• JSTS:Journal of Semiconductor Technology and Science
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• 제15권6호
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• pp.685-694
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• 2015

In this paper, a new dynamic reference scheme is proposed to improve the read voltage margin better than the previous static reference scheme. The proposed dynamic reference scheme can be helpful in compensating not only the background pattern dependence but also the cell position dependence. The proposed dynamic reference is verified by simulating the CMOS-memristor hybrid circuit using the practical CMOS SPICE and memristor Verilog-A models. In the simulation, the percentage read voltage margin is compared between the previous static reference scheme and the new dynamic reference scheme. Assuming that the critical percentage of read voltage margin is 5%, the memristor array size with the dynamic scheme can be larger by 60%, compared to the array size with the static one. In addition, for the array size of $64{\times}64$, the interconnect resistance in the array with the dynamic scheme can be increased by 30% than the static reference one. For the array size of $128{\times}128$, the interconnect resistance with the proposed scheme can be improved by 38% than the previous static one, allowing more margin on the variation of interconnect resistance.

• Transactions on Electrical and Electronic Materials
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• 제16권6호
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• pp.293-302
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• 2015

Degraded data stability, weaker write ability, and increased leakage power consumption are the primary concerns in scaled static random-access memory (SRAM) circuits. Two new SRAM cells are proposed in this paper for achieving enhanced read data stability and lower leakage power consumption in memory circuits. The bitline access transistors are asymmetrically gate-underlapped in the proposed SRAM cells. The strengths of the asymmetric bitline access transistors are weakened during read operations and enhanced during write operations, as the direction of current flow is reversed. With the proposed hybrid asymmetric SRAM cells, the read data stability is enhanced by up to 71.6% and leakage power consumption is suppressed up to 15.5%, while displaying similar write voltage margin and maintaining identical silicon area as compared to the conventional memory cells in a 15 nm FinFET technology.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.647-650
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• 2005

In this paper, a low voltage SRAM using double boosting scheme is described. A low supply voltage deteriorates the static noise margin (SNM) and the cell read-out current. For read/write operation, a selected word line and cell VDD bias are boosted in a different level using double boosting scheme. This increases not only the static noise margin but also the cell readout current at a low supply voltage. A low voltage SRAM with 32K ${\times}$ 8bit implemented in a 0.18um CMOS technology shows an access time of 26.1ns at 0.8V supply voltage.

• ETRI Journal
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• 제29권4호
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• pp.457-462
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• 2007

This work presents a low-voltage static random access memory (SRAM) technique based on a dual-boosted cell array. For each read/write cycle, the wordline and cell power node of selected SRAM cells are boosted into two different voltage levels. This technique enhances the read static noise margin to a sufficient level without an increase in cell size. It also improves the SRAM circuit speed due to an increase in the cell read-out current. A 0.18 ${\mu}m$ CMOS 256-kbit SRAM macro is fabricated with the proposed technique, which demonstrates 0.8 V operation with 50 MHz while consuming 65 ${\mu}W$/MHz. It also demonstrates an 87% bit error rate reduction while operating with a 43% higher clock frequency compared with that of conventional SRAM.

• 전기전자학회논문지
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• 제1권1호
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• pp.11-18
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• 1997

회로 시뮬레이터를 이용하는 DC 셀 노드전압 분석방법을 적용하여, 고저항 SRAM 셀 구조에서 기생저항들과 트랜지스터 비대칭에 의해 야기되는 정적 읽기동작에서의 동작마진을 조사하였다. 이상적인 셀에 기생저항을 선택적으로 추가함으로써 각 기생저항들이 동작 마진에 끼치는 영향을 조사한 뒤, 기생저항이 좌우대칭 쌍으로 존재하는 경우에 대해 조사하고, 또한 셀 트랜지스터의 채널폭을 선택적으로 변화시켜 트랜지스터의 비대칭을 야기시킴으로써 트랜지스터 비대칭에 의한 동작 마진의 저하를 분석하였다. 분석 방법은 시뮬레이션된 셀 노드전압 특성에서 두 셀 노드전압이 하나의 값으로 수렴되는 전원전압의 값과 $V_{DD}=5V$에서 셀 노드전압의 차를 비교함으로써 상대적인 동작 마진을 비교하는 방법을 사용하였다. 회로 시뮬레이션에 의존한 본 분석으로부터 셀의 정적 읽기동작에 가장 심각한 영향을 끼치는 기생저항 성분과 트랜지스터의 비대칭 형태를 규명함으로써 새로운 셀 구조 설계시 참고할 수 있는 기준을 제시하였다.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2011년도 춘계학술대회
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• pp.687-691
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• 2011

