• 제어로봇시스템학회논문지
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• 제17권11호
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• pp.1125-1131
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• 2011

This paper presents a control theoretic approach to realizing fault tolerance in asynchronous sequential circuits. The considered asynchronous circuit is assumed to work in space environment and is subject to faults caused by total ionizing dose (TID) effects. In our setting, TID effects cause permanent changes in state transition characteristics of the asynchronous circuit. Under a certain condition of reachability redundancy, it is possible to design a corrective controller so that the closed-loop system can maintain the normal behavior despite occurrences of TID faults. As a case study, the proposed control scheme is applied to an asynchronous arbiter implemented in FPGA.

• 전기전자학회논문지
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• 제27권3호
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• pp.303-307
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• 2023

본 논문은 Buried Channel Array Transistor(BCAT) 소자의 Oxide 내부에 Total Ionizing Dose(TID) effects으로 인한 Electron-Hole Pair의 생성이 유도되어, Oxide 계면의 Hole Trap Charge의 증가에 따른 누설전류의 증가와 문턱 전압의 변화를 기존에 제안한 Partial Isolation Buried Channel Array Transistor(Pi-BCAT)구조와 비교 시뮬레이션 하여, Pi-BCAT 소자의 증가한 Oxide 면적과 상관없이 변화한 누설전류와 문턱 전압에서의 특성이 비대칭 도핑 BCAT 구조보다 우수함을 보여 준다.

• Journal of Astronomy and Space Sciences
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• 제33권3호
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• pp.229-236
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• 2016

We present proton-induced single event effects (SEEs) and γ-ray-induced total ionizing dose (TID) data for 1 Gbit lowpower double data rate synchronous dynamic random access memory (LPDDR SDRAM) fabricated on a 5 μm epitaxial layer (54 nm complementary metal-oxide-semiconductor (CMOS) technology). We compare our radiation tolerance data for LPDDR SDRAM with those of general DDR SDRAM. The data confirms that our devices under test (DUTs) are potential candidates for space flight applications.

• Journal of Electrical Engineering and Technology
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• 제12권4호
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• pp.1619-1626
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• 2017

Electronic components that are used in high-level radiation environment require a semiconductor device having a radiation-hardened characteristic. In this paper, we proposed a radiation-hardened I-gate n-MOSFET (n-type Metal Oxide Semiconductors Field Effect Transistors) using a layout modification technique only. The proposed I-gate n-MOSFET structure is modified as an I-shaped gate poly in order to mitigate a radiation-induced leakage current in the standard n-MOSFET structure. For verification of its radiation-hardened characteristic, the M&S (Modeling and Simulation) of the 3D (3-Dimension) structure is performed by TCAD (Technology Computer Aided Design) tool. In addition, we carried out an evaluation test using a $Co^{60}$ gamma-ray source of 10kGy(Si)/h. As a result, we have confirmed the radiation-hardened level up to a total ionizing dose of 20kGy(Si).

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2005년도 한국우주과학회보 제14권1호
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• pp.143-147
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• 2005

우주시스템 연구실에서 개발 중인 HAUSAT-2의 우주방사능 환경은 포획된 양자와 전자, 태양양성자이다. 본 논문에서는 우주방사능 환경에 대해 임무기간동안의 총 피폭량을 계산하였고, 총 피폭량에 대해 HAUSAT-2에서 사용하는 부품들의 부품의 우주방사능 허용레벨 분류과정을 통해 사용가능성을 검증하였다. 또한 단일사건 발생확률을 계산하여 단일사건 발생에 대비하는 시스템을 설계에 반영하였다.

• Nuclear Engineering and Technology
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• 제54권12호
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• pp.4422-4430
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• 2022

Studying the effects of gamma radiation on the instrumentation and control (I&C) system of a nuclear power plant is critical to the successful and reliable operation of the plant. In the accidental scenario, the adverse environment of ionizing radiation affects the performance of the I&C system and it leads to inaccurate and incomprehensible results. This paper reports the effects of gamma radiation on the AT89C51RD2, a commercial-off-the-shelf 8-bit high-performance flash microcontroller. The microcontroller, selected for the device under test for this study is used in the remote terminal unit for a nuclear power plant. The custom circuits were made to test the microcontroller under different gamma doses using a ⁶⁰Co gamma source in both ex-situ and in-situ modes. The device was exposed to a maximum dose of 1.5 kGy. Under this hostile environment, the performance of the microcontroller was studied in terms of device current and voltage changes. It was observed that the microcontroller device can operate up to a total absorbed dose of approximately 0.6 kGy without any failure or degradation in its performance.

