• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.7
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• pp.39-46
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• 2009

A fast-switching current-pulse driver for light emitting diode (LED) backlight is proposed. It uses a regulated drain current mirror (RD-CM) [1] and a high-voltage NMOS transistor (HV-NMOS). It achieves the fast-response current-pulse switching by using a dynamic gain-boosting amplifier (DGB-AMP). The DGB-AMP does not discharge the large HV-NMOS gate capacitance of the RD-CM when the output current switch turns off. Therefore, it does not need to charge the HV-NMOS gate capacitance when the switch turns on. The proposed current-pulse driver achieves the fast current switching by removing the repetitive gate discharging and charging. Simulation results were verified with measurements performed on a fabricated chip using a 5V/40V 0.5um BCD process. It reduces the switching delay to 360ns from 700ns of the conventional current-pulse driver.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.1
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• pp.36-42
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• 2007

A low-power compact driver for multistandard physical layer is presented. The proposed driver achieves low power and small area through the voltage-mode driver with trans-impedance configuration and the novel hybrid driver,. In the voltage-mode driver, a trans-impedance configuration alleviates the problem of limited common-mode range of error amplifiers and the area and power overhead due to pre-amplifier. For a standard with extended output swing, only current sources are added in parallel with the voltage-mode driver, which is named a 'hybrid driver'. The hybrid architecture not only increases output swing but reduces overall driver area. The overall driver occupies $0.14mm^2$. Power consumptions under 3.3-V supply are 24.5 mW for the voltage-mode driver and 44.5 mW for the hybrid driver.

• ETRI Journal
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• v.27 no.2
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• pp.133-139
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• 2005

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 ${\mu}$ gate-length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2mm${\times}$ 2mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1mm${\times}$ 2mm. The frequency doubler achieved an output power of -6 dBm at 76.5 GHz with a conversion gain of -16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2mm ${\times}$ 1.2mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W-band.

• ETRI Journal
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• v.42 no.5
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• pp.773-780
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• 2020

A 40 nm complementary metal oxide semiconductor carrier-aggregated drive amplifier with high linearity is presented for sub-GHz Internet of Things applications. The proposed drive amplifier consists of two high linear amplifiers, which are composed of five differential cascode cells. Carrier aggregation can be achieved by switching on both the driver amplifiers simultaneously and combining the two independent signals in the current mode. The common gate bias of the cascode cells is selected to maximize the output 1 dB compression point (P1dB) to support high-linear wideband applications, and is used for the local supply voltage of digital circuitry for gain control. The proposed circuit achieved an output P1dB of 10.7 dBm with over 22.8 dBm of output 3rd-order intercept point up to 0.9 GHz and demonstrated a 55 dBc adjacent channel leakage ratio (ACLR) for the 802.11af with -5 dBm channel power. To the best of our knowledge, this is the first demonstration of the wideband carrier-aggregated drive amplifier that achieves the highest ACLR performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.213-216
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• 2008

The voltages for pixel electrodes on LCD panels are supplied with analog voltages from LCD Driver ICs (LDIs). The latest LDI developed for large LCD TV's has suffered from the degradation of analog output characteristics (target voltage: AVO and output voltage deviation: dVO). By the failure analysis, humps in $I_D-V_G$ curves have been observed in high voltage (HV) NMOS devices for input transistors in amplifiers. The hump is investigated to be the main cause of the deviation for the driving current in HV NMOS transistors. It also makes the matching between two input transistors worse and consequently aggravates the analog output characteristics. By simply modifying the active layout of HV NMOS transistors, this hump was removed and the analog characteristics (AVO &dVO) were improved significantly. In the help of the improved analog characteristics, it also became possible to reduce the size of the input transistors less than a half of conventional transistors and significantly improve the integration density of LDIs.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.979-982
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• 2003

Due to the differential transmission technique and low voltage swing, LVDS has been widely used for high speed transmission with low power consumption. This paper presents the design and implementation of interface circuits for 1.5Gb/s operation in 0.35um CMOS technology. The interface circuit ate fully compatible with the low-voltage differential signaling(LVDS) standard. The LVDS proposed in this paper utilizes a sense amplifiers instead of the conventional differential pre-amplifier, which provides a 1.5Gb/s transmission speed with further reduced driver output voltage. Furthermore, the reduced driver output voltage results in reducing the power consumption.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.10
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• pp.61-66
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• 2007

A gain enhancement rail-to-rail buffer amplifier for liquid crystal display (LCD) source driver is proposed. An op-amp with extremely high gain is needed to decrease the offset voltage of the buffer amplifier. Cascoded floating current source and class-AB control block in the op-amp achieve a high voltage gain by reducing the channel length modulation effect in high voltage technologies. HSPICE simulation in $1\;{\mu}V$ 15 V CMOS process demonstrates that voltage gain is increased by 30 dB. The offset voltage is improved from 6.84 mV to $400\;{\mu}V$. Proposed op-amp is fabricated in an LCD source driver IC and overall system offset voltage is decreased by 2 mV.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.409-412
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• 2000

A high performance EEG signal measurement system is fabricated. It consists of high precision pre-amplifier and auto identification bandwidth unit. High precision pre-amplifier is composed of signal generator, signal amplifier with a impedance converter, body driver and isolation amplifier. The pre-amplifier is designed for low noise characteristics, high CMRR, high input impedance, high IMRR and safety, Auto identification bandwidth unit is composed of AD-converter and PIC micro-controller for real time processing EEG signal. The performance of EEG signal measurement system has been shown the classified bandwidth through the clinical demonstrations.

• Proceedings of the IEEK Conference
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• 1999.11a
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• pp.1163-1166
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• 1999

In this paper, A CMOS power amplifier for PCS is designed with 0.65-$\mu\textrm{m}$ CMOS technology. Differential cascode structure is used which has good reverse isolation and wide voltage swing. This amplifier circuits consist of three stages which are power amplification stage, driver stage and power control stage. We obtain output power of 30 ㏈m, IMD3 of -31㏈c and efficiency of 30 % at input power of 4 ㏈m.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.10
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• pp.31-39
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• 2009

This paper presents the single supply power line communication(PLC) SoC ASIC with built-in analog frond-end circuit. To achieve the low power consumption along with low chip cost, this PLC SoC ASIC employs fully CMOS analog front-end(AFE) and several built-in Regulators(LDOs) powering for Core logic, ADC, DAC and IP Pad driver. The AFE includes RX of pre-amplifier, Programmable gain amplifier and 10 bit ADC and TX of 10bit Digital Analog Converter and Line driver. This PLC Soc was implemented with 0.18um 1 Poly 5 Metal CMOS process. The single power supply of 3.3V is required for the internal LDOs. The total power consumption is below 30mA at standby and 300mA at active which meets the eco-design requirement. The chips size is $3.686\;{\times}\;2.633\;mm^2$.