• Title/Summary/Keyword: gate structure

Search Result 1,124, Processing Time 0.024 seconds

FinFET for Terabit Era

  • Choi, Yang-Kyu
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.4 no.1
    • /
    • pp.1-11
    • /
    • 2004
  • A FinFET, a novel double-gate device structure is capable of scaling well into the nanoelectronics regime. High-performance CMOS FinFETs , fully depleted silicon-on-insulator (FDSOI) devices have been demonstrated down to 15 nm gate length and are relatively simple to fabricate, which can be scaled to gate length below 10 nm. In this paper, some of the key elements of these technologies are described including sub-lithographic pattering technology, raised source/drain for low series resistance, gate work-function engineering for threshold voltage adjustment as well as metal gate technology, channel roughness on carrier mobility, crystal orientation effect, reliability issues, process variation effects, and device scaling limit.

Analysis of Threshold Voltage for Symmetric and Asymmetric Oxide Structure of Double Gate MOSFET (이중게이트 MOSFET의 대칭 및 비대칭 산화막 구조에 대한 문턱전압 분석)

  • Jung, Hakkee
    • Journal of the Korea Institute of Information and Communication Engineering
    • /
    • v.18 no.12
    • /
    • pp.2939-2945
    • /
    • 2014
  • This paper has analyzed the change of threshold voltage for oxide structure of symmetric and asymmetric double gate(DG) MOSFET. The asymmetric DGMOSFET can be fabricated with different top and bottom gate oxide thickness, while the symmetric DGMOSFET has the same top and bottom gate oxide thickness. Therefore optimum threshold voltage is considered for top and bottom gate oxide thickness of asymmetric DGMOSFET, compared with the threshold voltage of symmetric DGMOSFET. To obtain the threshold voltage, the analytical potential distribution is derived from Possion's equation, and Gaussian distribution function is used as doping profile. We investigate for bottom gate voltage, channel length and thickness, and doping concentration how top and bottom gate oxide thickness influences on threshold voltage using this threshold voltage model. As a result, threshold voltage is greatly changed for oxide thickness, and we know the changing trend greatly differs with bottom gate voltage, channel length and thickness, and doping concentration.

Design of Broad Band RF Components for Partial Discharge Monitoring System (부분방전 모니터링 시스템을 위한 광대역 RF 소자설계 연구)

  • Lee, Je-Kwang;Ko, Jae-Hyeong;Kim, Koon-Tae;Kim, Hyeong-Seok
    • The Transactions of The Korean Institute of Electrical Engineers
    • /
    • v.60 no.12
    • /
    • pp.2286-2292
    • /
    • 2011
  • In this paper we present the design of Low Noise Amplifier(LNA), mixer and filter for RF front-end part of partial discharge monitoring system. The monitoring system of partial discharge in high voltage power machinery is used to prevent many kinds of industrial accidents, and is usually composed of three parts - sensor, RF front-end and digital microcontroller unit. In our study, LNA, mixer and filter are key components of the RF front-end. The LNA consists of common gate and common source-cascaded structure and uses the resistive feedback for broad band matching. A coupled line structure is utilized to implement the filter, of which size is reduced by the meander structure. The mixer is designed using dual gate structure for high isolation between RF and local oscillator signal.

A New Structure of SOI MOSFETs Using Trench Mrthod (트랜치 기법을 이용한 SOI MOSFET의 전기적인 특성에 관한 연구)

  • Park, Yun-Sik;Sung, Man-Young;Kang, Ey-Goo
    • 한국컴퓨터산업교육학회:학술대회논문집
    • /
    • 2003.11a
    • /
    • pp.67-70
    • /
    • 2003
  • In this paper, propose a new structure of MOFET(Metal-Oxide-Semiconductor Field Effect Transistor) which is widely application for semiconductor technologies. Eleminate the latch-up effect caused by closed devices when conpose a electronic circuit using proposed devices. In this device have a completely isolation structure, and advantage of leakage current elimination. Each independent devices are isolated by trench-well and oxide layer of SOI substrate. Using trench gate and self aligned techniques reduces parasitic capacitance between gate and source, drain. In this paper, we proposed the new structure of SOI MOSFET which has completely isolation and contains trench gate electrodes and SOI wafers. It is simulated by MEDICI that is device simulator.

  • PDF

An Improvement of the Gas Discharge Structure of the AMD Gate PDP (AND Gate PDP의 기체방전구조 개선)

  • Ryeom, Jeong-Duk
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
    • /
    • v.18 no.5
    • /
    • pp.42-47
    • /
    • 2004
  • This research has improved the problem of discharge AND gate PDP proposed before. The polarity of the DC discharge which composes AND gate is reversely designed and the cross talk problem to the adjacent scanning electrode has been improved. The AND gate proposed before operated by using non-linearity of the discharge by the space charge. In this research, new discharge NOT logic in which it was used that an applied voltage changed with the discharge circuit was added to AND gate. AND gate came to operate more stably. A selective address was able to be discharged with four horizontal scanning electrodes from the experiment result. The operation margin of the AND gate discharge obtained 34V and of the address discharge obtained 70V.

