• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.302-308
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• 2011

In this paper, we have proposed a new approach for optical failure analysis which employs a CMOS photon-emitting circuitry, consisting of a flip-flop based on a sense amplifier and a photon-emitting device. This method can be used even with deep-submicron processes where conventional optical failure analyses are difficult to use due to the low sensitivity in the near infrared (NIR) region of the spectrum. The effectiveness of our approach has been proved by the failure analysis of a prototype designed and fabricated in 0.18 ${\mu}m$ CMOS process.

• JSTS:Journal of Semiconductor Technology and Science
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• v.15 no.3
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• pp.417-422
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• 2015

A 6.5 - 8.5 GHz CMOS UWB transmitter is implemented using $0.18{\mu}m$ CMOS technology. The transmitter is mainly composed of switched LC VCO and digital pulse generator (DPG). Using RF switch and DPG, the uniform power and sidelobe rejection are achieved irrespective of the carrier frequency. The measured UWB carrier frequency range is 7 ~ 8 GHz and the pulse width is tunable from 1 to 2 ns. The measured energy efficiency per pulse is 2.1 % and the power consumption is 0.6 mW at 10 Mbps without the buffer amplifier. The chip core size is $0.72mm^2$.

• Journal of Sensor Science and Technology
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• v.28 no.2
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• pp.71-75
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• 2019

This paper proposes the extension of the dynamic range in complementary metal oxide semiconductor (CMOS) image sensors (CIS) using switching operation of in-pixel inverter. A CMOS inverter is integrated in each unit pixel of the proposed CIS for switching operations. The n+/p-substrate photodiode junction capacitances are added to each unit pixel. When the output voltage of the photodiode is less than half of the power supply voltage of the CMOS inverter, the output voltage of the CMOS inverter changes from 0 V to the power supply voltage. Hence, the output voltage of the CMOS inverter is adjusted by changing the supply voltage of the CMOS inverter. Thus, the switching point is adjusted according to light intensity when the supply voltage of the CMOS inverter changes. Switching operations are then performed because the CMOS inverter is integrated with in each unit pixel. The proposed CIS is composed of a pixel array, multiplexers, shift registers, and biasing circuits. The size of the proposed pixel is $10{\mu}m{\times}10{\mu}m$. The number of pixels is $150(H){\times}220(V)$. The proposed CIS was fabricated using a $0.18{\mu}m$ 1-poly 6-metal CMOS standard process and its characteristics were experimentally analyzed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.3
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• pp.274-283
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• 2014

In this paper, the epi layer of npn SOI HBT with n+ buried layer has been studied through Sentaurus process and device simulator. The doping value of the deposited epi layer has been varied for the npn HBT to achieve improved $f_tBV_{CEO}$ product (397 GHzV). As the $BV_{CEO}$ value is higher for low value of epi layer doping, higher supply voltage can be used to increase the $f_t$ value of the HBT. At 1.8 V $V_{CE}$, the $f_tBV_{CEO}$ product of HBT is 465.5 GHzV. Further, the film thickness of the epi layer of the SOI HBT has been scaled for better performance (426.8 GHzV $f_tBV_{CEO}$ product at 1.2 V $V_{CE}$). The addition of this HBT module to fully depleted SOI CMOS technology would provide better solution for realizing wireless circuits and systems for 60 GHz short range communication and 77 GHz automotive radar applications. This SOI HBT together with SOI CMOS has potential for future high performance SOI BiCMOS technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.8 no.4
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• pp.295-301
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• 2008

Recently, the demand on mm-wave (millimeter-wave) applications has increased dramatically. While circuits operating in the mm-wave frequency band have been traditionally implemented in III-V or SiGe technologies, recent advances in Si MOSFET operation speed enabled mm-wave circuits realized in a Si CMOS technology. In this work, a 58 GHz CMOS LC cross-coupled VCO (Voltage Controlled Oscillator) was fabricated in a $0.13-{\mu}m$ Si RF CMOS technology. In the course of the circuit design, active device models were modified for improved accuracy in the mm-wave range and EM (electromagnetic) simulation was heavily employed for passive device performance predicttion and interconnection parasitic extraction. The measured operating frequency ranged from 56.5 to 58.5 GHz with a tuning voltage swept from 0 to 2.3 V. The minimum phase noise of -96 dBc/Hz at 5 MHz offset was achieved. The output power varied around -20 dBm over the measured tuning range. The circuit drew current (including buffer current) of 10 mA from 1.5 V supply voltage. The FOM (Figure-Of-Merit) was estimated to be -165.5 dBc/Hz.

