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Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill  

Kim, Seong-Keol (서울산업대학교 기계 설계자동화공학부)
Kim, Joo-Young (서울산업대학교 에너지 환경 대학원 Nano/IT 공학과)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.19, no.2, 2010 , pp. 157-162 More about this Journal
Abstract
This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.
Keywords
Solder joints; Flip Chip; UBM; Underfill; Fatigue life; Viscoplastic behavior;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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