Analysis of the Gate Bias Effects of the Cascode Structure for Class-E CMOS Power Amplifier (CMOS Class-E 전력증폭기의 Cascode 구조에 대한 게이트바이어스 효과 분석)

  • Seo, Donghwan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
    • /
    • v.28 no.6
    • /
    • pp.435-443
    • /
    • 2017
  • In this study, we analyzed the effects of the common-gate transistor bias of a switching mode CMOS power amplifier. Although the most earier works occured on the transistor sizes of the cascode structure, we showed that the gate bias of the common-gate transistor also influences the overall efficiency of the power amplifier. To investigate the effect of the gate bias, we analyzed the DC power consumption according to the gate bias and hence the efficiency of the power amplifier. From the analyzed results, the optimized gate bias for the maximum efficiency is lower than the supply voltage of the power amplifier. We also found that an excessively low gate bias may degrade the output power and efficiency owing to the effects of the on-resistance of the cascode structure. To verify the analyzed results, we designed a 1.9 GHz switching mode power amplifier using $0.18{\mu}m$ RF CMOS technology. As predicted in the analysis, the maximum efficiency is obtained at 2.5 V, while the supply voltage of power amplifier is 3.3 V. The measured maximum efficiency is 31.5 % with an output power of 29.1 dBm. From the measureed results, we successfully verified the analysis.

A Study on Partially-Depleted SOI MOSFET with Multi-gate (다중 게이트을 이용한 부분 공핍형 SOI MOSFET 특성에 관한 연구)

  • Shin, K.S.;Park, Y.K.;Lee, S.J.;Kim, C.J.
    • Proceedings of the KIEE Conference
    • /
    • 1997.07d
    • /
    • pp.1286-1288
    • /
    • 1997
  • In this study, partially-depleted SOI MOSFET with multi-gate was fabricated on p-type SIMOX(Seperation by Implanted Oxygen). As increase the number of its gate, increase the breakdown voltage. But kink effect was not affected by the number of its gate. However, it is known that the asymmetric gate structure reduce kink effect. So if asymmetric multi-gate applied to partially-depleted SOI MOSFET, it is expected that the breakdown voltage of SOI MOSET with asymmetric multi-gate is higher than that of SOI MOSFET with single gate and that kink effect is reduced by SOI MOSFET with asymmetric multi-gate.

  • PDF

Design and Analysis of AlGaN/GaN MIS HEMTs with a Dual-metal-gate Structure

  • Jang, Young In;Lee, Sang Hyuk;Seo, Jae Hwa;Yoon, Young Jun;Kwon, Ra Hee;Cho, Min Su;Kim, Bo Gyeong;Yoo, Gwan Min;Lee, Jung-Hee;Kang, In Man
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.17 no.2
    • /
    • pp.223-229
    • /
    • 2017
  • This paper analyzes the effect of a dual-metal-gate structure on the electrical characteristics of AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors. These structures have two gate metals of different work function values (${\Phi}$), with the metal of higher ${\Phi}$ in the source-side gate, and the metal of lower ${\Phi}$ in the drain-side gate. As a result of the different ${\Phi}$ values of the gate metals in this structure, both the electric field and electron velocity in the channel become better distributed. For this reason, the transconductance, current collapse phenomenon, breakdown voltage, and radio frequency characteristics are improved. In this work, the devices were designed and analyzed using a 2D technology computer-aided design simulation tool.

A Study on the Information Reversibility of Quantum Logic Circuits (양자 논리회로의 정보 가역성에 대한 고찰)

  • Park, Dong-Young
    • The Journal of the Korea institute of electronic communication sciences
    • /
    • v.12 no.1
    • /
    • pp.189-194
    • /
    • 2017
  • The reversibility of a quantum logic circuit can be realized when two reversible conditions of information reversible and energy reversible circuits are satisfied. In this paper, we have modeled the computation cycle required to recover the information reversibility from the multivalued quantum logic to the original state. For modeling, we used a function embedding method that uses a unitary switch as an arithmetic exponentiation switch. In the quantum logic circuit, if the adjoint gate pair is symmetric, the unitary switch function shows the balance function characteristic, and it takes 1 cycle operation to recover the original information reversibility. Conversely, if it is an asymmetric structure, it takes two cycle operations by the constant function. In this paper, we show that the problem of 2-cycle restoration according to the asymmetric structure when the hybrid MCT gate is realized with the ternary M-S gate can be solved by equivalent conversion of the asymmetric gate to the gate of the symmetric structure.