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.5
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• pp.58-65
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• 2015

This paper presents the design of an implantable stimulation IC intended for neural prosthetic devices using $0.18-{\mu}m$ standard CMOS technology. The proposed single-channel biphasic current stimulator prototype is designed to deliver up to 1 mA of current to the tissue-equivalent $10-k{\Omega}$ load using 12.8-V supply voltage. To utilize only low-voltage standard CMOS transistors in the design, transistor stacking with dynamic gate biasing technique is used for reliable operation at high-voltage. In addition, active charge balancing circuit is used to maintain zero net charge at the stimulation site over the complete stimulation cycle. The area of the total stimulator IC consisting of DAC, current stimulation output driver, level-shifters, digital logic, and active charge balancer is $0.13mm^2$ and is suitable to be applied for multi-channel neural prosthetic devices.

• Journal of Sensor Science and Technology
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• v.10 no.2
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• pp.91-100
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• 2001

A $8{\times}8$ foveated (log-polar) retina chip for edge detection has been designed and fabricated using CMOS technology. Retina chip performs photo-input sensing, edge extraction and motion detection and we focused edge extraction. The pixel distribution follows the log-polar transform having more resolution in the center than in the periphery and can reduce image information selectively. This kind of structure has been already employed in simple image sensors for normal cameras, but never in edge detection retina chip. A scaling mechanism is needed due to the different pixel size from circumference to circumference. A mechanism for current scaling in this research is channel width scaling of MOS transistor. The designed chip has been fabricated using standard $1.5{\mu}m$ single-poly double-metal CMOS technology.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.6
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• pp.48-51
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• 2009

One-stage low noise amplifier (LNA) using 65 nm RF CMOS technology below 20 GHz is designed to find the optimal bias voltage and optimal width of input transistor so that the maximum figure of merit (FoM) has been achieved. If the frequency is higher than 13 GHz, the amplifier needs two-stage to achieve the higher gain. If the frequency is lower than 5 GHz, one additional capacitor between gate and source should be added to control the power under the limitation. This paper summarizes one-stage LNA overall performances below 20 GHz and this approach can also be applied to other CMOS technology of LNA designs.

• Journal of IKEEE
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• v.20 no.3
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• pp.279-284
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• 2016

This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm. This paper presents a two stage L-band power amplifier realized with a $0.32{\mu}m$ Silicon-On-Insulator (SOI) CMOS technology. To overcome a low breakdown voltage limit of MOSFET, stacked-FET structures are employed, where three transistors in the first stage amplifier and four transistors in the second stage amplifier are connected in series so that their output voltage swings are added in phase. The stacked-FET structures enable the proposed amplifier to achieve a 21.5 dB small-signal gain and 15.7 dBm output 1-dB compression power at 1.9 GHz with a 122 mA DC current from a 4 V supply. The amplifier delivers a 19.7 dBm saturated output power with a 16 % maximum Power Added Efficiency (PAE). A bond wire fine tuning technology enables the amplifier a 23.67 dBm saturated output power with a 20.4 % maximum PAE. The die area is $1.9mm{\times}0.6mm$.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.349-352
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• 2002

This paper describes a design of a 1bit Carry Propagate Free Adder/Subtracter (CPFA/S) VLSI using the Adiabatic Dynamic CMOS Logic (ADCL) circuit technology. Using a PSPICE simulator, energy dissipation of the ADCL 1bit CPFA/S is compared with that of the CMOS 1bit CPFA/S. As a result, energy dissipation of the proposed ADCL circuits is about 1/23 as low as that of the CMOS circuits. The transistors count, propagation-delay tittle and energy dissipation of the ADCL 4bit CPFA/S are compared with those of the ADCL 4bit Carry Propagate Adder/Subtracter (CPA/S). The transistors count and propagation-delay tittle are found to be reduced by 7.02% and 57.1%, respectively. Also, energy dissipation is found to be reduced by 78.4%. Circuit operation and performance are evaluated using a chain of the ADCL 1bit CPFA/S fabricated in a $1.21mutextrm{m}$ CMOS process. The experimental results show that addition and subtraction are operated with clock frequencies up to about 1㎒.