• 전자공학회논문지
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• 제50권6호
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• pp.85-90
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• 2013

본 논문에서는 본 연구실에서 제안된 Dummy Gate Assisted MOSFET을 이용하여 6bit SAR (Successive Approximation Register) ADC를 설계하였으며 이에 대한 대조군으로 Conventional MOSFET으로 동일한 회로를 설계하여 두 회로의 Co-60 Gamma Ray에 의한 누적방사선 영향을 비교 분석해 보았다. 설계된 SAR ADC는 Binary Capacitor DAC과 Dynamic Latch 형태의 Comparator 그리고 Logic으로 구성이 되었으며, 0.35um standard CMOS공정으로 제작되었다. 방사선 조사 후 Conventional MOSFET을 이용한 ADC는 정상동작하지 못하였지만, Dummy Gate Assisted MOSFET을 사용한 ADC는 방사선 조사 후 DNL은 0.7LSB에서 2.0LSB, INL은 1.8LSB에서 3.2LSB로 다소 증가하였으나 정상적인 A/D 변환이 가능하다는 것을 확인하였다.

• Journal of Semiconductor Engineering
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• 제1권3호
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• pp.81-87
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• 2020

An instrumentation amplifier (IA) and an analog-to-digital converter (ADC) are essential circuit blocks for accurate and robust sensor readout systems. This paper introduces recent advances in radiation-hardening by design (RHBD) techniques applied for the sensor readout integrated circuits (IC), e.g., the three-op-amp IA and the successive-approximation register (SAR) ADC, operating against total ionizing dose (TID) and singe event effect (SEE) in harsh radiation environments. The radiation-hardened IA utilized TID monitoring and adaptive reference control to compensate for transistor parameter variations due to radiation effects. The radiation-hardened SAR ADC adopts delay-based double-feedback flip-flops to prevent soft errors which flips the data bits. Radiation-hardened IA and ADC were verified through compact model simulation, and fabricated CMOS chips were measured in radiation facilities to confirm their radiation tolerance.

• Nuclear Engineering and Technology
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• 제54권6호
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• pp.2198-2203
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• 2022

As robotics become more sophisticated, there are a growing number of generic systems being used for routine tasks in nuclear environments to reduce risk to radiation workers. The nuclear sector has called for more commercial-off-the-shelf (COTS) devices and components to be used in preference to nuclear specific hardware, enabling robotic operations to become more affordable, reliable, and abundant. To ensure reliable operation in nuclear environments, particularly in high-gamma facilities, it is important to quantify the tolerance of electronic systems to ionizing radiation. To deliver their full potential to end-users, mobile robots require sophisticated autonomous behaviors and sensing, which requires significant computational power. A popular choice of computing system, used in low-cost mobile robots for nuclear environments, is the UP Core single board computer. This work presents estimates of the total ionizing dose that the UP Core running the Robot Operating System (ROS) can withstand, through gamma irradiation testing using a Co-60 source. The units were found to fail on average after 111.1 ± 5.5 Gy, due to faults in the on-board power management circuitry. Its small size and reasonable radiation tolerance make it a suitable candidate for robots in nuclear environments, with scope to use shielding to enhance operational lifetime.

• Nuclear Engineering and Technology
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• 제51권5호
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• pp.1428-1435
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• 2019

The total ionizing dose (TID) and non ionizing energy loss (NIEL) effects of 100 MeV phosphorous ($P^{7+}$) and 80 MeV nitrogen ($N^{6+}$) ions on 200 GHz silicon-germanium heterojunction bipolar transistors (SiGe HBTs) were examined in the total dose range from 1 to 100 Mrad(Si). The in-situ I-V characteristics like Gummel characteristics, excess base current (${\Delta}I_B$), net oxide trapped charge ($N_{OX}$), current gain ($h_{FE}$), avalanche multiplication (M-1), neutral base recombination (NBR) and output characteristics ($I_C-V_{CE}$) were analysed before and after irradiation. The significant degradation in device parameters was observed after $100MeV\;P^{7+}$ and $80MeV\;N^{6+}$ ion irradiation. The $100MeV\;P^{7+}$ ions create more damage in the SiGe HBT structure and in turn degrade the electrical characteristics of SiGe HBTs more when compared to $80MeV\;N^{6+}$. The SiGe HBTs irradiated up to 100 Mrad of total dose were annealed from $50^{\circ}C$ to $400^{\circ}C$ in different steps for 30 min duration in order to study the recovery of electrical characteristics. The recovery factors (RFs) are employed to analyse the contribution of room temperature and isochronal annealing in total recovery.