Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill

무연 솔더 접합부을 갖는 플립칩에서의 언더필 및 범프 피치 변화에 의한 열 피로 수명 예측 해석

  • 김성걸 (서울산업대학교 기계 설계자동화공학부) ;
  • 김주영 (서울산업대학교 에너지 환경 대학원 Nano/IT 공학과)
  • Received : 2009.04.01
  • Accepted : 2009.10.11
  • Published : 2010.04.15
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Abstract

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

Keywords

References

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