• 제목/요약/키워드: annealing ambient

검색결과 319건 처리시간 0.027초

Formation of Mo-Silicide on Mo Tip

  • Oh, Chang-Woo;Kim, Yoo-Jong;Lee, Jong-Duk;Park, Byung-Gook
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.217-218
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    • 2000
  • This paper describes a formation of the Mo-silicide on Mo tip to compare the emission characteristics of the Mo tip. Cone-shaped Mo tip arrays were fabricated and silicidized by evaporating a 15nm-thick a-Si film on Mo tip arrays and annealing it in inert ambient at the temperature of $1000\;^{\circ}C$ for 60 sec. The $Mo_5Si_3$ phase of Mo-silicide was observed through X-ray diffraction (XRD) analysis. Although the gate voltage of the Mo-silicide tip increased by 38 V to obtain the current level of 20 nA/tip, the dependence of emission current on vacuum level was improved.

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RTA를 이용한 Cobalt Silicide의 형성 및 Growth Rate d에 관한 연구 ("A Study on the formation of Cobalt Silicide and its Growth Rate by Rapid Thermal Annealing(RTA)")

  • 강유석;김효완;황호정
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
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    • pp.387-390
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    • 1988
  • The increases in the packing density and the resulting shrinkage of silicon integrated circuit dimensions led to the investigation and successful of the deposited silicide layers as the gate and interconnection and contact metallization. In this paper evaporated Co films on n-Si have been rapid thermal annealed in $N_2$ambient at temperature of $400^{\circ}C-1000^{\circ}C$. The Co silicide formation is characterized by sheet resistance (4PP). Also, silicide growth rate and its reproductivity has been examined by SEM.

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X-ray and Plasma Process Induced Damages to PLZT Capacitor Characteristics for DRAM Applications

  • Kim, Jiyoung
    • The Korean Journal of Ceramics
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    • 제3권3호
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    • pp.213-217
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    • 1997
  • In this paper, the imparct of X-ray and plasma process-induced-damages to La doped Lead Zirconate Titanate (PLZT, (Pb1-xLa)(Zr0.5Ti0.5)O3) capacitor characteristics have been investigated from the viewpoint of gigabit scale dynamic random access memory (DRAM) applications. Plamsa damage causes asymmetric degradation on hysteresis characteristics of PLZT films. On the other hand, X-ray damage results in a symmetrical reduction of charge storage densities (Qc's) for both polarities. As La concentration increases in the films, the radiation hardness of PLZT films on X-ray and plasma exposures is improved. It is observed that the damaged devices are fully recovered by thermal annealing under oxygen ambient.

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$WO_3$ 박막을 이용한 $NO_x$ 센서의 제조 및 가스감도 특성 (Fabrication and Gas-Sensing Characteristics of $NO_x$ Sensors using $WO_3$ Thin Films)

  • 유광수;김태송;정형진
    • 한국세라믹학회지
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    • 제32권12호
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    • pp.1369-1376
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    • 1995
  • The WO3 thin-film NOx sensor which is of practical use and includes the heater and the temperature sensor was fabricated. The WO3 thin films as a gas-sensing layer was deposited at ambient temperature in a high-vacuum resistance heated evaporator. The highest sensitivity of the WO3 thin-film sensor to NOx was obtained under the condition of the annealing temperature of 50$0^{\circ}C$ and the operating temperature of 30$0^{\circ}C$. The gas sensing characteristics of this sensor was excellent, i.e. high sensitivity (Rgas/Rair in 3 ppm NO2=53) and fast response time (4 seconds).

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The Strategy to Fabricate the MTiO3(M = Sr, Ba) Thin Films by Laser Ablation

  • Im, T.M.;Park, J.Y.;Kim, H.J.;Choi, H.K.;Jung, K.W.;Jung, D.
    • Bulletin of the Korean Chemical Society
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    • 제29권2호
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    • pp.427-430
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    • 2008
  • BaTiO3 and SrTiO3 thin films were fabricated on Pt/Ti/SiO2/Si substrate by the pulsed laser deposition process. The dependence of the deposited film quality upon the partial oxygen pressure during the deposition process was importantly examined. Regardless of the oxygen pressure, the as-deposited films were not fully crystallized. However, the film deposited at low oxygen pressure became well crystallized after the annealing process. It was concluded, therefore, that the partial oxygen pressure is reduced as low as possible during the deposition process and then anneal the as-deposited samples at ambient pressure to fabricate the well crystallized SrTiO3 and BaTiO3 films by laser ablation.