본 논문에서는 아날로그 트리밍용으로 사용되는 $0.18{\mu}m$ generic 공정 기반의 EM(Electro-Migration)과 eFuse의 저항 변동을 고려한 8bit eFuse OTP (One-Time Programmable) 메모리를 설계하였다. eFuse OTP 메모리는 eFuse에 인가되는 program power를 증가시키기 위해 external program voltage를 사용하였으며, 프로그램되지 않은 cell에 흐르는 read current를 낮추기 위해 RWL (Read Word-Line) activation 이전에 BL을 VSS로 precharging하는 방식과 read NMOS transistor를 최적화 설계하였다. 그리고 프로그램된 eFuse 저항의 변동을 고려한 variable pull-up load를 갖는 sensing margin test 회로를 설계하였다. 한편 eFuse link의 length를 split하여 eFuse OTP의 프로그램 수율 (program yield)을 높였다.

• 전자공학회논문지A
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• 제32A권11호
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• pp.71-78
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• 1995

Based on the popular 4-transistor SRAM cell, an analytical expression of the minimum cell ratio was derived by modeling the static read operation. By analyzing the relatively simple expression for the minimum cell ratio, which was derived assuming the ideal transistor characteristics, effects of the changes in supply voltage and process parameters on the minimum cell ratio was predicted, and the minimum power supply voltage for read operation was determined. The results were verified by simulations utilizing the suggested simulation method, which is suitable for monitoring the lower limit of supply voltage for proper cell operation. From the analysis, it was shown that the worst condition for cell operation is low temperature and low supply voltage, and that the operation margin can be effectively improved by reducing the threshold voltage of the cell transistors.

• 대한전자공학회논문지SD
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• 제44권1호
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• pp.28-35
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• 2007

SRAM의 전체적인 성능은 공급 전원전압에 크게 영향을 받는다. 본 논문에서는 1-V 이하의 저전압 동작시 주요 이슈가 되는 SRAM 셀의 SNM(Static Noise Margin)과 셀 전류의 크기를 개선하기 위하여 이중 승압 셀 바이어스 기법을 이용한 SRAM 설계기법에 대해 기술하였다. 제안한 설계기법은 읽기 및 쓰기동작시 선택된 SRAM 셀의 워드라인과 load PMOS 트랜지스터의 소스에 연결된 셀 공급전원을 서로 다른 레벨로 동시에 승압함으로써 SRAM 셀의 SNM과 셀 전류를 증가시킨다. 이는 셀 면적의 증가 없이 충분한 SNM을 확보할 수 있으며, 아울러 증가된 셀 전류에 의해 동작속도가 개선되는 장점이 있다. $0.18-{\mu}m$ CMOS 공정을 적용한 0.8-V, 32K-byte SRAM macro 설계를 통해 제안한 설계기법을 검증하였고, 시뮬레이션 결과 0.8-V 공급전원에서 종래의 셀 바이어스 기법 대비 135 %의 SNM 향상과 아울러 동작속도는 31 % 개선되었으며, 이로인한 32K-byte SRAM은 23 ns의 access time, $125\;{\mu}W/Hz$의 전력소모 특성을 보였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 ITC-CSCC -3
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• pp.1555-1557
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• 2002

We have investigated the precharge type sense amplifier, it is suitable fur voltage sensing in a NOR type single transistor ferroelectric field effect transistor (1T FeFET) memory read operation. The proposed precharge type sense amplifier senses the bit line voltage of 1T FeFET memory. Therefore, the reference celt is not necessary compared to current sensing in 1T FeFET memory, The high noise margin is wider than the low noise margin in the first inverter because requires tile output of precharge type sense amplifier high sensitivity to transition of input signal. The precharge type sense amplifier has very simple structure and can sense the bit line signal of the 1T FeFET memory cell at low voltage.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제50권4호
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• pp.176-181
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• 2001

As the data rate between chip-to-chip gets high, the skin effect and load of pins deteriorate noise margin. With these, noise disturbances on the bus channel make it difficult for receiver circuits to read the data signal. This paper has proposed a new pre-emphasis driver circuit which achieves wide noise margin by enlarging the signal voltage range during data transition. When data is transferred from a memory chip to a controller, the output boltage of the driver circuit reaches the final values through the intermediate voltage level. The proposed driver supplies more currents applicable to a packet-based memory system, because it needs no additional control signal and realizes very small area. The circuit has been designed in a 0.18 ${\mu}m$ CMOS process, and HSPICE simulation results have shown that the data rate of 1.32 Gbps be achieved. Due to its result, the proposed driver can achieved higher speed than conventional driver by 10%.