• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.629-632
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• 1998

This paper presents a new and simple technique to realize high Q inductor on low resistivity silicon wafer with 6 $\Omega$.cm. This technique is very compatible with bipolar and CMOS standard silicon process. By forming the deep and narrow trenches on the low resistivity wafer substrate under inductor pattern, oxidizing and filling with undoped polysilicon, the low resistivity silicon wafer acts as high resistivity wafer being suitable for the fabrication of high Q inductor. By using this technique the quality factor (Q) for 8-turn spiral inductor was improved up to max. 10.3 at 2 ㎓ with 3.0 $\mu\textrm{m}$ of metal thickness. The experiment results show that Q on low resistivity silicon wafer with the trench technique have been improved more than 2 times compared to the conventional low resistivity silicon wafer without trenches.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.126-129
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• 2009

In this study, it was aimed to develop the re-use technology of ultra-fine silicon powders, by-products during the current production process of high purity poly-Si feedstock. For this goal, the compacts of the silicon powders were tried to fabricate by CIP (Cold Isostatic Pressing) method using silicon rubber mold without chemical binder materials. The density ratio of the silicon powder compacts reached 74%. In order to simulate the actual handling and charging conditions of feedstock material in casting process, a shaking test was carried out and mass loss measured. Finally, the silicon powder compacts were melted using a cold crucible induction melting method and the purity assessment was conducted by Hall effect measurement.

• KIEE International Transactions on Electrophysics and Applications
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• 제2C권5호
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• pp.258-261
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• 2002

Electrical forming dependent current-voltage (I-V) and numerically derived differential conductance(dI／dV) characteristics have been presented in the multi-layer nano-crystalline silicon／oxygen (no-Si／O) superlattice. Distinct staircase-like features, indicating the presence of resonant tunnel barriers, are clearly observed in the dc I-V characteristics. Also, all samples showed a continuous change in current and zero conductivity around OV corresponding to the Coulomb blockade in the calculated dI／dV-V curve. Also, Ra-man scattering measurement showed the presence of a nano-crystalline Si structure. This result becomes a step in the right direction for the fabrication of silicon-based optoelectronic and quantum devices as well as for the replacement of silicon-on-insulator (SOI) in high speed and low power silicon MOSFET devices of the future.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 추계학술대회 논문집
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• pp.264-267
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• 2007

It is important to reduce optical losses from front surface reflection to improve the efficiency of crystalline silicon solar cells. Surface texturing by isotropic etching with acid solution based on HF and $HNO_3$ is one of the promising methods that can reduce surface reflectance. Anisotropic texturing with alkali solution is not suitable for multicrystalline silicon wafers because of its various grain orientations. In this paper, we textured multicrystalline silicon wafers by simple wet chemical etching using acid solution to reduce front surface reflectance. After that, surface morphology of textured wafer was observed by Scanning Electron Microscope(SEM) and Atomic Force Microscope(AFM), surface reflectance was measured in wavelength from 400nm to 1000nm. We obtained 29.29% surface reflectance by isotropic texturing with acid solution in wavelength from 400nm to 1000nm for fabrication of multicrystalline silicon solar cells.

• 한국세라믹학회지
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• 제42권10호
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• pp.645-648
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• 2005

To fabricate a (100) silicon hard master, we used anisotropic wet etching for the embossing. The etching chemical for the sili­con wafer was a TMAH 25$\%$ solution. The anisotropic wet etching produces a smooth sidewall surface inclined at 54.7°, and the surface roughness of the fabricated master is about 1 nm. After spin coating an organic-inorganic sol-gel hybrid resin on a silicon substrate, we used the fabricated master to form patterns on the silicon substrate. Thus, we successfully obtained patterns via the hot embossing technique with the (100) silicon hard master. Moreover, by using a single hydrophobic surface treatment of the master, we succeeded in achieving uniform surface roughness of the embossed patterns for more than ten embossments.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.121-124
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• 2004

The research on the porous silicon having low wafer stress during the oxidation process in IPOS(Isolation by Porous Oxidized Silicon) were carried out. Fine pores with less than 100A of diameter were found in the porous silicon which from p-type Si by electrochemical etching. In this study, it is possible to make the porous silicon with 59% of porosity.

• 통합자연과학논문집
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• 제7권4호
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• pp.221-226
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• 2014

Optically encoded porous silicon smart particles were successfully fabricated from the free-standing porous silicon thin films using ultrasono-method. DBR PSi was prepared by an electrochemical etch of heavily doped $p^{{+}{+}}$-type silicon wafer. DBR PSi was prepared by using a periodic pseudo-square wave current. The surface-modified DBR PSi was prepared by either thermal oxidation or thermal hydrosilylation. Free-standing DBR PSi films were generated by lift-off from the silicon wafer substrate using an electropolishing current. Free-standing DBR PSi films were ultrasonicated to create DBR-structured porous smart particles. Optical characteristics of porous smart particles were measured by FT-IR spectroscopy. The surface morphology of porous smart particles was determined by FE-SEM.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2002년도 제22회 학술발표회 초록집
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• pp.106-106
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• 2002

• 센서학회지
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• 제11권1호
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• pp.1-8
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• 2002

온도 측정이 필요한 다양한 용도의 소자에 응용되고 있는 열전쌍열(thermopile) 제작에 SOI 구조를 응용하여, 특성을 개선하였다. 열전쌍열을 구성하는 저항체가 단결정 실리콘으로, 제벡 계수(seebeck coefficient)가 높은 재료일 뿐 아니라, 실리콘 저항체를 산화막을 이용하여 실리콘 기판과 절연 분리한 구조로 되어있어서, 기존의 이온주입 공정에 의해 불순물을 주입하는 방법으로 제작된 저항체에 비해서 두 접점(hot junction 및 cold junction) 사이의 열 전달을 극적으로 감소시킬 수 있어서 소자의 특성을 개선할 수 있었다. 열전쌍열은 p형 단결정 실리콘 저항체 17개 및 n형 17개를 직렬 연결로 구성했다. 저항체의 길이 $1600{\mu}m$, 폭 $40{\mu}m$, 두께 $1{\mu}m$으로 제작된 열전쌍열에 빛을 조사하여 소자 양단에 온도차를 발생시키고, 그 때 발생하는 기전력을 측정한 결과 130mV/K의 우수한 특성을 나타냈다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2011년도 추계학술발표대회 논문집
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• pp.154-157
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• 2011

Hydrogenated silicon nitride deposited by LF-PECVD is commonly used for anti-reflection coating and passivation in silicon solar cell fabrication. The deposition of the optimized silicon nitride on the surface is elemental in crystalline silicon solar cell. In this work, the carrier lifetimes were measured while the thicknesses of $SiN_x$ were changed from 700 ${\AA}$ to 1150 ${\AA}$ with the gas flow of $SiH_4$ as 40 sccm and $NH_3$ as 120 sccm,. The carrier lifetime enhanced as the thickness of $SiN_x$ increased due to improved passivation effect. To study the characteristics of $SiN_x$ with various gas ratios, the gas flow of $NH_3$ was changed from 40 sccm to 200 sccm with intervals of 40 sccm. The thickness of $SiN_x$ was fixed as 1000 ${\AA}$ and the gas flow of $SiH_4$ as 40 sccm. The refractive index of SiNx and the carrier lifetime were measured before and after heat treating at $650^{\circ}C$ to investigate their change by the firing process in solar cell fabrication. The index of refraction of SiNx decreased as the gas ratios increased and the longest carrier lifetime was measured with the gas ratio $NH_3/SiH_4$ of 3.