MOSFET, a lateral bipolar junction transistor (BJT), and a vertical BJT. Conventional SPICE models are based on complete depletion approximation, which is more applicable to reverse-biased p-n junctions; therefore, they are not appropriate for simulating circuits that are implemented with a GBT PD with an overlapping control gate. The GBT PD with an overlapping control gate can control the sensitivity of the photodetector. The proposed sensor is fabricated using a $0.35{\mu}m$ two-poly, four-metal standard complementary MOS (CMOS) process, and its characteristics are evaluated.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.24 no.12A
• /
• pp.1985-1991
• /
• 1999

In this paper, complete and general two-port lumped Spice-network model is developed for a lossy transmission line. This model is realized as a Spice subcircuit, by means of standard lumped network elements and mathematical functions. It is used as a component in the time-domain simulation of a high-speed data transmission line such as IMI(Inter Module Interface) data path in HANbit ACE 64 ATM switching system. The only required Spice network elements are resistance and frequency-dependent controlled-voltage sources. Such frequency-dependent sources are realized by utilizing the standard Hspice mathematical functions FREQ, DELAY, and POLY.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.142-143
• /
• 2006

Organic thin film transistors(OTFTs) were simulated by a SPICE model adopted in the amorphous TFTs(a-Si:H TFTs). The gate voltage-dependent mobilities were assumed to fit the representative current-voltage characteristics. The optimal fitting procedures were suggested to compare the experimental data with the mathematical expressions used in the amorphous TFTs. Each SPICE parameter explains the gate dependent mobilities in OTFTs which might originate from the influence of the hopping conduction.

• Journal of Sensor Science and Technology
• /
• v.23 no.4
• /
• pp.284-289
• /
• 2014

In this paper, modeling of a gate/body-tied (GBT) PMOSFET photodetector with built-in transfer gate is performed. It can control the photocurrent with a high-sensitivity. The GBT photodetector is a hybrid device consisted of a MOSFET, a lateral BJT, and a vertical BJT. This device allows for amplifying the photocurrent gain by $10^3$ due to the GBT structure. However, the operating parameters of this photodetector, including its photocurrent and transfer characteristics, were not known because modeling has not yet been performed. The sophisticated model of GBT photodetector using a process simulator is not compatible with circuit simulator. For this reason, we have performed SPICE modeling of the photodetector with reduced complexity using Cadence's Spectre program. The proposed modeling has been demonstrated by measuring fabricated chip by using 0.35 im 2-poly 4-metal standard CMOS technology.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.52 no.4
• /
• pp.49-55
• /
• 2015

The inaccuracy of the bias-dependent gate-drain overlap capacitance $C_{gdo}$ simulation in original BSIM4 and BSIM4 macro model using a diode is analyzed in detail. It is found that the accuracy of the macro model is better than of the BSIM4. However, the macro model cannot be used in the linear region. In order to remove the inaccuracy of the conventional models, a new BSIM4 macro model with a physical bias-dependent $C_{gdo}$ equation is proposed and its accuracy is validated in the full bias range.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2021.10a
• /
• pp.634-636
• /
• 2021

In this study, we studied the macro-modeling of an feedback field-effect transistor (FBFET) using SPICE simulation. The previously presented macro-model of the FBFET is consisting of two circuits. one is charge integration circuit, and the other is current generation circuit. The previous current generation circuit has problem that can't predict performance accurately of the circuits, due to implementing only I_DS-V_GS characteristics. To solve this problem, we presents a model that can implement not only I_DS-V_GS characteristics but alos I_DS-V_DS characteristics by adding the diode in the current generation circuit.

• Proceedings of the IEEK Conference
• /
• 1998.10a
• /
• pp.1057-1060
• /
• 1998

Power Dissipation and circuit speed become the most importance parameters in VLSI system maximum power dissipation for VLSI system design. We remodeled CMOS inverter according to the operating region, saturation region or linear regin, and calculate maximum power dissipation point of CMOS inverter. The result of proposed maximum power dissipation model compared with those from SPICE simulation which results that the proposed maximum power dissipation model has the error rate within 10% to SPICE simulation.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2008.10a
• /
• pp.431-434
• /
• 2008

The physical OLED analog behavioral model for SPICE simulation has been described using Verilog-A language. The model is based on the carrier-balance between the hole and electron injected through Schottky barrier at anode and cathode. The accuracy of this model was examined by comparing with the results from device simulation.

• Journal of Information Display
• /
• v.10 no.3
• /
• pp.101-106
• /
• 2009

In this study, a physical OLED analog behavior model for SPICE simulation was described using the Verilog-A language. The model was presented through theoretical equations for the J-V characteristics of OLED derived according to the internalcarrier emission equation based on a diffusion model at the Schottky barrier contact, and the mobility equation based on the Pool-Frenkel model. The accuracy of this model was examined by comparing it with the results of the device simulation that was conducted.