• JSTS:Journal of Semiconductor Technology and Science
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• 제9권1호
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• pp.37-50
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• 2009

Evaluation results about area scaling capabilities of various SRAM margin-assist techniques for random $V_T$ variability issues are described. Various efforts to address these issues by not only the cell topology changes from 6T to 8T and 10T but also incorporating multiple voltage-supply for the cell terminal biasing and timing sequence controls of read and write are comprehensively compared in light of an impact on the required area overhead for each design solution given by ever increasing $V_T$ variation (${\sigma}_{VT}$). Two different scenarios which hinge upon the EOT (Effective Oxide Thickness) scaling trend of being pessimistic and optimistic, are assumed to compare the area scaling trends among various SRAM solutions for 32 nm process node and beyond. As a result, it has been shown that 6T SRAM will be allowed long reign even in 15 nm node if ${\sigma}_{VT}$ can be suppressed to < 70 mV thanks to EOT scaling for LSTP (Low Standby Power) process.

• 전기전자학회논문지
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• 제27권1호
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• pp.65-70
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• 2023

높은 캐리어 이동도, 큰 포화 속도, 낮은 고유 정전 용량, 유연성, 그리고 투명성을 장점으로 가진 CNTFET(Carbon NanoTube Field Effect Transistor) 10,000개 이상을 현존하는 반도체 디자인 절차와 공정 프로세서를 활용하여 하나의 반도체 칩에 집적하는데 성공하였다. 제작된 반도체 칩의 3차원 다층 구조와 다양한 CNTFET 생산 공정 연구는 기존 MOSFET과 CNTFET를 하나의 반도체 칩에 함께 사용하는 hybrid MOSFET-CNTFET 반도체 칩 제작에 대한 가능성을 보여주고 있다. 본 논문에서는 hybrid MOSFET-CNTFET을 활용한 6T binary SRAM을 디자인하는 방법에 대해 논하고자 한다. 기존 MOSFET SRAM 또는 CNTFET SRAM 디자인 방법을 활용하여 hybrid MOSFET-CNTFET SRAM을 디자인 하는 방법을 소개하고 그 성능을 기존 MOSFET SRAM 그리고 CNTFET SRAM과 비교하고자 한다.

• 한국컴퓨터산업학회논문지
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• 제6권5호
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• pp.757-766
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• 2005

There have been great demands for higher density SRAM in all area of SRAM applications, such as mobile, network, cache, and embedded applications. Therefore, aggressive shrinkage of 6T Full CMOS SRAM had been continued as the technology advances, However, conventional 6T Full CMOS SRAM has a basic limitation in the cell size because it needs 6 transistors on a silicon substrate compared to 1 transistor in a DRAM cell. The typical cell area of 6T Full CMOS SRAM is $70{\sim}90F^{2}$, which is too large compared to $8{\sim}9F^{2}$ of DRAM cell. With 80nm design rule using 193nm ArF lithography, the maximum density is 72M bits at the most. Therefore, pseudo SRAM or 1T SRAM, whose memory cell is the same as DRAM cell, is being adopted for the solution of the high density SRAM applications more than 64M bits. However, the refresh time limits not only the maximum operation temperature but also nearly all critical electrical characteristics of the products such as stand_by current and random access time. In order to overcome both the size penalty of the conventional 6T Full CMOS SRAM cell and the poor characteristics of the TFT load cell, we have developed $S^{3}$ cell. The Load pMOS and the Pass nMOS on ILD have nearly single crystal silicon channel according to the TEM and electron diffraction pattern analysis. In this study, we present $S^{3}$ SRAM cell technology with 100nm design rule in further detail, including the process integration and the basic characteristics of stacked single crystal silicon TFT.

