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Flip-chip Bonding Using Nd:YAG Laser  

Song, Chun-Sam (서울테크노파크)
Ji, Hyun-Sik (서울산업대학교 에너지환경대학원)
Kim, Jong-Hyeong (서울산업대학교 기계설계자동화공학부)
Kim, Joo-Hyun (국민대학교 기계자동차공학부)
Kim, Joo-Han (서울산업대학교 기계공학과)
Publication Information
Transactions of the Korean Society of Machine Tool Engineers / v.17, no.1, 2008 , pp. 120-125 More about this Journal
Abstract
A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.
Keywords
Soldering; Flipchip; DPSS laser; Packaging;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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