• The Transactions of the Korean Institute of Electrical Engineers C
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• v.53 no.10
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• pp.510-514
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• 2004

In this paper, we analytically examine the voltage transfer function dependent on input conditions for an N-Input NAND Gate. The logic threshold voltage, defined as a voltage at which the input and the output voltage become equal, changes as the input condition changes for a static NAND Gate. The logic threshold voltage has the highest value when all the N-inputs undergo transitions and it has the lowest value when only the last input connected to the last NMOS to ground, makes a transition. This logic threshold voltage difference increases as the number of inputs increases. Therefore, in order to provide a near symmetric voltage transfer function, a multistage N-Input Gate consisting of 2-Input Logic Gates is desirable over a conventional N-Input Gate.

• The KIPS Transactions:PartA
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• v.17A no.3
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• pp.121-126
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• 2010

This paper proposes a low-power MOS current-mode logic circuit with the low voltage swing technology and the high-threshold sleep-transistor. The sleep-transistor is used to high-threshold voltage PMOS transistor to minimize the leakage current. The $16{\times}16$ bit parallel multiplier is designed by the proposed circuit structure. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/104. The proposed circuit is achieved to reduce the power consumption by 11.7% and the power-delay-product by 15.1% compared with the conventional MOS current-model logic circuit in the normal mode. This circuit is designed with Samsung $0.18\;{\mu}m$ standard CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.535-538
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• 2005

We report the influence of the threshold voltage and mobility fluctuation in TFT on current mode digital circuit performance. We found that the threshold voltage showed more serious circuit malfunction. We studied new circuit configuration for improvement.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.250-252
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• 2017

High-performance full swing logic inverters were fabricated using amorphous 1 wt% Si doped indium-zinc-oxide (a-SIZO) thin films with different channel layer thicknesses. In the inverter configuration, the threshold voltage was adjusted by varying the thickness of the channel layer. The depletion mode (D-mode) device used a TFT with a channel layer thickness of 60 nm as it exhibited the most negative threshold voltage (-1.67 V). Inverters using enhancement mode (E-mode) devices were fabricated using TFTs with channel layer thicknesses of 20 or 40 nm with excellent subthreshold slope (S.S). Both the inverters exhibited high voltage gain values of 30.74 and 28.56, respectively at $V_{DD}=15V$. It was confirmed that the voltage gain can be improved by increasing the S.S value.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.10
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• pp.52-62
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• 2003

This paper discusses ternary logic gate, ternary D flip-flop, and ternary four-digit parallel input/output register. The ternary logic gates consist of n-channel pass transistors and neuron MOS(νMOS) threshold inverters on voltage mode. They are designed with a transmission function using threshold inverter that are in turn, designed using Down Literal Circuit(DLC) that has various threshold voltages. The νMOS pass transistor is very suitable gate to the multiple-valued logic(MVL) and has the input signal of the multi-level νMOS threshold inverter. The ternary D flip-flop uses the storage element of the ternary data. The ternary four-digit parallel input/output register consists of four ternary D flip-flops which can temporarily store four-digit ternary data. In this paper, these circuits use 3.3V low power supply voltage and 0.35m process parameter, and also represent HSPICE simulation result.

• Journal of Electrical Engineering and Technology
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• v.4 no.3
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• pp.410-417
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• 2009

The objective of this paper is to study the discharge phenomenon for a point-plane air interval using an original fuzzy logic system. Firstly, a physical model based on streamer theory with consideration of the space charge fields due to electrons and positive ions is proposed. To test this model we have calculated the breakdown threshold voltage for a point-plane air interval. The same model is used to determine the discharge steps for different configurations as an inference data base. Secondly, using results obtained by the numerical simulation of the previous model, we have introduced the fuzzy logic technique to predict the breakdown threshold voltage of the same configurations used in the numerical model and make estimation on the insulating state of the air interval. From the comparison of obtained results, we can conclude that they are in accordance with the experimental ones obtained for breakdown discharges in different point-plane air gaps collected from the literature. The proposed study using fuzzy logic technique shows a good performance in the analysis of different discharge steps of the air interval.

• The KIPS Transactions:PartA
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• v.15A no.2
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• pp.69-74
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• 2008

This paper proposes a structure of low-power MOS current-mode logic circuit with sleep-transistor to reduce the leakage current. The sleep-transistor is used to high-threshold voltage transistor to minimize the leakage current. The $16\;{\times}\;16$ bit parallel multiplier is designed by the proposed circuit structure. Comparing with the conventional MOS current-model logic circuit, the circuit achieves the reduction of the power consumption in sleep mode by 1/50. This circuit is designed with Samsung $0.35\;{\mu}m$ CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• The KIPS Transactions:PartA
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• v.15A no.5
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• pp.243-248
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• 2008

This paper proposes a low-power carry look-ahead adder using multi-threshold voltage CMOS. The designed adder is compared with conventional CMOS adder. The propagation delay time is reduced by using low-threshold voltage transistor in the critical path. Also, the power consumption is reduced by using high-threshold voltage transistor in the shortest path. The other logic block is implemented with normal-threshold transistor. Comparing with the conventional CMOS circuit, the proposed circuit is achieved to reduce the power consumption by 14.71% and the power-delay-product by 16.11%. This circuit is designed with Samsung $0.35{\mu}m$ CMOS process. The validity and effectiveness are verified through the HSPICE simulation.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.21 no.4
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• pp.1059-1067
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• 1996

A 128/129 dual-modulus prescalar IC is designed for application to frequency synthesizers in high frequency communication systems. The FET logic used in this design is SCFL(Source Coupled FET Logic), employing depletion-mode 1.mu.m gate length GaAs MESFETs with the threshold voltage of -1.5V. This circuit consists of 8 flip-flops, 3 OR gates, 2 NOR gates, a modulus control buffer and I/O buffers, which are integrated with about 440 GaAs MESFETs on dimensions of 1.8mm. For $V_{DD}$ and $V_{SS}$ power supply voltages 5V and -3.3V Commonly used in TTL and ECL circuits are determined, respectively. The simulation results taking into account the threshold voltage variation of .+-.0.2V and the power supply variation of .+-.1V demonstrate that the designed prescalar can operate up to 2GHz. This prescalar is fabricated using the ETRI MMIC foundary process and the measured maximum operating frquency is 621MHz.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.994-999
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• 2006

For low-cost embedded EEPROM, in this paper, single polysilicon EEPROM and n-channel high-voltage LDMOST device are developed in a $0.25{\mu}m$ standard CMOS logic process. Using these devices developed, the EEPROM chip is fabricated. The fabricated EEPROM chip is composed of 1 Kbit single polysilicon EEPROM away and high voltage driver circuits. The program and erase characteristics of the fabricated EEPROM chip are evaluated using 'STA-EL421C'. The fabricated n-channel high-voltage LDMOST device operation voltage is over 10 V and threshold voltage window between program and erase states of the memory cell is about 2.0 V.