Transactions of the Korean Society of Machine Tool Engineers (한국공작기계학회논문집)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Flip-chip Bonding Using Nd:YAG Laser

Nd:YAG 레이저를 이용한 Flipchip 접합

  • 송춘삼 (서울테크노파크) ;
  • 지현식 (서울산업대학교 에너지환경대학원) ;
  • 김종형 (서울산업대학교 기계설계자동화공학부) ;
  • 김주현 (국민대학교 기계자동차공학부) ;
  • 김주한 (서울산업대학교 기계공학과)
  • Published : 2008.02.15
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Abstract

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

Keywords

References

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