• 대한전자공학회논문지SD
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• 제48권7호
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• pp.30-36
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• 2011

많은 반도체 회사들이 메모리 층 사이에서 수직 버스의 역할을 하는 TSV를 사용한 3차원 메모리를 개발하고 있다. 3차원 메모리는 KGD로 이루어지며, 만약 추가 고장이 접합 공정 중에 발생한다면, 반드시 수리되어야 한다. 공유 예비 셀을 가지는 3차원 메모리의 수율을 증진시키기 위해서, 3차원 메모리 내의 메모리 다이를 효과적으로 적층하는 다이 매칭 방법이 필요하다. 본 논문에서는 공유 예비 셀을 가지는 3차원 메모리의 수율 증진을 위해 접합 공정에서 추가 고장이 발생하는 경우를 고려한 다이 매칭 방법을 제안한다. 세 가지 경계 제한 조건이 제안하는 다이 매칭 방법에서 사용된다. 이 조건은 3차원 메모리를 제작하기 위해 선택하는 메모리 다이의 검색 범위를 제한한다. 시뮬레이션 결과는 제안하는 다이 매칭 방법이 3차원 메모리의 수율을 크게 향상 시킬 수 있음을 보여 준다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.277-280
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• 2004

In recent die industry, web-based production control system is applied widely because of the improvement of IT technology. In result, many researches are published about remote monitoring at a long distance. The target of this study is to develop Die Discrimination System using web-based vision, and CAD API when client discriminates die in process at a long distance. Special feature of this system is to use 2D vision image and to match with DB. We can get discrimination result enough to want with short time and a little low precision in web-monitoring by development of this system.

• Design & Manufacturing
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• 제16권3호
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• pp.34-38
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• 2022

Regular expression pattern matching is widely used in applications such as computer virus vaccine, NIDS and DNA sequencing analysis. Hardware-based pattern matching is used when high-performance processing is required due to time constraints. ReCPU, SMPU, and REMP, which are processor-based regular expression matching processors, have been proposed to solve the problem of the hardware-based method that requires resynthesis whenever a pattern is updated. However, these processor-based regular expression matching processors inefficiently handle repetitive operations of regular expressions. In this paper, we propose a new instruction set to improve the inefficient repetitive operations of ReCPU and SMPU. We propose REMPi, a regular expression matching processor that enables efficient iterative operations based on the REMP instruction set. REMPi improves the inefficient method of processing a particularly short sub-pattern as a repeat operation OR, and enables processing with a single instruction. In addition, by using a down counter and a counter stack, nested iterative operations are also efficiently processed. REMPi was described with Verilog and synthesized on Intel Stratix IV FPGA.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권2호
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• pp.139-149
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• 2012

A 3D stacked IC is made by multiple dies (possibly) with heterogeneous process technologies. Therefore, die-to-die variation in 2D chips renders on-package variation (OPV) in a 3D chip. In spite of the different variation effect in 3D chips, generally, 3D die stacking can produce high yield due to the smaller individual die area and the averaging effect of variation on data path. However, 3D clock network can experience unintended huge clock skew due to the different clock propagation routes on multiple stacked dies. In this paper, we analyze the on-package variation effect on 3D clock networks and show the necessity of a post silicon management method such as body biasing technique for the OPV induced 3D clock skew control in 3D stacked IC designs. Then, we present a parametric yield improvement method to mitigate the OPV induced 3D clock skew.

• 한국전자파학회논문지
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• 제26권6호
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• pp.540-545
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• 2015

본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) die를 이용하여 S-대역 내부 정합형 전력 증폭기 설계, 제작 그리고 실험 결과에 대해 기술하였다. S-대역 내부 정합형 전력 증폭기를 설계하기 위하여 고유전율을 가지는 기판과 알루미나 기판을 이용하여 입/출력단 정합 회로를 설계 및 제작하였다. 측정 결과로는 펄스 모드로 동작시켰을 때 3 GHz에서 55.4 dBm의 출력 전력, 78 % 드레인 효율 그리고 11 dB의 전력 이득을 얻었다.

