• 한국자기학회지
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• 제10권5호
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• pp.203-209
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• 2000

Synthetic antiferromagnet CoFe/Ru/CoFe/FeMn을 사용하고 자유층으로 NiFe/CoFe 이중 층을 사용한 top스핀밸브 구조를 dc magnetron 방식으로 제조하여, 자유층과 구속층의 두께변화에 따른 자기적 특성과 interlayer coupling field티 변화를 조사하였다 Si/Ta(50 $\AA$)/NiFe(x $\AA$)/CoFe(y $\AA$)/Cu(26 $\AA$)/CoFe(30 $\AA$)/Ri(7 $\AA$)/CoFe(15 $\AA$)/FeMn(100 $\AA$)/Ta(50 $\AA$) top synthetic 스핀밸브 시료에서 자유층의 두께 감소에 따른 interlayer coupling field를 조사한 결과 interlayer coupling field가 증가하였으며, 이것은 Neel 모델에 의한 정자기 교환결합에 기인하는 것으로 설명하였다. Top synthetic 스핀 밸브에서 Cu에 인접한 자성층(Pl)과 FeMn에 인접한 자성층(P2) 두께 차이에 따른 interlayer coupling field 의 의존성을 조사한 결과 $t_{P1}$> $t^{P2}$ 일 경우 interlayer coupling field(층간 교환 결합력 세기)는 기존 스핀 밸브에서 적용한 Kools이 제시한 modified Nel 모델에 잘 부합되나, $t_{P1}$ $\leq$ $t_{P2}$ 인 경우 모델과 부합되지 않음으로 새로운 모델이 필요함을 확인하였다 Cu 두께에 변화에 따른 층간 교환 결합력 세기 의존성을 조사한 결과 Cu 두께를 32 $\AA$으로 증가시 층간 교환결합력 세기는 10 Oe 이하로 감소하였다.감소하였다.다.

• 한국표면공학회지
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• 제46권2호
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• pp.68-74
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• 2013

For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2000년도 International Symposium on Magnetics The 2000 Fall Conference
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• pp.191-199
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• 2000

The reflection-amplitude approximation is used to calculate the interlayer exchange coupling in (001) Co/Cu/Co multilayers. The dependence of the phase factor of the reflection amplitude on the energy and wave vector is included. The contribution of each period is calculated and the results are compared with those from the asymptotic behavior. It is shown that the energy and wave-vector dependence of the phase factor may affect the interlayer exchange coupling significantly.

• Journal of Magnetics
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• 제6권2호
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• pp.43-46
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• 2001

The reflection-amplitude approximation is used to calculate the interlayer exchange coupling in (001) Co/Cu/Co multilayers. The dependence of the phase factor of the reflection amplitude on the energy and wave vector is included. The contribution of each period is calculated and the results are compared with those from asymptotic behavior. It is shown that the energy and wave-vector dependence of the phase factor may affect the interlayer exchange coupling significantly.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.277-282
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• 2017

Nickel germanide (NiGe) is one of the most promising alloy materials for source/drain (S/D) of Ge MOSFETs. However, NiGe has limited thermal stability up to $450^{\circ}C$ which is a challenge for fabrication of Ge MOSFETs. In this paper, a novel method is proposed to improve the thermal stability of NiGe using Co interlayer. As a result, we found that the thermal stability of NiGe was improved from $450^{\circ}C$ to $570^{\circ}C$ by using the proposed Co interlayer. Furthermore, we found that current-voltage (I-V) characteristic was improved a little by using Co/Ni/TiN structure after post-annealing. Therefore, NiGe formed by the proposed Co interlayer that is, Co/Ni/TiN structure, is a promising technology for S/D contact of Ge MOSFETs.

