• Proceedings of the KIPE Conference
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• 2017.07a
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• pp.188-189
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• 2017

There has been a growing demand for power semiconductor switches equipped with high-voltage blocking capability of kV range and fast-switching characteristics of ns range in various plasma application. This paper investigates the application of SiC MOSFETs in the particular plasma application which requires the blocking voltage of 4.5kV and the switching transient time of less than 100ns. In order to meet the required blocking voltage, the series connection of multiple SiC MOSFETs is adopted in this paper. Also, snubber capacitors are employed to equalize the voltage sharing among the series connected SiC MOSFETs. The simulation and experimental result successfully verifies the application of SiC MOSFETs and snubber capacitors in the plasma application requiring high-voltage and fast-switching load dynamics.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.389-389
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• 2010

In this paper, an investigation of the benefits of gate oxide for 8" the manufacturing of Trench MOSFETs and its impact on device performance is presented. Layout dimensions of trench power MOSFETs have been continuously reduced in order to decrease the specific on-resistance, maintaining equal vertical dimensions. We discuss experimental results for devices with a pitch size down fabricated with an unconventional gate trench topology and a simplified manufacturing scheme. The fabricated Trench MOSFETs are observed the trench gate oxidation by SEM.

• Journal of Power Electronics
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• v.19 no.4
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• pp.1054-1067
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• 2019

This paper systematically investigates the influence of device parameters spread on the current distribution of paralleled silicon carbide (SiC) MOSFETs. First, a variation coefficient is introduced and used as the evaluating norm for the parameters spread. Then a sample of 30 SiC MOSFET devices from the same batch of a well-known company is selected and tested under the same conditions as those on datasheet. It is found that there is big difference among parameters spread. Furthermore, comprehensive theoretical and simulation analyses are carried out to study the sensitivity of the current imbalance to variations of the device parameters. Based on the concept of the control variable method, the influence of each device parameter on the steady-state and transient current distributions of paralleled SiC MOSFETs are verified separately by experiments. Finally, some screening suggestions of devices or chips before parallel-connection are provided in terms of different applications and different driver configurations.

• Proceedings of the KIPE Conference
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• 2002.07a
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• pp.707-710
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• 2002

A 120kV/70A high voltage switch has been installed at Korea Atomic Energy Research Institute in Taejon to supply power with Korea Superconducting Tokamak Advanced Research (KSTAR) Neutral Beam Injection (NBI) system. NBI system requires fast cutoff of the power supply voltage for protection of the grid when arc detected and fast turn-on the voltage for sustaining the beam current. Therefore the high voltage switch and arc current detection circuit are important part of the NBI power supply and there are much need for high voltage solid state switches in NBI system and a broad area of applications. This switch consisted of 100 series connected MOSFETs and adopted the proposed simple and reliable gate drive circuit without bias supply, Various results taken during the commissioning phase with a 100kW resistive load and NBI source are shown. This paper presents the detailed design of 120kV/70A high voltage MOSFETs switch and simple gate drive circuit. Problems with the high voltage switch and gate driver and solutions are also presented.

• ETRI Journal
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• v.27 no.4
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• pp.439-445
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• 2005

We introduce a strained-SiGe technology adopting different thicknesses of Si cap layers towards low power and high performance CMOS applications. By simply adopting 3 and 7 nm thick Si-cap layers in n-channel and p-channel MOSFETs, respectively, the transconductances and driving currents of both devices were enhanced by 7 to 37% and 6 to 72%. These improvements seemed responsible for the formation of a lightly doped retrograde high-electron-mobility Si surface channel in nMOSFETs and a compressively strained high-hole-mobility $Si_{0.8}Ge_{0.2}$ buried channel in pMOSFETs. In addition, the nMOSFET exhibited greatly reduced subthreshold swing values (that is, reduced standby power consumption), and the pMOSFET revealed greatly suppressed 1/f noise and gate-leakage levels. Unlike the conventional strained-Si CMOS employing a relatively thick (typically > 2 ${\mu}m$) $Si_xGe_{1-x}$ relaxed buffer layer, the strained-SiGe CMOS with a very thin (20 nm) $Si_{0.8}Ge_{0.2}$ layer in this study showed a negligible self-heating problem. Consequently, the proposed strained-SiGe CMOS design structure should be a good candidate for low power and high performance digital/analog applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.9 no.2
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• pp.110-116
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• 2009

