• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.384.1-384.1
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• 2016

We reported that amorphous silicon (a-Si) thin film provide sample plate exhibiting a multimodality to measure biomolecules by secondary ion mass spectrometry (SIMS) and laser desorption/ionization mass spectrometry (LDI-MS). Kim et al.1 reported that a-Si thin film were suitable to detect small molecules such as drugs and peptides by SIMS and LDI-MS. Recently, bacterial identification has been required in many fields such as food analysis, veterinary science, ecology, agriculture, and so on.2 Mass spectrometry is emerging for identifying and profiling microbiology samples from its advantageous characters of label-free and shot-time analysis. Five species of bacteria - S. aureus, G. glutamicum, B. kurstaki, B. sphaericus, and B. licheniformis - were sampled for MS analysis without lipid extraction in sample preparation steps. The samples were loaded onto the a-Si thin film with a thickness of 100 nm which did not only considered laser-beam penetration but also surface homogeneity. Mass spectra were recorded in both positive and negative ionization modes for more analytical information. High reproducibility and sensitivity of mass spectra were demonstrated in a mass range up to mass-to-charge ratio(m/z) 1200 by applying the a-Si thin film in mentioned above MS. Principle component analysis (PCA) - a popular statistical analysis widely used in data processing was employed to differentiate between five bacterial species. The PCA results verified that each bacterial species were readily distinguished and differentiated effectively from our MS approach. It shows a new opportunity to rapid bacterial profiling and identification in clinical microbiology. More details will be discussed in the presentation.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.35T no.2
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• pp.6-12
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• 1998

Thin film SOI(Silicon-on-insulator) device offer unique advantages such as reduction in short channel effects, improvement of subthreshold slope, higher mobility, latch-up free nature, and so on. But these devices exhibit floating-body effet such as current kink which inhibits the proper device operation. In this paper, the SOI NMOSFET with a T-type gate structure is proposed to solve the above problem. To simulate the proposed device with TSUPREM-4, the part of gate oxide was considered to be 30nm thicker than the normal gate oxide. The I-V characteristics were simulated with 2D MEDICI. Since part of gate oxide has different oxide thickness, the gate electric field strength is not same throughout the gate and hence the impact ionization current is reduced. The current kink effect will be reduced as the impact ionization current drop. The reduction of current kink effect for the proposed device structure were shown using MEDICI by the simulation of impact ionization current, I-V characteristics, and hole current distribution.

• Journal of the Korean Vacuum Society
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• v.16 no.3
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• pp.221-226
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• 2007

DBR (distributed Bragg reflectors) PSi (porous silicon) composite films displaying dual optical properties, both optical reflectivity and photoluminescence had been developed. DBR PSi samples were prepared by electrochemical etch of heavily doped $p^{++}-type$ silicon wafers (boron doped, polished on the <100> face, resistivity of $0.8-1.2m{\Omega}-cm$, Siltronix, Inc.). Free-standing DBR PSi films were treated with PMMA (polymethyl methacrylate) to produce flexible, stable composite materials in which the PSi matrix is covered with PMMA containing photoluminescent polysiloles. Optical characteristics of DBR PSi/polysilole-impregnated PMMA composite materials exhibit both their photonic reflectivity at 565 nm and photoluminescence at 510 nm, simultaneously. A possible application of this materials will be discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.595-601
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• 2009

For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

• Journal of Acupuncture Research
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• v.22 no.6
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• pp.135-140
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• 2005

Objectives : There have been several studies about the quality of acupuncture needle tip recently. We have investigated the condition of the tip of the acupuncture needles in the last studies. In the former studies, we discovered the metallic scuff, lumps and irregularities of the acupuncture needle tips under the microscope. But, no information was available on those foreign materials' identity. Methods : We have selected 200 needles of 1000 pieces from several companies by randomized methods. And we observed the tip of the 6 needles selected finally at ${\times}1000\;or\;{\times}3000$ magnification and analyzed the components of the metallic scuff, lumps and irregularities of the needle tips with a SEM-EDX analyser. Results : We found that the identity of the metallic scuff, lumps and irregularities of the needle tips were metallic materials and silicon. For example, A point was composed of Fe(69.78%), Cr(17.71%), Ni(8.11%), Zn(2.04%), Si(1.23%), Mn(1.12%), and B point was composed of Si(66.40%), Fe(26.76%), Cr(6.84%). Conclusion : The results of this study confirm that there is a real possibility of the remaining of metallic materials and silicon in body of patient, after acupuncture treatment. Therefore, it is necessary to intensify our efforts to make needles of good quality and to concentrate on manufacturing process of acupuncture needles completely to be free from danger in acupuncture treatment.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.23-29
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• 2010

This paper presents a method for constructing a memory system using defective memory chips comprising faulty storage blocks. The three-dimensional memory system introduced here employs a die-stacked structure of faulty memory chips. Signals lines passing through the through-silicon-vias (TSVs) connect chips in the defect tolerant structure. Defective chips are classified into several groups each group comprising defective chips having faulty blocks at the same location. A defect tolerant memory system is constructed using chips from different groups. Defect-free storage blocks from spare chips replace faulty blocks using additional routing circuitry. The number of spare chips for defect tolerance is $s={\ulcorner}(k{\times}n)/(m-k){\urcorner}$ to make a system defect tolerant for (n+s) chips with k faulty blocks among m independently addressable blocks.

