• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• The Magazine of the IEIE
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• v.29 no.1
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• pp.66-72
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• 2002

VLSI 기술의 발전은 보다 많은 양의 로직을 단일 칩에 집적 가능하게 했고, 이는 System-on-a-chip 시대의 도래를 가능하게 했다. System-on-a-chip을 가능하게 하기 위해서는 많은 종류의 IP (Intellectual Property)가 필요하고, 공정 변환을 쉽게 하기 위해서는 합성이 가능한 RTL 설계가 절실히 요구된다. 본 논문은 이러한 요구에 부응하기 위해서 hard macro 형태의 기존의 IP로 부터 합성 가능한 IP를 자동 생성해 주는 ART(Automatic RTL Translation)로 명명된 기법에 관한 것이다. 제안된 ART 기법을 이용하여 80C52 호환의 8-bit MCU(Micro-controller Unit)의 합성 가능한 RTL model을 자동 생성하였고, 개발된 Soft IP를 이용하여 TCP/IP 전용 MCU를 표함해서 다양한 제품들을 개발하였다.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1540-1545
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• 2004

Measurement of concentration fields in a micro-channel is the crucial technology in the area of Lab-on-a-chip to be used for various bio-chemical applications. It is wel-known that the only possible way to measure the concentration field in the micro-channel is using micro-LIF(Laser Induced Fluorescence) method. However, an accurate concentration field at a given cross plane in a micro-channel has not been made so far due to the limit of light illumination. The present study demonstrates a novel method to provide an ultra thin laser sheet beam having 5 microns thickness by a micro focus laser line generator. Nile Blue A was used as fluorescent dye for LIF measurement. The laser sheet beam illuminates an exact plane of concentration measurement in the micro-channel to increase the signal to noise ratio and reduce the depth uncertainty considerably.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.23-31
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• 2006

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.09a
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• pp.55-85
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• 2000

MEMS(Micro Electro Mechanical System) technology. MEMS Inertial Sensors promise a new wide market for many areas -Challenge. significant cost reduction by wafer level packaging and testing. decreasing of power consumption by miniaturization. enhancing of performance and reliability. on-chip integration for multiplicity. MEMS is newly emerging technology.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.109-110
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.385-386
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.615-616
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• 2008