The prominent advantages of Dual Material Surrounding Gate (DMSG) MOSFETs are higher speed, higher current drive, lower power consumption, enhanced short channel immunity and increased packing density, thus promising new opportunities for scaling and advanced design. In this Paper, we present Transconductance-to-drain current ratio and electric field distribution model for dual material surrounding gate (DMSGTs) MOSFETs. Transconductance-to-drain current ratio is a better criterion to access the performance of a device than the transconductance. This proposed model offers the basic designing guidance for dual material surrounding gate MOSFETs.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1501-1502
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• 2011

In this paper, an investigation of the 8" process for Trench Power MOSFET Application and Trench MOSFETs and its impact on device performance is presented. Layout dimensions of trench power MOSFETs have been continuously reduced in order to decrease the specific on-resistance, maintaining equal vertical dimensions. We discuss experimental results for devices with a pitch size down fabricated with an unconventional gate trench topology and a simplified manufacturing scheme. The fabricated Trench MOSFETs are observed the trench gate oxidation by SEM.

• Proceedings of the KIPE Conference
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• 2003.07a
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• pp.227-230
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• 2003

In this paper, a full bridge edge-resonant zero voltage mode based soft-switching PWM DC-DC power converter with a high frequency center tapped transformer link stage is presented from a practical point of view. The power MOSFETS operating as synchronous rectifier devices are implemented in the rectifier center tapped stage to reduce conduction power losses and also to extend the transformer primary side power MOSFETS ZVS commutation area from the rated to zero-load without a requirement of a magnetizing current. The steady-state operation of this phase-shift PWM controlled power converter is described in comparison with a conventional ZVS phase-shift PWM DC-DC converter using the diodes rectifier. Moreover, the experimental results of the switching power losses analysis are evaluated and discussed in this paper. The practical effectiveness of the ZVS phase-shift PWM DC-DC power converter treated here is actually proved by using 2.5kW-32kHz breadboard circuit. An actual efficiency of this converter is estimated in experiment and is achieved as 97$\%$ at maximum.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.4
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• pp.246-248
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• 2000

Closed-form expressions for the temperature dependent breakdown voltage and the on-resistance of the Si power MOSFETs were derived by employing effective temperature dependent ionization coefficient for electrons and holes. The breakdown voltage increases by 20% and the on-resistance increases 2 times when the temperature increases from 300 K to 423 K. The analytic results normalized to the values at 300 K show good agreement with the experimental data of Motorola within 3.5% and 7% for the breakdown voltage and the on-resistance, respectively.

• Journal of Power Electronics
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• v.15 no.5
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• pp.1190-1199
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• 2015

This paper presents a new resonant converter to achieve the soft switching of power devices. Two full-bridge converters are connected in series to clamp the voltage stress of power switches at V_in/2. Thus, power MOSFETs with a 500V voltage rating can be used for 800V input voltage applications. Two flying capacitors are connected on the AC side of the two full-bridge converters to automatically balance the two split input capacitor voltages in every switching cycle. Two resonant tanks are used in the proposed converter to share the load current and to reduce the current stress of the passive and active components. If the switching frequency is less than the series resonant frequency of the resonant tanks, the power MOSFETs can be turned on under zero voltage switching, and the rectifier diodes can be turned off under zero current switching. The switching losses on the power MOSFETs are reduced and the reverse recovery loss is improved. Experiments with a 1.5kW prototype are provided to demonstrate the performance of the proposed converter.