Flip-chip Bonding Using Nd:YAG Laser
![]() |
Song, Chun-Sam
(서울테크노파크)
Ji, Hyun-Sik (서울산업대학교 에너지환경대학원) Kim, Jong-Hyeong (서울산업대학교 기계설계자동화공학부) Kim, Joo-Hyun (국민대학교 기계자동차공학부) Kim, Joo-Han (서울산업대학교 기계공학과) |
1 | Ulrich, R. K., and Brown, W. D., 2006, Advanced Electronic Packaging, Wiley-Interscience, pp. 417-418 |
2 | Kim, S. W., Kim, S. H., and Youn, B. H., 2005, 'Bonding Properties of BGA Solder Ball with Laser Process,' KWS, Vol. 45, Autumn |
3 | Kim, J. W., Kim, D. G., Ha, S. S., Moon, W. C., Yoo, C. S., Moon, J. H., and Jung, S. B., 2006, 'Evaluation of Thermo-mechanical Reliability of Flip Chip Solder Joints(I):I Pb-bearing Solder,' The Korean Institute of Metals and Materials, Vol. 44, No. 8, pp. 581-586 |
4 | Teutsch, T., Zakel, E., and Azdasht, G., 2006, Advanced packaging, PennWell |
5 | Tummala, R. R., 2001, Fundamentals of Microsystems Packaging, McGraw Hill, pp. 281-284 |
6 | Theppakuttai, S., Shao, D. B., and Chen, S. C., 2004, 'Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging,' Journal of Manufacturing Process, Vol. 6, No. 1, pp. 1-8 DOI ScienceOn |
7 | Schafer, H., Yuan, P., and Wang, Z. P., 2003, 'Investigation of Ultrasonic Filp Chip Bonding on Flex Substartes,' Electronic Packaging Technology Proceeding, pp. 117-120 |
8 | Ready, J. F., Farson, D. F., and Feeley, T., 2001, Handbook of Laser Materials Processing, Laser Institute of America, p. 138 |
9 | Son, H. K., 2007, '266nm DPSS Laser Micro Machining Technology,' Journal of the KSMTE, Vol. 47, No. 2, pp. 19-21 |
10 | Li, M. Y., Wang, C. Q., Bang, H. S., and Kim, Y. P., 2005, 'Development of a Flux-less Soldering Method by Ultrasonic Modulated Laser,' Journal of Materials Processing Technology, Vol. 168, Issue. 2, pp. 303-307 DOI ScienceOn |
![]() |