• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.247-250
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• 1999

This paper presents characteristics of neuron-MOSFET for the implementation of logic circuits such at the inverter and D/A converter. Neuron-MOSFETS were fabricated using double poly CMOS process. From the measured results, it was found that noise margin of the inverter was dependant on the coupling ratio and a complete D/A characteristics of the source follower could be obtained by using any input Sate as a control gate.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.05a
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• pp.709-711
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• 2011

본 연구에서는 Double-gate MOSFET의 DIBL(Drain Induced Barrier Lowering)의 특성을 분석하기 위하여 분석학적 전송모델을 사용하였으며 분석학적 모델을 유도하기 위하여 포아송방정식을 풀 때 급수함수를 이용하였다. 단채널 효과에서는 유효채널길이 감소와 문턱전압 감소 그리고 DIBL이 있다. DIBL은 드레인 전압 변화에 따른 문턱전압의 변화로 알 수 있다. 채널길이가 감소하면 DIBL은 감소하지만, 채널길이가 감소하면 단채널 효과가 증가한다. 본 논문에서는 채널길이에 따른 DIBL을 분석하였고, 또한 채널 두께 및 게이트 산화막의 두께에 대한 DIBL에 대하여 분석하였다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.2
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• pp.107-117
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• 2010

An analytical subthreshold swing model is presented for symmetric double-gate (DG) MOSFETs with Gaussian doping profile in vertical direction. The model is based on the effective conduction path effect (ECPE) concept of uniformly doped symmetric DG MOSFETs. The effect of channel doping on the subthreshold swing characteristics for non-uniformly doped device has been investigated. The model also includes the effect of various device parameters on the subthreshold swing characteristics of DG MOSFETs. The proposed model has been validated by comparing the analytical results with numerical simulation data obtained by using the commercially available $ATLAS^{TM}$ device simulator. The model is believed to provide a better physical insight and understanding of DG MOSFET devices operating in the subthreshold regime.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.2
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• pp.130-133
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• 2010

This paper presents a study of the influence of variation of counter doping thickness on short channel effect in symmetric double-gate (DG) nano MOSFETs. Short channel effects are estimated from the computed values of current-voltage (I-V) characteristics. Two dimensional Quantum transport equations and Poisson equations are used to compute DG MOSFET characteristics. We found that the transconductance ($g_m$) and the drain conductance ($g_d$) increase with an increase in p-type counter-doping thickness ($T_c$). Very high value of transconductance ($g_m=38\;mS/{\mu}m$) is observed at 2.2 nm channel thickness. We have established that the threshold voltage of DG MOSFETs can be tuned by selecting the thickness of counter-doping in such device.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2014.10a
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• pp.745-748
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• 2014

본 연구에서는 비대칭 이중게이트(double gate; DG) MOSFET의 채널길이에 대한 문턱전압이하 스윙의 변화에 대하여 분석하였다. 문턱전압이하 스윙은 트랜지스터의 디지털특성을 결정하는 중요한 요소로서 채널길이가 감소하면 특성이 저하되는 문제가 나타나고 있다. 이러한 문제를 해결하기 위하여 개발된 DGMOSFET의 문턱전압이하 스윙의 채널길이에 대한 변화를 채널두께, 산화막두께, 상하단 게이트 전압 및 도핑농도 등에 따라 조사하고자 한다. 특히 하단 게이트 구조를 상단과 달리 제작할 수 있는 비대칭 DGMOSFET에 대하여 문턱전압이하 스윙을 분석함으로써 하단 게이트 전압 및 하단 산화막 두께 등에 대하여 자세히 관찰하였다. 문턱전압이하 스윙의 해석학적 모델을 구하기 위하여 포아송방정식에서 해석학적 전위분포모델을 유도하였으며 도핑분포함수는 가우스분포함수를 사용하였다. 결과적으로 문턱전압이하 스윙은 상하단 게이트 전압 및 채널도핑농도 그리고 채널의 크기에 매우 민감하게 변화하고 있다는 것을 알 수 있었다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.2
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• pp.881-883
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• 2005