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.441-448
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• 2015

Silicon carbide (SiC) coatings for tri-isotropic (TRISO) nuclear fuel particles were fabricated using a chemical vapor deposition (CVD) process onto graphite. A micro-tensile-testing system was developed for the mechanical characterization of SiC coatings at high temperatures. The fracture strength of the SiC coatings was characterized by the developed micro-tensile test in the range of $25^{\circ}C$ to $1000^{\circ}C$. Two types of CVD-SiC films were prepared for the micro-tensile test. SiC-A exhibited a large grain size (0.4 ~ 0.6 m) and the [111] preferred orientation, while SiC-B had a small grain size (0.2 ~ 0.3 mm) and the [220] preferred orientation. Free silicon (Si) was co-deposited onto SiC-B, and stacking faults also existed in the SiC-B structure. The fracture strengths of the CVD-SiC coatings, as measured by the high-temperature micro-tensile test, decreased with the testing temperature. The high-temperature fracture strengths of CVD-SiC coatings were related to the microstructure and defects of the CVD-SiC coatings.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.3
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• pp.271-277
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• 2004

A Si(Silicon) MEMS(Micro Electro Mechanical System) package using a doped lossy Si carrier for CPW(Coplanar Waveguide) MMICs(Microwave and Millimeter-wave Integrated Circuits) is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed chip-carrier scheme is verified by fabricating and measuring a GaAs CPW on the two types of carriers(conductor-back metal, doped lossy Si) in the frequency from 0.5 to 40 ㎓. The proposed MEMS package using the lightly doped lossy(15 Ω$.$cm) Si chip-carrier and the HRS(High Resistivity Silicon, 15 ㏀$.$cm) shows the optimized loss and parasitic problems-free since the doped lossy Si-carrier effectively absorbs and suppresses the resonant leakage. The Si MEMS package for CPW MMICs has an insertion loss of only - 2.0 ㏈ and a power loss of - 7.5 ㏈ at 40 ㎓.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.3 no.3
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• pp.165-169
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• 2002

Silicon wafer is very important accuracy make use semiconductor device substrate. In this research, for the uniformity dopant density distribution obtained to Neutron Transmutation Doping on make use Si in P Doping study work. In this research. we irradiated neutron on FZ silicon wafers which had high resistivity (1000~2000 ${\Omega}$cm), HANARO reactor was utilized resistivity changes due to observed, the generation of neutron irradiation on point defect analyzed, point defect on resistivity changes inquire into the effect. Before neutron irradiation theoretical due to calculated 5 ${\Omega}$-cm, 20.1 ${\Omega}$-cm for HTS hole and 5 ${\Omega}$-cm, 26.5 ${\Omega}$-cm, 32.5 ${\Omega}$-cm for IP3 hole. After neutron irradiation through SRP measurement the designed resistivities were approached, which were 2.1 H-cm for HTS-1, 7.21 ${\Omega}$-cm for HTS-2, 1.79 ${\Omega}$-cm for IP-1, 6.83 ${\Omega}$-cm for IP-2, 9.23 ${\Omega}$-cm for IP-3, respectively. Also after neutron irradiation resistivity changes due to thermal neutron dependent irradiation hole types free.

• Journal of the Korean institute of surface engineering
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• v.35 no.6
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• pp.415-421
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• 2002

Ti-Si-N coating layers were codeposited on silicon wafer substrates by a DC reactive magnetron sputtering technique using separate titanium and silicon targets in $N_2$/Ar gas mixtures. The oxidation behavior of Ti-Si-N coating layers containing 4.0 at.%, 10.0 at.%, and 27.3 at.% Si was investigated at temperatures ranging from 600 to $960^{\circ}C$. The coating layers containing 4.0 at.% Si became fast oxidized from $600^{\circ}C$ while the coating layers containing 10.0 at.% Si had oxidation resistance up to $800^{\circ}C$. It was concluded that an increase in Si content to a level of 10.0 at.% led to the formation of finer TiN grains and a uniformly distributed amorphous Si3N4 phase along grain boundaries, which acted as efficient diffusion barriers against oxidation. However, the coating layers containing 27.3 at.% Si showed relatively low oxidation resistance compared with those containing 10.0 at.% Si. This phenomenon would be explained by the existence of free Si which was not nitrified in the coating layers containing 27.3 at.% Si.