• Journal of KIISE:Computer Systems and Theory
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• 제36권1호
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• pp.33-39
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• 2009

This paper presents a new secure scan design technique to protect secret key from scan-based side channel attack for an Advanced Encryption Standard(AES) core embedded on an System-on-a-Chip(SoC). Our proposed secure scan design technique can be applied to crypto IF core which is optimized for applications without the IP core modification. The IEEE1149.1 standard is kept, and low area and power consumption overheads and high fault coverage can be achieved compared to the existing methods.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제47권2호
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• pp.77-86
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• 2010

This paper presents an efficient secure scan design technique which is based on a fake key and IEEE 1149.1 instruction to protect secret key from scan-based side channel attack for an Advanced Encryption Standard (AES) core embedded on an System-on-a-Chip (SoC). Our proposed secure scan design technique can be applied to crypto IP core which is optimized for applications without the IP core modification. The IEEE 1149.1 standard is kept, and low area, low power consumption, very robust secret-key protection and high fault coverage can be achieved compared to the existing methods.

• IEMEK Journal of Embedded Systems and Applications
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• 제17권6호
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• pp.375-382
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• 2022

This paper proposes a multi-core cooperative computing structure considering the heterogeneous features of automotive embedded on-chip software. The automotive embedded software has the heterogeneous execution flow properties for various hardware drives. Software developed with a homogeneous execution flow without considering these properties will incur inefficient overhead due to core latency and load. The proposed method was evaluated on an target board on which a automotive MCU (micro-controller unit) with built-in multi-cores was mounted. We demonstrate an overhead reduction when software including common embedded system tasks, such as ADC sampling, DSP operations, and communication interfaces, are implemented in a heterogeneous execution flow. When we used the proposed method, embedded software was able to take advantage of idle states that occur between heterogeneous tasks to make efficient use of the resources on the board. As a result of the experiments, the power consumption of the board decreased by 42.11% compared to the baseline. Furthermore, the time required to process the same amount of sampling data was reduced by 27.09%. Experimental results validate the efficiency of the proposed multi-core cooperative heterogeneous embedded software execution technique.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 한국해양정보통신학회 2009년도 추계학술대회
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• pp.959-962
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• 2009

Recently, a multi-core system is studied for single terminal's operations on various service networks for mobile systems. Therefore, it is expected that mobile systems capable of supporting WCDMA, GSM, and WiBro would be developed. Mobile systems for supporting various service networks is able to be implemented on a single chipset via SoC(System on Chip) technology, thus a noble modem design proper for SoC technology is necessary. As those systems shall be operated at different frequency band with only a single terminal, a problem that a nonlinear characteristic according to the system and its frequency band is occurred. In this paper a noble modem design for multi-core systems is proposed and the nonlinear characteristics for those systems is analysed. The proposed modem design is based on OFDM(Orthogonal Frequency Division Multiplexing) and MC-CDMA scheme. And nonlinear characteristic analysis is done by PSD measurement.

• Journal of the Institute of Electronics Engineers of Korea SD
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• 제46권8호
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• pp.22-30
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• 2009

Due to high levels of integration and complexity, the Network-on-Chip (NoC) approach has emerged as a new design paradigm to overcome on-chip communication issues and data bandwidth limits in conventional SoC(System-on-Chip) design. In particular, exponentially growing of energy consumption caused by high frequency, synchronization and distributing a single global clock signal throughout the chip have become major design bottlenecks. To deal with these issues, a globally asynchronous, locally synchronous (GALS) design combined with low power techniques is considered. Such a design style fits nicely with the concept of voltage-frequency-islands (VFI) which has been recently introduced for achieving fine-grain system-level power management. In this paper, we propose an efficient design methodology that minimizes energy consumption by VFI partitioning on an NoC architecture as well as assigning supply and threshold voltage levels to each VFI. The proposed algorithm which find VFI and appropriate core (or processing element) supply voltage consists of traffic-aware core graph partitioning, communication contention delay-aware tile mapping, power variation-aware core dynamic voltage scaling (DVS), power efficient VFI merging and voltage update on the VFIs Simulation results show that average 10.3% improvement in energy consumption compared to other existing works.

