• Journal of information and communication convergence engineering
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• 제8권4호
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• pp.421-426
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• 2010

This paper presents a method of design the counter using sequential system based on synchronous techniques. For the design the counter, first of all, we derive switching algebras and their operations. Also, we obtain the next-state functions, flip-flop excitations and their input functions from the flip-flop. Then, we propose the algorithm which is a method of implementation of the synchronous sequential digital logic circuits. Finally, we apply proposed the sequential logic based on synchronous techniques to counter.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.779-782
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• 1998

This paper describes a high-speed Dual-modulus Prescaler (DMP) for RF mobile communication systems with pulse remover using selective latch technique. This circuit achieves high speed and low power consumption by reducing full speed flip-flops and using a selective latch. The proposed DMP consists of only one full speed flip-flop, a selective latch, conventional flip-flops, and a control gate. In order to ensure the timing of control signal, duty cycle problem and propagation delay must be considered. The failling edgetriggered flip-flops alleviate the duty cycle problem andthis paper shows that the propagation delay of control signal doesn't matter. The maximum operating frequency of the proposed DMP with 0.6um CMOS technology is up to 2.2㎓ at 3.3V power supply and the circuit consumes 5.24mA.

• Journal of the Optical Society of Korea
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• 제14권2호
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• pp.137-141
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• 2010

We report, for the first time to our knowledge, observation of polarization bistability from 1.55-${\mu}m$ wavelength single-mode VCSELs of a conventional cylinder-shape under control of their driving current, and demonstration of all-optical flip-flop (AOFF) operations based on the bistability with optical set and reset pulse injection at a 50 MHz switching frequency. The injection pulse energy was less than 14 fJ. The average on-off contrast ratio of the flip-flopped signals was about 7 dB. These properties of the VCSELs will be potentially useful for future high-speed all-optical signal processing applications.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.583-584
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• 2008

This paper presents a low-power and high-speed pulsed flip-flop based on dual-precharging and conditional discharging. The dual-precharging operation minimizes the parasitic capacitance of each precharge node, resulting in high-speed operation. The conditional-discharging operation minimizes the redundant transitions of precharge nodes, resulting in low-power operation. Linear feedback shift register (LFSR) designed in a $0.18{\mu}m$ CMOS technology using the proposed flip-flop achieves 32% power reduction as compared to conventional design.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.109.1-109
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• 2002

This paper presents a macro/micro flip chip mounting head system for precise force control. In the proposed macro/ micro system, the macro actuator is conventional do servomotor with a ball screw mechanism and the micro actuator is a voice coil motor(VCM) that consists of four NdFeB magnets and a winded moving coil. For force control, a sensitive strain-gauge force sensor is mounted in the micro actuator. Through harmonic motion between macro and micro actuator, we would like to get precise contact force control when small sized flip chip is mounted on flexible substrate in high speed. In order to show the effectiveness of the proposed macro/micro flip chip mounting head system, we com...

• 전자공학회논문지C
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• 제35C권12호
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• pp.49-58
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• 1998

본 논문에서는 무고정 부분 스캔 테스트 방법을 위한 새로운 스캔 선택 알고리즘에 대하여 논한다. 무고정 부분 스캔 테스트 방법은 모든 플립-플롭을 스캔하지 않는다는 점을 제외하면 완전 스캔과 동일한 테스트 방법이다. 이 테스트 방법은 테스트 벡터를 입력, 인가, 혹은 적용 등, 어느 때에도 스캔, 비스캔 중 어느 플립-플롭의 데이터 값도 고정하지 않는다. 제안된 스캔 선택 알고리즘은 무고정 부분 스캔 테스트 방법에서 완전 스캔 고장 검출율을 거의 유지하면서 많은 플립-플롭을 스캔하지 않게 한다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1717-1722
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• 2003

In this paper we developed flip-chip bonder using XY stage, liner-rotary actuator and vision system. We depicted the major parts of the developed flip-chip bonder. Then we discussed several problems and their solutions such as vision and motion control, pick-up module position accuracy, separation of chip from the blue taped hoop, etc. We used a post guide to improve the horizontal positional accuracy against the long arm. Also, we used an ejector module and synchronization technique for easy chip separation from the blue tape.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.120-125
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• 2008

A flip-chip bonding system using DPSS(Diode Pumped Solid State) Nd:YAG laser(wavelength : 1064nm) which shows a good quality in fine pitch bonding is developed. This laser bonder can transfer beam energy to the solder directly and melt it without any physical contact by scanning a bare chip. By using a laser source to heat up the solder balls directly, it can reduce heat loss and any defects such as bridge with adjacent solder, overheating problems, and chip breakage. Comparing to conventional flip-chip bonders, the bonding time can be shortened drastically. This laser precision micro bonder can be applied to flip-chip bonding with many advantage in comparison with conventional ones.

• 한국초전도ㆍ저온공학회논문지
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• 제4권1호
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• pp.35-39
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• 2002

We have simulated and laid out a Single Flux Quantum(SFQ) AND gate for Arithmetic Logic Unit by using XIC, WRspice and Lmeter. SFQ AND gate circuit is a combination of two D Flip-Flop. D Flip-Flop and dc SQUID are the similar shape form the fact that it has the loop inductor and two Josephson junction We obtained perating margins and accomplished layout of the AND gate. We got the margin of $\pm$38%. over. After layout, we drew mask for fabrication of SFQ AND sate. This mask was included AND gate, dcsfq, sfqdc, rs flip-flop and jtl.

• 한국생산제조학회지
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• 제19권2호
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.