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http://dx.doi.org/10.5369/JSST.2002.11.1.001

Fabrication of the thermopile using SOI structure  

Lee, Young-Tae (Electronics Engineering Education, Andong National University)
Takao, Hidekuni (Department of Electrical and Electronic Engineering, Toyohashi University of Technology)
Ishida, Makoto (Department of Electrical and Electronic Engineering, Toyohashi University of Technology)
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Abstract
In this paper, a thermopile which is applied to wide uses of temperature measuring was fabricated and its characteristic was improved by appling SOI structure to the fabrication. We improved characteristic of the thermopile by using single crystal silicon strips that has high seebeck coefficient and dielectric isolating the silicon strips from substrate with silicon dioxide film which dramatically decrease thermal conductivity between hot and cold junction compared to a silicon strip which was fabricated by ion implantation. The thermopile consists of 17 p-type single crystal silicon strips and 17 n-types by serial connection. The result of electromotive force measuring showed very good characteristic as 130mV/K when temperature difference between the two ends of the thermopile occurs by applying light on the thermopile fabricated with silicon strips of $1600{\mu}m$ length, $40{\mu}m$ width, $1{\mu}m$ thickness.
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