In case is below length 100nm of gate, various kinds problem can be happened with by threshold voltage change of device, occurrence of leakage current by tunneling because thickness of oxide by 1.5nm low scaling is done and doping concentration is increased. SiO$_2$ dielectric substance can not be used for gate insulator because is expected that tunneling current become 1A/cm$^2$ in 1.5nm thickness low. In this paper, devised double gate MOSFET(DGMOSFET) to decrease effect of leakage current by this tunneling. Therefore, could decrease effect of these leakage current in thickness 1nm low of SiO$_2$ dielectric substance. But, very big gate insulator of permittivity should be developed for develop device of nano scale.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.142-147
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• 2021

We present a subthreshold swing model for a symmetric junctionless double gate MOSFET. The scale length λ1 required to obtain the potential distribution using the Poisson's equation is a criterion for analyzing the short channel effect by an analytical model. In general, if the channel length Lg satisfies Lg > 1.5λ1, it is known that the analytical model can be sufficiently used to analyze short channel effects. The scale length varies depending on the channel and oxide thickness as well as the dielectric constant of the channel and the oxide film. In this paper, we obtain the scale length for a constant permittivity (silicon and silicon dioxide), and derive the relationship between the scale length and the channel length satisfying the error range within 5%, compared with a numerical method. As a result, when the thickness of the oxide film is reduced to 1 nm, even in the case of Lg < λ1, the analytical subthreshold swing model proposed in this paper is observed to satisfy the error range of 5%. However, if the oxide thickness is increased to 3 nm and the channel thickness decreased to 6 nm, the analytical model can be used only for the channel length of Lg > 1.8λ1.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.818-821
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• 2012

This paper have analyzed the change of threshold voltage for conduction path of double gate(DG) MOSFET. The threshold voltage roll-off among the short channel effects of DGMOSFET have become obstacles of precise device operation. The analytical solution of Poisson's equation have been used to analyze the threshold voltage, and Gaussian function been used as carrier distribution to analyze closely for experimental results. The threshold voltages for conduction path have been analyzed for device parameters such as channel length, channel thickness, gate oxide thickness and doping concentration. Since this potential model has been verified in the previous papers, we have used this model to analyze the threshold voltage. Resultly, we know the threshold voltage is greatly influenced on the change of conduction path for device parameters of DGMOSFET.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.11
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• pp.2511-2516
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• 2012

This paper have analyzed the change of threshold voltage for conduction path of double gate(DG) MOSFET. The threshold voltage roll-off among the short channel effects of DGMOSFET have become obstacles of precise device operation. The analytical solution of Poisson's equation have been used to analyze the threshold voltage, and Gaussian function been used as carrier distribution to analyze closely for experimental results. The threshold voltages for conduction path have been analyzed for device parameters such as channel length, channel thickness, gate oxide thickness and doping concentration. Since this potential model has been verified in the previous papers, we have used this model to analyze the threshold voltage. Resultly, we know the threshold voltage is greatly influenced on the change of conduction path for device parameters of DGMOSFET.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.10
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• pp.1-6
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• 2008

The holding voltage of the high-voltage MOSFETs in snapback condition is much smaller than the power supply voltage. Such characteristics may cause the latcup-like problems in the Smart Power ICs if these devices are directly used in the ESD (Electrostatic Discharge) power clamp. In this work, a latchup-free design based on the Drain-Extended PMOS (DEPMOS) adopting gate VDD structure is proposed. The operation region of the proposed gate-VDD DEPMOS ESD power clamp is below the onset of the snapback to avoid the danger of latch-up. From the measurement on the devices fabricated using a $0.35\;{\mu}m$ BCD (Bipolar-CMOS-DMOS) Process (60V), it was observed that the proposed ESD power clamp can provide 500% higher ESD robustness per silicon area as compared to the conventional clamps with gate-driven LDMOS (lateral double-diffused MOS).