• 한국전기전자재료학회논문지
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• 제19권4호
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• pp.314-321
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• 2006

There have been great demands for higher density SRAM in all area of SRAM applications, such as mobile, network, cache, and embedded applications. Therefore, aggressive shrinkage of 6 T Full CMOS SRAM had been continued as the technology advances. However, conventional 6 T Full CMOS SRAM has a basic limitation in the cell size because it needs 6 transistors on a silicon substrate compared to 1 transistor in a DRAM cell. The typical cell area of 6 T Full CMOS SRAM is $70{\sim}90\;F^2$, which is too large compared to $8{\sim}9\;F^2$ of DRAM cell. With 80 nm design rule using 193 nm ArF lithography, the maximum density is 72 Mbits at the most. Therefore, pseudo SRAM or 1 T SRAM, whose memory cell is the same as DRAM cell, is being adopted for the solution of the high density SRAM applications more than 64 M bits. However, the refresh time limits not only the maximum operation temperature but also nearly all critical electrical characteristics of the products such as stand_by current and random access time. In order to overcome both the size penalty of the conventional 6 T Full CMOS SRAM cell and the poor characteristics of the TFT load cell, we have developed S3 cell. The Load pMOS and the Pass nMOS on ILD have nearly single crystal silicon channel according to the TEM and electron diffraction pattern analysis. In this study, we present $S^3$ SRAM cell technology with 100 nm design rule in further detail, including the process integration and the basic characteristics of stacked single crystal silicon TFT.

• 전기전자학회논문지
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• 제11권4호
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• pp.129-136
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• 2007

본 논문에서는 Dual-Port 구조를 사용하는 Display IC용 내장형 1T-SRAM에 적합한 간단하고 효과적인 새로운 데이터라인 리던던시 회로(dataline redundancy circuit)를 제안하고 이를 0.18-um CMOS 1T-SRAM 공정을 이용하여 $320{\times}120{\times}18$-Bit Dual-port 1T-SRAM로 구현하여 검증하였다. 한 개의 인버터와 한 개의 낸드 게이트로 이루어진 시프트 로직 회로(shift logic circuit)를 이용해서 기존의 데이터라인 리던던시 회로 보다는 훨씬 간단하게 컨트롤 로직을 구현함으로써 한 개의 비트라인 페어(bit line pair)의 피치(pitch) 내에서 필요한 컨트롤 로직을 모두 구현할 수 있었다. 또한 시프트 로직 회로를 개선해서 worst case에서의 delay를 12.3ns에서 5.9ns로 52% 감소시켜서 워드라인 셋업 후에서 센스앰프 셋업까지의 시간 동안에 데이터라인 스위칭 작업을 완료할 수 있게 하여서 데이터라인 리던던시 회로의 타이밍 오버헤드(timing overhead)를 row cycle 시간에 의해 감추어지게 할 수 있었다. 본 논문에서 제시된 데이터라인 리던던시 회로의 면적 오버헤드(area overhead)는 약 7.6%로 예측된다.

• 센서학회지
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• 제33권3호
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• pp.152-157
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• 2024

In this study, we propose a novel 8T ternary SRAM that can process three logic values (0, 1, and 2) with only two additional transistors, compared with the conventional 6T binary SRAM. The circuit structure consists of positive and negative ternary inverters (PTI and NTI, respectively) with carbon-nanotube field-effect transistors, replacing conventional cross-coupled inverters. In logic '0' or '2,' the proposed SRAM cell operates the same way as conventional binary SRAM. For logic '1,' it works differently as storage nodes on each side retain voltages of V_DD/2 and V_DD, respectively, using the subthreshold current of two additional transistors. By applying the ternary system, the data capacity increases exponentially as the number of cells increases compared with the 6T binary SRAM, and the proposed design has an 18.87% data density improvement. In addition, the Synopsys HSPICE simulation validates the reduction in static power consumption by 71.4% in the array system. In addition, the static noise margins are above 222 mV, ensuring the stability of the cell operation when V_DD is set to 0.9 V.

• 한국정보통신학회논문지
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• 제14권8호
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• pp.1877-1886
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• 2010

본 논문에서는 전기적인 퓨즈 프로그래밍을 이용한 1T-SRAM 리페어용 리던던시 제어 회로를 설계하였다. 공급전원이 낮아지더라도 외부 프로그램 전원을 사용하여 높은 프로그램 파워를 eFuse (electrical fuse)에 공급하면서 셀의 읽기 전류를 줄일 수 있는 듀얼 포트 eFuse 셀을 제안하였다. 그리고 제안된 듀얼 포트 eFuse 셀은 파워-온 읽기 기능으로 eFuse의 프로그램 정보가 D-래치에 자동적으로 저장되도록 설계하였다. 또한 메모리 리페어 주소와 메모리 액세스 주소를 비교하는 주소 비교 회로는 dynamic pseudo NMOS 로직으로 구현하여 기존의 CMOS 로직을 이용한 경우 보다 레이아웃 면적을 19% 정도 줄였다. 전기적인 퓨즈 프로그래밍을 이용한 1T-SRAM 리페어용 리던던시 제어 회로는 동부하이텍 $0.11{\mu}m$ Mixed Signal 공정을 이용하여 설계되었으며, 레이아웃 면적은 $249.02{\times}225.04{\mu}m^{2}$이다.