• JSTS:Journal of Semiconductor Technology and Science
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• 제10권3호
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• pp.176- 184
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• 2010

A low-power inductorless 1:4 DEMUX and a 4:1 MUX for a 90 nm CMOS are presented. The DEMUX can be operated at a speed of 25 Gb/s with the power supply voltage of 1.05 V, and the power consumption is 8.9 mW. The area of the DEMUX core is $29\;{\times}\;40\;{\mu}m^2$. The operation speed of the 4:1 MUX is 13 Gb/s at a power supply voltage of 1.2 V, and the power consumption is 4 mW. The area of the MUX core is $30\;{\times}\;18\;{\mu}m^2$. The MUX/DEMUX mainly consists of differential pseudo-NMOS. In these MUX/DEMUX circuits, logic swing is nearly rail-to-rail, and a low $V_{dd}$. The component circuit is more scalable than a CML circuit, which is commonly used in a high-performance MUX/DEMUX. These MUX/DEMUX circuits are compatible with conventional CMOS logic circuit, and it can be directly connected to CMOS logic gates without logic level conversion. Furthermore, the circuits are useful for core-to-core interconnection in the system LSI or chip-to-chip communication within a multi-chip module, because of its low power, small footprint, and reasonable operation speed.

• Journal of the Microelectronics and Packaging Society
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• 제22권2호
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• pp.55-59
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• 2015

Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

• Journal of the Microelectronics and Packaging Society
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• 제13권4호
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• pp.9-15
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• 2006

This paper shows the impedance profile of PEEC(Partial Equivalent Electrical Circuit) PDN(Power Distribution Networks) including core and I/O circuit. Through the simulated results, we find that the core power noise having connection with I/O power is affected by I/O switching. Also, using designed $74{\times}5inch$ DLL(Delay Locked Loop) test board, we analyzed the effect of power noise on operation region of chip. Jitter of a DLL measure for frequency of $50{\sim}400MHz$ and compared with impedance obtained result of simulation. Jitter of a DLL are increased near about frequency of 100MHz. It is reason that the resonant peak of PDNs has an impedance of more the 1ohm on 100MHz. we present the impedance profile of a chip and board for the decoupling capacitor reduced the target impedance. Therefore, power supply network design should be considered not only decoupling capacitors but also core switching current and I/O switching current.

• Journal of IKEEE
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• 제23권2호
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• pp.388-394
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• 2019

This paper describes a design of security system-on-chip (SoC) that integrates a Cortex-M0 CPU with an AAW (ARIA-AES- Whirlpool) crypto-core which implements two block cipher algorithms of ARIA and AES and a hash function Whirlpool into an unified hardware architecture. The AAW crypto-core was implemented in a small area through hardware sharing based on algorithmic characteristics of ARIA, AES and Whirlpool, and it supports key sizes of 128-bit and 256-bit. The designed security SoC was implemented on FPGA device and verified by hardware-software co-operation. The AAW crypto-core occupied 5,911 slices, and the AHB_Slave including the AAW crypto-core was implemented with 6,366 slices. The maximum clock frequency of the AHB_Slave was estimated at 36 MHz, the estimated throughputs of the ARIA-128 and the AES-128 was 83 Mbps and 78 Mbps respectively, and the throughput of the Whirlpool hash function of 512-bit block was 156 Mbps.

• IEIE Transactions on Smart Processing and Computing
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• 제4권2호
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• pp.83-88
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• 2015

Core-A is 32-bit synthesizable processor core with a unique instruction set architecture (ISA). In this paper, the Core-A ISA is introduced with discussion of useful features and the development environment, including the software tool chain and hardware on-chip debugger. Core-A is described using Verilog-HDL and can be customized for a given application and synthesized for an application-specific integrated circuit or field-programmable gate array target. Also, the GNU Compiler Collection has been ported to support Core-A, and various predesigned platforms are well equipped with the established design flow to speed up the hardware/software co-design for a Core-A-based system.