• 한국전자파학회논문지
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• 제25권6호
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• pp.646-652
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• 2014

본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) die를 이용하여 Ku-대역 전력 증폭기 설계, 제작 그리고 실험 결과에 대해 기술하였다. 저비용으로 Ku-대역 전력 증폭기를 설계하기 위하여 고가의 알루미나 회로 기판 제작 대신 PCB(Printed Circuit Board)를 이용하여 입/출력단 정합 회로를 이용하였다. 측정 결과로는 펄스 모드로 동작시켰을 때 14.8 GHz에서 42.6 dBm의 출력 전력, 37.7 % 드레인 효율 그리고 7.9 dB의 선형 이득을 얻었다. CW(Continuous Wave) 실험 결과로는 39.8 dBm의 출력 전력, 24.1 %의 드레인 효율 그리고 7.2 dB의 선형 이득을 얻을 수 있었다.

• 한국시뮬레이션학회논문지
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• 제12권3호
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• pp.13-20
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• 2003

Semiconductor Manufacturing has emerged as one of the most important world industries. Even with the highly automated and precisely monitored facilities used to process the complex manufacturing steps in a near particle free environment, processing variations in wafer fabrication still exist. The causes of these variations may arise from equipment malfunctions, delicate and difficult processing steps, or human mistakes. In this paper, we could specify the cause stage and the cause equipment and take countermeasures at a speed by the conventional method, without depending on the experience and skills of the engineer

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권2호
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• pp.186-192
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• 2012

Half-rail stacked drivers are used to reduce power consumption of the drivers for synchronous buck converters. In this paper, the stacked driver is optimized by matching the average charging and discharging currents used by high-side and low-side drivers. By matching the two currents, the average intermediate bias voltage can remain constant without the aid of the voltage regulator as long as the voltage ripple stays within the window defined by the hysteresis of the regulator. Thus the optimized driver in this paper can minimize the power consumption in the regulator. The current matching requirement yields the value for the intermediate bias voltage, which deviates from the half-rail voltage. Furthermore the required capacitance is also reduced in this design due to decreased charging current, which results in significantly reduced die area. The detailed analysis and design of the stacked driver is verified through simulations done using 5V MOSFET parameters of a typical 0.35-${\mu}m$ CMOS process. The difference in power loss between the conventional half-rail driver and the proposed driver is less than 1%. But the conventional half-rail driver has excess charge stored in the capacitor, which will be dissipated in the regulator unless reused by an external circuit. Due to the reduction in the required capacitance, the estimated saving in chip area is approximately 18.5% compared to the half-rail driver.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권3호
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• pp.179-192
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• 2008

A multiphase compensation method with mismatch linearization technique, is presented and demonstrated in a $\Sigma-\Delta$ fractional-N frequency synthesizer. An on-chip delay-locked loop (DLL) and a proposed delay line structure are constructed to provide multiphase compensation on $\Sigma-\Delta$ quantizetion noise. In the delay line structure, dynamic element matching (DEM) techniques are employed for mismatch linearization. The proposed $\Sigma-\Delta$ fractional-N frequency synthesizer is fabricated in a $0.18-{\mu}m$ CMOS technology with 2.14-GHz output frequency and 4-Hz resolution. The die size is 0.92 mm$\times$1.15 mm, and it consumes 27.2 mW. In-band phase noise of -82 dBc/Hz at 10 kHz offset and out-of-band phase noise of -103 dBc/Hz at 1 MHz offset are measured with a loop bandwidth of 200 kHz. The settling time is shorter than $25{\mu}s$.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권1호
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• pp.126-142
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• 2016

This paper presents a wide-frequency-range, low-power transceiver with an automatic impedance-matching calibration for TV-white-space (TVWS) application. The wide-range automatic impedance matching calibration (AIMC) is proposed for the Drive Amplifier (DA) and LNA. The optimal $S_{22}$ and $S_{11}$ matching capacitances are selected in the DA and LNA, respectively. Also, the Single Pole Double Throw (SPDT) switch is integrated to share the antenna and matching network between the transmitter and receiver, thereby minimizing the systemic cost. An N-path filter is proposed to reject the large interferers in the TVWS frequency band. The current-driven mixer with a 25% duty LO generator is designed to achieve the high-gain and low-noise figures; also, the frequency synthesizer is designed to generate the wide-range LO signals, and it is used to implement the FSK modulation with a programmable loop bandwidth for multi-rate communication. The TVWS transceiver is implemented in $0.13{\mu}m$, 1-poly, 6-metal CMOS technology. The die area of the transceiver is $4mm{\times}3mm$. The power consumption levels of the transmitter and receiver are 64.35 mW and 39.8 mW, respectively, when the output-power level of the transmitter is +10 dBm at a supply voltage of 3.3 V. The phase noise of the PLL output at Band 2 is -128.3 dBc/Hz with a 1 MHz offset.