• 전기전자학회논문지
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• 제16권3호
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• pp.265-273
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• 2012

Data stability and leakage power dissipation have become a critical issue in scaled SRAM design. In this paper, an advanced 8T SRAM cell improving the read and write stability of data storage elements as well as reducing the leakage current in the idle mode is presented. During the read operation, the bit-cell keeps the noise-vulnerable data 'low' node voltage close to the ground level, and thus producing near-ideal voltage transfer characteristics essential for robust read functionality. In the write operation, a negative bias on the cell facilitates to change the contents of the bit. Unlike the conventional 6T cell, there is no conflicting read and write requirement on sizing the transistors. In the standby mode, the built-in stacked device in the 8T cell reduces the leakage current significantly. The 8T SRAM cell implemented in a 130 nm CMOS technology demonstrates almost 100 % higher read stability while bearing 20 % better write-ability at 1.2 V typical condition, and a reduction by 45 % in leakage power consumption compared to the standard 6T cell. The stability enhancement and leakage power reduction provided with the proposed bit-cell are confirmed under process, voltage and temperature variations.

• 대한전자공학회논문지SD
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• 제47권3호
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• pp.7-17
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• 2010

본 논문은 4-트랜지스터 래치 셀을 이용한 저전력향 신개념의 SRAM을 제안한다. 4-트랜지스터 메모리 셀은 종래의 6-트랜지스터 SRAM 셀에서 access 트랜지스터를 제거한 형태로, PMOS 트랜지스터의 소스는 비트라인 쌍에 연결되고 NMOS 트랜지스터의 소스는 두개의 워드라인에 각각 연결된다. 동작시 워드라인에 일정크기의 전압을 인가할 때 비트라인에 흐르는 전류를 감지하여 읽기동작을 수행하고, 비트라인 쌍에 전압차이를 두고 워드라인에 일정크기의 전압을 인가하여 쓰기동작을 수행한다. 이는 공급전압 보다 낮은 소신호 전압으로 워드라인과 비트라인을 구동하여 메모리 셀의 데이터를 저장하고 읽어낼 수 있어서 동작 소비전력이 적다. 아울러 셀 누셀전류 경로의 감소로 인해 대기 소모전력 또한 개선되는 장점이 있다. 0.18-${\mu}m$ CMOS 공정으로 1.8-V, 16-kbit SRAM test chip을 제작하여 제안한 회로기술을 검증하였고, 칩 면적은 $0.2156\;mm^2$이며 access 속도는 17.5 ns 이다. 동일한 환경에서 구현한 종래의 6-트랜지스터 SRAM과 비교하여 읽기동작시 30% 쓰기동작시 42% 동작소비전력이 적고, 대기전력 또한 64% 적게 소비함을 관찰하였다.

• 한국산업융합학회 논문집
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• 제24권1호
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• pp.69-77
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• 2021

The widely used low-cost design methodology for IoT devices is very popular. In such a networked device, memory is composed of flash memory, SRAM, DRAM, etc., and because it processes a large amount of data, memory design is an important factor for system performance. Therefore, each device selects optimized design factors such as function, performance and cost according to market demand. The design of a memory architecture available for low-cost IoT devices is very limited with the configuration of SRAM, flash memory, and DRAM. In order to process as much data as possible in the same space, an architecture that supports parallel processing units is usually provided. Such parallel architecture is a design method that provides high performance at low cost. However, it needs precise software techniques for instruction and data mapping on the parallel architecture. This paper proposes an instruction/data mapping method to support optimized parallel processing performance. The proposed method optimizes system performance by actively using hardware and software parallelism.