코발트실리사이드 박막을 이용한 발열 엑츄에이터의 제작 (Fabrication of Heating Actuator Using Cobalt Silicided Thin Films)

  • 노영규;장호정
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.234-237
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    • 2002
  • The cobalt silicide was formed OH POly-Si/SiO$_2$/Si Substrates by the E-beam evaporation of Co metal and rapid thermal annealing method for the application of heating actuators. The most stable CoSi$_2$crystal was obtained at temperature of above $700^{\circ}C$ for 20 sec in $N_2$ambient. From the SEM observation, the thickness and diameter of the heating elements were about $1{\mu}{\textrm}{m}$ and $50{\mu}{\textrm}{m}$, respectively. Temperature resistance coefficient of heating elements was found to be about 0.0014($1/^{\circ}C$) with $30~35\Omega$ of resistance.

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A Study on the Dielctric Properties of the PTC $BaTiO_3$ Ceramic Thin Films

  • Im, Ik-Tae;So, Byung Moon
    • 반도체디스플레이기술학회지
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    • 제11권3호
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    • pp.63-67
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    • 2012
  • The films were deposited at evaporator system and were annealed at heat treatment. The films had a dense microstructure with fine grains. The electrical properties of the films were dramatically controlled with annealing. Samples Preparation were analyzed in term of positive temperature coefficient of Resistivity Samples were made in the substrate tempera-true of $400^{\circ}C$ deposition time of 10 hours, and forward power of 210watt. R-T(resistivity-temperature) Characteristics of the samples were investigated as a function of the substrate type and the ambient temperature. The resistivity of the thin film specimens was compared with that of the bulk type specimens. By using RF/DC magnetron sputtering system, we obtained lower resistivity in the thermistor with thin $BaTiO_3$ film than that in the bulk type thermistor.

Thermal stabilityof fluorine doped silicon oxide films

  • Lee, Seog-Heong;Yoo, Jae-Yoon;Park, Jong-Wan
    • Journal of Korean Vacuum Science & Technology
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    • 제2권1호
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    • pp.25-31
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    • 1998
  • The reliability of fluorine doped silicon oxide (SiOF) films for intermetal dielectrics in multilevel interconnections of ultra-large scale integrated circuits (ULSIs) is investigated. SiOF films were deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition (ECRPECVD) using H-free source gases, i.e., SiF4 and O2. The effect of post plasma treatment on the moisture absorption and dielectric properties of SiOF films was carried out I terms of air exposure time, The reliability test of Cu/TiN/SiOF/Fi specimen was carried out in terms of temperature by rapid thermal annealing (RTA) in N2 ambient. After O2 plasma treatment,, no appreciable peak directly related to moisture absorption was detected. The capacitance-voltage (C-V) characteristics of the O2 plasma treated SiOF film showed that the film remained to hold the sound dielectric properties even after boiling treatment. The Cu/TiN/SiOF/Si system was found to be reliable up to $600^{\circ}C$.

산화물 전구체 기반의 MOD방법을 이용한 YBCO 고온초전도 선재의 batch-type 제조 공정 (Batch-type fabrication process of YBCO coated conductor using oxide-precursor-based MOD method)

  • 정국채;유재무;고재웅;김영국
    • 한국초전도ㆍ저온공학회논문지
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    • 제7권3호
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    • pp.9-12
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    • 2005
  • [ $Y_1Ba_2Cu_3O_{7-8}$ ] (YBCO) coated conductor has been fabricated by batch-type process using oxide-precursor-based metal-organic deposition (MOD) method. The batch-type process can be scaled up more simply to Produce long-length YBCO conductor than the reel-to-reel process. Also, it has less handling problems and is adequate to the ambient gas environment. In this work, YBCO oride powder was used as a starting precursor for MOD method. After reel-to-reel dip coating process, me ter-long-buffered metal tape was wound around a cylinder and underwent calcination and annealing processes. Annealed YBCO films showed good c-axis alignment and dense surface morphology with no cracks, but exhibited very low critical current density of $10^5\;A/cm^2$.

스퍼터링을 이용한 $YMnO_3$/Si(100) 구조의 제작 (Fabrication of $YMnO_3$/Si(100) Structures by RF Magnetron Sputtering)

  • 김진규;김채규;정순원;김용성;이남열;김광호;유병곤;이원재;유인규
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.429-432
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    • 1999
  • The growth of $\textrm{YMnO}_3$ films directly on Si(100) substrates by RF magnetron sputtering system has been performed. The structural properties of $\textrm{YMnO}_3$ films on Si(100) by rapid thermal annealing(RTA) analysed by XRD(X-ray diffraction). The c-axis oriented $\textrm{YMnO}_3$ peaks were observed deposited in $\textrm{YMnO}_3$/Si(100) structure at RF power of 100W and at a temperature range of $840^{\circ}C$~$870^{\circ}C$ in oxygen ambient.

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