• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2019.05a
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• pp.323-324
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• 2019

For flash memory devices with Ge-MONOS(metal-Oxide-Nitride-Oxide-Silicon) structures, variations of threshold voltage with programming voltage were investigated. The programming voltage was observed in steps of 1V from 10V to 17V and programmed for 1 second. The threshold voltage from 10V to 14V was about 0.5V, which is not much different from that before programing, and the threshold voltages at 15V, 16V and 17V were 1.25V, 2.01V and 3.84V, respectively, which differed 0.75V, 1.49V and 3.44V from that before programing.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.8
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• pp.1227-1234
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• 2013

An analog array with a 1.2 double poly floating gate transistor has been developed with a standard CMOS fabrication process. The programming of each cell by means of an efficient control circuit eliminates the unnecessary erasing operation which has been widely used in conventional analog memories. It is seen that the path of the signal for both the programming and the reading is almost exactly the same since just one comparator supports both operations. It helps to eliminate the effects of the amplifier input-offset voltage problem on the output voltage for the read operation. In the array, there is no pass transistor isolating a cell of interest from the adjacent cells in the array. Instead of the extra transistors, one extra bias voltage, Vmid, is employed. The experimental results from the memory shows that the resolution of the memory is equivalent to the information content of at least six digital cells. Programming/erasing of each cell is achieved with no detectable disturbance of adjacent cells. Finally, the unique shape of the injector structure in a EEPROM is adopted as a cell of analog array. It reduces the programming voltage below the transistor breakdown voltage without any special fabrication process.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.194-199
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• 1997

We fabricated MIM (Metal-Insulator-Metal) antifuses with Al/a-Si/Mo structure and then examined the I-V characteristics and on-state resistance distribution of antifuses. The leakage current of antifuses is below $1Pa/{\mu}m^2$, and programming voltage lies within 10 to 11 V. After programming, on-resistance of antifuses is mostly 10-20$\Omega$ and 20% of these have above 100$\Omega$. In order to reduce on-resistance and the deviation of this distribution, we tried to inject current again into already programed antifuses (we call this re-programming method). From this method, the resistance of antifuses with above 100Ω can be reduced to below 50$\Omega$. When antifuses are programmed by re-programming method, these antifuses have more uniform and lower on-resistance than programmed with one-pulse.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.35C no.10
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• pp.30-37
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• 1998

An analog array with a 1.2 $\mu\textrm{m}$ double poly floating gate transistor has been developed with a standard CMOS fabrication process. The programming of each cell by means of an efficient control circuit eliminates the unnecessary erasing operation which has been widely used in conventional analog memories. It is seen that the path of the signal for both the programming and the reading is almost exactly the same since just one comparator supports both operations. It helps to eliminate the effects of the amplifier input-offset voltage problem on the output voltage for the read operation. In the array, there is no pass transistor isolating a cell of interest from the adjacent cells in the array. Instead of the extra transistors, one extra bias voltage, Vmid, is employed. The experimental results from the memory shows that the resolution of the memory is equivalent to the information content of at least six digital cells. Programming/erasing of each cell is achieved with no detectable disturbance of adjacent cells. Finally, the unique shape of the injector structure in a EEPROM is adopted as a cell of analog array. It reduces the programming voltage below the transistor breakdown voltage without any special fabrication process.

• The Journal of the Korea institute of electronic communication sciences
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• v.6 no.1
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• pp.118-122
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• 2011

For programming such as writing or erasing of the flash memory, two different kinds of high voltage are required, and the charge pump circuit has been used for this. The charge pump circuit proposed in this paper uses the VCO to adjust the clock frequency in order to match the reference voltage approved from the outside and the charge pump's output. Accordingly, I suggest a circuit that can produce a predictable output, regardless of not only an error by fabrication but also MOSFET's body effect generated in each part of the charge pump.

• Journal of the Korean Institute of Telematics and Electronics
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• v.21 no.5
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• pp.67-78
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• 1984

EAROM device is an n-channel MOS transistor with a control gate stack ed on the floating gate. On account of channel injection type, channel lengths are designed 4-8 $\mu$m and chinnel widths 5-14 $\mu$m. These devices which have fourstructures of different type control gate are designed by NMOS 5 $\mu$m design rule and fabricated by double polysilicon gate NMOS Process. Double ion implantation is applied to increase punchthrough voltage and gate-controlled channel breakdown voltage. The drain and gate voltage for programming was 13-17V and 20-25V, respectively. EPROM cell fabricated could be erased not by optical method but by electrical method. The result of charge retention test showed decrease in stored charges by 4% after 200 hours at 1$25^{\circ}C$.

• Journal of KIISE:Computing Practices and Letters
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• v.16 no.11
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• pp.1051-1055
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• 2010

Software defined radio(SDR) technology implements wireless communication protocols as software instead of dedicated hardware. SDR enables reconfiguration of wireless communication protocols without expensive hardware modification. However, as the SDR systems are equipped with additional programmable processors, they suffer significant power dissipation. This paper proposes a novel power management technique for SDR systems, called the combined modulation and voltage scaling (CMVS). Numerical analyses were performed to evaluate the effectiveness of CMVS. The results show that CMVS minimizes power dissipation while satisfying the given data transfer rate.

• Journal of Sensor Science and Technology
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• v.4 no.3
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• pp.80-88
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• 1995

This paper presents the fabrication of a metal-insulator-metal(MIM) antifuse structure consisting of insulators sandwiched between top electrode, Al, and bottom electrode, TiW and additionally studies on antifuse properties depending on the condition of insulator. The intermetallic insulators, prepared by means of sputter, comprised of silicon oxide and tantalum oxide. In such an antifuse structure, silicon oxide layer is utilized to decrease the leakage current and tantalum oxide layer, of which the dielectric strength is lower than that of silicon oxide, is also utilized to lower the breakdown voltage near 10V. Finally sufficient low leakage current, below 1nA, and low programming voltage, about 9V, could be obtained in antifuse device comprising $Al/Ta_{2}O_{5}(10nm)/SiO_{2}(10nm)/TiW$ structure and OFF resistance of 3$3.65M{\Omega}$ and ON resistance of $7.26{\Omega}$ could be also obtained. This $Ta_{2}O_{5}/SiO_{2}$ based antifuse structures will be promising for highly reliable programmable device.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.981-984
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• 2005

This study is to realize its threshold voltage shift after programming operation in charge trap type SONOS memory by simulation. SONOS devices are charge trap type nonvolatile memory devices in which charge storage takes place in traps in the nitride-blocking oxide interface and the nitride layer. For simulation of their threshold voltage as a function of the memory states, traps in the nitride layer have to be defined. However, trap models in the nitride layer are not developed in commercial simulator. So, we propose a new method that can simulate their threshold voltage shift by an amount of charges induced to the electrodes as a function of a programming voltages and times as define two electrodes in the tunnel oxide-nitride interface and the nitride-blocking oxide interface of SONOS structures.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.5
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• pp.1061-1066
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• 2012

A digital memory has been widely used as a device for storing information due to its reliable, fast and relatively simple control circuit. However, the storage of the digital memory will be limited by the inablility to make smaller linewidths. One way to dramatically increase the storeage capability of the memory is to change the type of stored data from digital to analog. The analog memory fabricated in a standard single poly 0.6um CMOS process has been developed. Single cell and adjacent circuit block for programming have been designed and characterized. Applications include low-density non-volatile memory, control of redundancy in SRAM and DRAM memories, ID or security code registers, and image and sound memory.