• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.48 no.1
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• pp.67-74
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• 2016

The demand of environmental friendly packaging materials such as pulp mold has been increased. The application of the oil palm biomass, EFB (Empty Fruit Bunch) fiber as natural raw materials to the pulp mold could increase the usability of the pulp mold by the reduced production cost brought from the relatively low cost of EFB. The effects of the EFB(Empty Fruit Bunch) fibers on the properties of pulp mold and on the process efficiency were evaluated in this study. The pulp mold samples were prepared with mixture ONP (Old news paper) and EFB by using laboratory wet pulp molder. The changes in the drying efficiency were measured with the changes in the solid contents of pulp mold samples during drying process. The efficiency of the surface coating treatment on the pulp mold depending on the condition of the pulp mold samples were also evaluated in order to improve the water resistance properties of pulp mold. The addition of EFB increased the drying efficiency by providing the bulkier structure and the higher water contact angle, which indicated the better water resistance properties. The water resistance were improved by the surface coating treatments and the application of surface coating on the pulp mold at the higher moisture contents resulted in the higher improvement in the water resistance. The bulkier structure originated from the application of EFB fiber reduced the effects of the surface coating, which could be overcome by the control of surface coating process.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.35-39
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• 2018

In order to improve the coupling efficiency, a collimator lens that collects the light emitted from the laser diode at a wide angle to the core of the optical fiber is essential. Glass mold method using a mold is widely used as a collimator lens currently used. Although this method is inexpensive to produce, it is difficult to form precisely and quality problems such as spherical aberration. In this study, the precision of surface processing was improved by replacing the existing glass mold method with the semiconductor process, and the material of the lens was changed to silicon suitable for the semiconductor process. The semiconductor process consists of a photolithography process using PR and a dry etching process using plasma. The optical coupling efficiency was measured using an ultra-precision alignment system for the evaluation of the optical characteristics of the silicon lens. As a result, the optical coupling efficiency was 50% when the lens diameter was $220{\mu}m$, and the optical coupling property was 5% or less with respect to the maximum optical coupling efficiency in the lens diameter range of $210-240{\mu}m$.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.25-29
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• 2015

Demand for a low-cost, high-throughput, and high-resolution patterning method for fabricating devices continues to increase. The roll-to-roll (R2R) imprint lithography technique has received a great deal of attention as a means of fabricating next-generation devices. In this paper, we propose a fabrication method for polymeric planar lightwave circuit (PLC) devices that uses R2R imprint lithography. The proposed technique uses an elastomeric polydimethylsiloxane (PDMS) mold. A Si wafer with micro patterns is used as the Si master. The PDMS mold is then replicated from the Si master. By applying a precise web tension and at a given web speed, we fabricated a micro-patterned PLC device. The insertion losses were 4.0 dB for a $1{\times}2$ optical splitter. As such, the proposed method of fabricating a PLC device by the R2R process was shown to be an effective solution.

• Design & Manufacturing
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• v.1 no.1
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• pp.17-21
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• 2007

In the manufacture and processing of large plastic materials, product quality is tested and verified through several techniques such as injection processing, residual stress through injection molding and shrinkage. With regards to the injection molding process, common problems such as inconsistent density is seen when different points of the product are discovered to have varying thickness levels. Sink marks in product are then evident. This occurs when there is poor molding conditions caused about by poor runner and packaging systems incorporated into the process. We designed the runner system which is possible balanced filling to cavities using CAE program $Moldflow^{TM}$ and then obtained optimal processing conditions by Taguchi's Robust Design technique.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1383-1388
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• 2015

Proportional integral derivative (PID) control is one of the conventional control strategies. Industrial PID control has many options, tools, and parameters for dealing with the wide spectrum of difficulties and opportunities in manufacturing plants. It has a simple control structure that is easy to understand and relatively easy to tune. Injection mold is warming up to the idea of cycling the tool surface temperature during the molding cycle rather than keeping it constant. This “heating and cooling” process has rapidly gained popularity abroad. However, it has discovered that raising the mold wall temperature above the resin’s glass-transition or crystalline melting temperature during the filling stage is followed by rapid cooling and improved product performance in applications from automotive to packaging to optics. In previous studies, optimization methods were mainly selected on the basis of the subjective experience. Appropriate techniques are necessary to optimize the cooling channels for the injection mold. In this study, a digital signal processor (DSP)-based PID control system is applied to injection molding machines. The main aim of this study is to optimize the control of the proposed structure, including a digital PID control method with a DSP chip in the injection molding machine.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.275-280
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• 2005

We propose a new approach to greatly simplify the fabrication of conventional nanoimprint lithography (NIL) by combined nanoimprint and photolithography (CNP). We introduce a hybrid mask mold (HMM) made from UV transparent material with a UV-blocking Cr metal layer placed on top of the mold protrusions. We used a negative tone photo resist (PR) with higher selectivity to substrate the CNP process instead of the UV curable monomer and thermal plastic polymer that has been commonly used in NIL. Self-assembled monolayer (SAM) on HMM plays a reliable role for pattern transfer when the HMM is separated from the transfer layer. Hydrophilic $SiO_2$ thin film was deposited on all parts of the HMM, which improved the formation of SAM. This $SiO_2$ film made a sub-10nm formation without any pattern damage. In the CNP technique with HMM, the 'residual layer' of the PR was chemically removed by the conventional developing process. Thus, it was possible to simplify the process by eliminating the dry etching process, which was essential in the conventional NIL method.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.25-29
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• 2014

In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.59-63
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• 2013

In this paper, the impact of the copper densities of substrate layers on IC package warpage is studied experimentally and numerically. The substrate strips used in this study contained two metal layers, with the metal densities and patterns of these two layers varied to determine their impacts. Eight legs of substrate strips were prepared. Leg 1 to leg 5 were prepared with a HD (high density) type of strip and leg 6 to leg 8 were prepared with UHD (ultra high density) type of strip. The top copper metal layer was designed to feature meshed patterns and the bottom copper layer was designed to feature circular patterns. In order to consider the process factors, the warpage of the substrate bottom was measured step by step with the following manufacturing process: (a) bare substrate, (b) die attach, (c) applying mold compound (d) and post reflow. Furthermore, after the post reflow step, the substrate strips were diced to obtain unit packages and the warpage of the unit packages was measured to check the warpage trends and differences. The experimental results showed that the warpage trend is related to the copper densities. In addition to the experiments, a Finite Element Modeling (FEM) was used to simulate the warpage. The nonlinear material properties of mold compound, die attach, solder mask, and substrate core were included in the simulation. Through experiment and simulation, some observations were concluded.