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A. Yu, J. H. Lau, S. W. Ho, A. Kumar, W. Y. Hnin, W. S. Lee, M. C. Jong, V. N. Sekhar, V. Kripesh, D. Pinjala, S. Chen, C.-F. Chan, C.-C. Chao, C.-H. Chiu, C.-M. Huang and C. Chen, "Fabrication of High Aspect Ratio TSV and Assembly with Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology with High-Density Interconnects", IEEE Transactions on Components, Packaging, Manufacturing Technologies (CPMT), 1(9), 1336 (2011).
DOI
ScienceOn
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Y. Orii, K. Toriyama, H. Noma, Y. Oyama, H. Nishiwaki, M. Ishida, T. Nishio, N. C. Labianca and C. Feger, "Ultrafinepitch C2 Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps", Proc. of the 59th Electronic Components and Technology Conference (ECTC), 948 (2009).
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Y. H. Hu, C. S. Liu, M. J. Lii, A. L. Manna, K. J. Rebibis and M. Zhao, "3D Stacking Using Cu-Cu Direct Bonding for 40 Pitch and Beyond", Proc. of the 4th European System Integration Technology Conference (ESTC), (2012).
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R. Agarwal, W. Zhang, P. Limaye and W. Ruythooren, "High Density Cu-Sn TLP Bonding for 3D Integration", Proc. of the 59th Electronic Components and Technology Conference (ECTC), 345, (2009).
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M. S. Kim, Y. H. Ko, J. H. Bang and C. W. Lee, "The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump", J. Microelectron. Packag. Soc., 19(3), 15 (2012).
DOI
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J. B. Kim, S. H. Kim and Y. B. Park, "Intermetallic Compound Growth Characteristics of Cu/Ni/Au/Sn-Ag/Cu Microbump for 3-D IC Packages", J. Microelectron. Packag. Soc., 20(2), 59 (2013).
DOI
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7 |
K.-S. Choi, K. J. Sung, B. O. Lim, H. C. Bae, S. Jung, J. T. Moon and Y. S. Eom, "Novel Maskless Bumping Material for 3D Integration", ETRI J., 32(2), 342 (2010).
DOI
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K.-S. Choi, S. W. Chu, J. J. Lee, K. J. Sung, H. C. Bae, B. O. Lim, J. T. Moon and Y. S. Eom, "Novel Bumping Material for Solder-on-Pad Technology", ETRI J., 33(4), 637 (2011).
DOI
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Y.-S. Eom, K. S. Choi, S.-H. Moon, J. H. Park, J. H. Lee and J. T. Moon, "Characterization of a Hybrid Cu Paste as an Isotropic Conductive Adhesive", ETRI J., 33(6), 864 (2011).
DOI
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K.-J. Sung, K. S. Choi, H. C. Bae, Y. H. Kwon and Y. S. Eom, "Novel Bumping and Underfill Technologies for 3D IC Integration", ETRI J., 34(5), 706 (2012).
DOI
ScienceOn
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K.-S. Choi, H. E. Bae, H. C. Bae and Y. S. Eom, "Novel Bumping Process for Solder on Pad Technology", ETRI J., 35(2), 340 (2013).
DOI
ScienceOn
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Y.-S. Eom, J. H. Son, H. C. Bae, K. S. Choi and H. S. Choi, "Optimization of material and process for fine pitch LVSoP technology", ETRI J., 35(4), 625 (2013).
DOI
ScienceOn
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J.-H. Son, Y.-S. Eom, K.-S. Choi, H. S. Lee, H. C. Bae and J. H. Lee, "HV-SoP Technology for Maskless Fine Pitch Bumping Process", ETRI J., 37(3), 523 (2015).
DOI
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IPC Std. J-STD-005, "Requirements for Soldering Pastes".
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Y.-S. Eom, J. W. Back, J. T. Moon, J. D. Nam and J. M. Kim "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film", Microelectron. Eng., 85, 327 (2008).
DOI
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Y.-S. Eom, K.-S. Jang, J.-T. Moon and J. D. Nam, "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder", ETRI J., 32(3), 414 (2010).
DOI
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Y.-S. Eom, J.-H. Son, K.-S. Jang, H. S. Lee, H. C. Bae and J. H. Lee, "Characterization of fluxing and hybrid underfills with micro-encapsulated catalyst for long pot life", ETRI J., 36(3), 343 (2014).
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