Browse > Article
http://dx.doi.org/10.6117/kmeps.2012.19.3.015

The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump  

Kim, Min-Su (과학기술연합대학원대학교)
Ko, Yong-Ho (한국생산기술연구원)
Bang, Jung-Hwan (한국생산기술연구원)
Lee, Chang-Woo (한국생산기술연구원)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.3, 2012 , pp. 15-20 More about this Journal
Abstract
In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.
Keywords
flexible; bendable; wearable; flexible substrate; Cu pillar bump; Sn-Bi solder bump;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Players, "Organic Electronics Forecasts 2005-2015", IDTec (2005).
2 R. H. Reuss, B. R. Chalamala, A. Moussessian, M. G. Kane, A. Kumar, D. C. Zhang, J. A. Rogers, M. Hatalis, D. Temple, G. Moddel, B. J. Eliasson, M. J. Estes, J. Kunze, E. S. Handy, E. S. Harmon, D. B. Salzman, J. M. Woodall, M. A. Alam, J. Y. Murthy, S. C. Jacobsen, M. Olivier, D. Markus, P. M. Campbell, and E. Snow, "Macroelectronics: Perspectives on Technology and Applications", Proc. IEEE, 93(7), 1239 (2005).   DOI   ScienceOn
3 W. S. Wong and A. Salleo, Flexible Electronics, 1st Ed, pp.4- 5, Springer (2009).
4 J. W. Yoon, W. C. Moon, and S. B. Jung, "Core Technology of electronic Packaging", Int. J. Kor. Weld. Soc., 23(2), 116 (2005).
5 S. K. Kang, "Lead (Pb)-Free Solders for Electronic Packaging", J. Electron. Mater., 23(8), 701 (1994).   DOI
6 M. Abtew and G. Selvaduray, "Lead-free Solders in Microelectronics", Mater. Sci. and Eng. R., 27(5-6), 95 (2000).   DOI   ScienceOn
7 A. Sharif and Y. C. Chan, "Comparative Study of Interfacial Reactions of Sn-Ag-Cu and Sn-Ag Solders on Cu Pads during Reflow Soldering", J. Electron. Mater., 34(1), 46 (2005).   DOI
8 J. Shen and Y. C .Chan, "Research advances in nano composite solders", Microelectron. Reliab., 49(3), 223 (2009).   DOI   ScienceOn
9 M. Y .Kim, S .K .Lim and T. S. Oh, "Thermal Cycling and High Temperature storage Reliabilities of the Flip Chip Hoints Processed Using Cu pillar Bumps", J. Microelectron. Packag. Soc, 17(3), 27 (2010).
10 J. Y .Choi, M. Y .Kim, S .K .Kim, and T. S. Oh, "Flip Chip Process for RF Packages Using Joints Structures of Cu and Sn bumps", J. Microelectron. Packag. Soc, 16(3), 67 (2009).
11 W. M. Ki, "Joint Microstructures and Reliability of the Flexible Electronic Module with Flip Bonding Paramtetes(in Kor.)", in MS thesis, pp. 88, University of Science and Technology, Daejeon (2012).