• 한국재료학회지
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• 제13권2호
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• pp.88-93
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• 2003

Co/Ti bilayer structure in Co salicide process helps to the improvement of device speed by lowering contact resistance due to the epitaxial growth of $CoSi_2$layers. We investigated the epitaxial growth and interfacial mass transport of $CoSi_2$layers formed from $150 \AA$-Co/Ti structure with two step rapid thermal annealing (RTA). The thicknesses of Ti layers were varied from 20 $\AA$ to 100 $\AA$. After we confirmed the appropriate deposition of Ti film even below $100\AA$-thick, we investigated the cross sectional microstructure, surface roughness, eptiaxial growth, and mass transportation of$ CoSi_2$films formed from various Ti thickness with a cross sectional transmission electron microscopy XTEM), scanning probe microscopy (SPM), X-ray diffractometery (XRD), and Auger electron depth profiling, respectively. We found that all Ti interlayer led to$ CoSi_2$epitaxial growth, while $20 \AA$-thick Ti caused imperfect epitaxy. Ti interlayer also caused Co-Ti-Si compounds on top of $CoSi_2$, which were very hard to remove selectively. Our result implied that we need to employ appropriate Ti thickness to enhance the epitaxial growth as well as to lessen Co-Ti-Si compound formation.

• 반도체디스플레이기술학회지
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• 제4권2호
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• pp.7-10
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• 2005

[ $SiO_{2}$ ] or SiON is usually deposited and annealed after formation of silicide in real transistor fabrication processes. Nickel silicide and nickel silicide with Co interlayer were annealed at 650$^{\circ}C$ for 30 min with silica top layer in this study to investigate its thermal stability. SEM, XPS, and FPP(four point probe) were employed for the investigation. Nickel silicide with Co interlayer showed improved thermal stability. Co interlayer seems to play a key role to the stability of nickel silicide.

• Journal of Magnetics
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• 제5권4호
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• pp.139-142
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• 2000

The interlayer coupling between adjacent ferromagnetic layers was examined for CoFe/Cu/NiFe trilayer systems. A series of films of CoFe (20 nm)/Cu($t_{cu}$)/NiFe (20 nm) trilayers with Cu spacer thickness, $t_{cu}$, in the range of 1~10 m was deposited on Si(100) wafers at room temperature by DC magnetron sputtering. In order to understand the dependence of the magnetic interaction between ferromagnetic $Co_{90}Fe_{10}$ (wt.%) and $Ni_{81}Fe_{19}$ (wt.%) layers separated by a nonmagnetic Cu spacer on the Cu layer thickness, we investigated the derivative ferromagnetic resonance (FMR) spectra. The FMR results were analyzed using the model of Layadi and Art-man for interlayer interaction. The interlayer coupling constant decreases in an oscillatory manner as the Cu spacer thickness increases up to 10 nm and approaches zero above 10 nm. The interlayer coupling constant is positive for all samples. Hence, it seems that the exchange coupling between adjacent CoFe and NiFe layers separated by a Cu layer is ferromagnetic.

• 대한전자공학회논문지SD
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• 제40권12호
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• pp.1-9
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• 2003

본 논문에서는 cobalt interlayer와 TiN capping을 적용한 Ni-Silicide 구조를 제안하여 100 ㎜ CMOS 소자에 적용하고 소자 특성 연구를 하였다. Ni-Silicide의 취약한 열 안정성을 개선하기 위해 열 안정성이 우수한 Cobalt interlayer이용하여 silicide의 열화됨을 개선하였고 또한 silicide 계면의 uniformity를 향상하기 위해 TiN capping을 동시에 적용하였다. 100 ㎚ CMOS 소자에 제안한 Co/Ni/TiN 구조를 적용하여 700℃, 30분에서의 열처리 시에도 silicide의 낮은 면저항과 낮은 접합 누설 전류가 유지되었으며 100 ㎚이하 소자의 특성 변화도 거의 없음을 확인하였다. 따라서 제안한 Co/Ni/TiN 구조가 NiSi의 열 안정성을 개선시킴으로써 100 ㎚ 이하의 Nano CNOS 소자에 매우 적합한 Ni-Silicide 특성을 확보하였다.

• Journal of Magnetics
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• 제10권2호
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• pp.44-47
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• 2005

The oscillatory interlayer exchange coupling (IEC) has been shown in pinned $[CoFe/Pt(t_{pt})/CoFe]/IrMn$ multi-layers with perpendicular anisotropy. The period of oscillation corresponds to about 2 monolayers of Pt. The oscillatory behavior of IEC depending on the nonmagnetic metallic Pt thickness is thought to be related the antiferromagnetic ordering induced by IrMn layer. Oscillatory IEC as function of insulating NiO thickness has been observed in $[Pt/CoFe]_4/NiO(t_{NiO})/[CoFe/Pt]_4$ multilayers. The effect of N (number of bilayer repeats) upon the magnetic property of [Pt/CoFe]N/IrMn is also studied.