• Proceedings of the Korea Concrete Institute Conference
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• 2005.05a
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• pp.267-270
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• 2005

Recently, the damaged concrete structures are often strengthened or repaired using the polymer concrete or the polymer cement mortar. In the repaired concrete structures at early ages, internal stresses could be developed due to the differential drying shrinkage of the repair material. Due to the difference of the thermal coefficients of the repair material and existing concrete, additional stresses also could be developed as the structures are subjected to the ambient temperature changes. Theses environmentally-induced stresses can sometimes be large enough to cause damage to the structures, such as debonding of the interface between the two materials. In this study, a rational procedure was developed where anchors can be designed and installed to prevent damages in such structures by thermally-induced stresses. Finally, through the experimental and numerical study, the effects of the repair method using anchors with debonding was investigated and discussed the results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.513-517
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• 1999

High voltage motor(rated 6.6kV and 448kw) has failed in the stator endwinding area during normal service. Experiments on microstructure property were conducted using the control and aged insulations, which were drawn out from stator windings of the high voltage motor. The analyses were characterized using stereozoom microscope(SM), scanning electron microscope(SEM) and energy dispersive X-ray spectroscopy(EDS). SM result shows that large voids are present in the interface between turn insulation and groundwall insulation. SEM results indicated that the groundwall insulation is rarely thermal stress. EDS results showed that chemical elements in the high voltage motor stator insulations were Al, Si, O, K and Fe.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.242-245
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• 1997

Co single layer and Co/Ti used to form a CoSi$_2$ contact. We fabricated the n+/p diodes with this CoSi$_2$ contact as diffusion source of As. The diodes wish CoSi$_2$ formed by Co/ri bilayer had more Bo7d electrical characteristics than CoSi$_2$ formed by Co single layer. This shows that the flatness of interface which is a parameters to affect the diodes\` electrical characteristics. And the electrical characteristics of diodes are more good when the second thermal activation processing temperature was low as much as 50$0^{\circ}C$ than the temperature high over than 80$0^{\circ}C$, it was thought as that the silicide was degradated at high temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.454-455
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• 2007

송전용 자기 애자에 대하여 산물화염 특성과 송전선로의 환경 검토를 토대로 송전용 절연물에 대한 산불화염 열화특성을 1)내열충격 열화와 2) 열충격 싸이클 열화로 나누어 가속시킨 후 절연물의 성능을 시험 평가하였다. 또한 승전용 자기애자 (254mm, 36,000lbs)를 대상으로 실제 삼불열화 조건을 근간으로 기계적, 열적 환경을 고려한 자기애자의의 수축, 팽창 변위에 따른 계면의 응력거동을 열충격 및 내열충격 시험의 결과와 비교 분석하였다.

• Journal of Powder Materials
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• v.13 no.5 s.58
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• pp.321-326
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• 2006

Electronic packaging involves interconnecting, powering, protecting, and cooling of semiconductor circuits fur the use in a variety of microelectronic applications. For microelectronic circuits, the main type of failure is thermal fatigue, owing to the different thermal expansion coefficients of semiconductor chips and packaging materials. Therefore, the search for matched coefficients of thermal expansion (CTE) of packaging materials in combination with a high thermal conductivity is the main task for developments of heat sink materials electronics, and good mechanical properties are also required. The aim of this work is to develop copper matrix composites reinforced with carbon nanofibers. The advantages of carbon nanofibers, especially the good thermal conductivity, are utlized to obtain a composite material having a thermal conductivity higher than 400 W/mK. The main challenge is to obtain a homogeneous dispersion of carbon nanofibers in copper. In this paper, a technology for obtaining a homogeneous mixture of copper and nanofibers will be presented and the microstructure and properties of consolidated samples will be discussed. In order to improve the bonding strength between copper and nanofibers, different alloying elements were added. The microstructure and the properties will be presented and the influence of interface modification will be discussed.

• Journal of Powder Materials
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• v.16 no.6
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.9
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• pp.148-155
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• 1995

The object of this study is to achieve a gteater understanding of meterial removal process and its mechanism. In this study, some applications of finite element techniques are applied to analyze the chip formation and cutting heat generation mechanism of metal cutting. To know the effect of cutting parameters, simulations employed some independent cutting variables change, such as constitutive deformation laws of workpiece and tool material, frictional coefficients and tool-chip contact interfaces, cutting speed, tool rake angles, depth of cut and this simulations also include large elastic-plastic defor- mation, adiabetic thermal analysis. Under a usual plane strain assumption, quasi-static, thermal-mechanical coupling analysis generate detailed informations about chip formation process and cutting heat generation mechanism Some cutting parameters are affected to cutting force, plastic deformation of chip, shear plane angle, chip thickness and tool-chip contact length and reaction force on tool, cutting temperature and thermal behavior. Several aspects of the metal cutting process predicted by the finite element analysis provide information about tool shape design and optimal cutting conditions.

• Transactions on Electrical and Electronic Materials
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• v.9 no.1
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• pp.6-11
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• 2008

In this study, we investigated effects of hydrogen annealing (HA) and plasma nitridation (PN) applied in order to improve $Si/SiO_2$ interface characteristics of TiN metal gate. In result, HA and PN showed a positive effect decreasing number of interface state $(N_{it})$ respectively. After FN stress for verifying reliability, however, we identified rapid increase of $N_{it}$ for TiN gate with HA, which is attributed to hydrogen related to a change of $Si/SiO_2$ interface characteristic. In contrast to HA, PN showed an improved Nit and gate oxide leakage characteristic due to several possible effects, such as blocking of Chlorine (Cl) diffusion and prevention of thermal reaction between TiN and $SiO_2$.

• Korean Journal of Optics and Photonics
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• v.26 no.3
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• pp.168-171
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• 2015

The heat flow characteristics of a high-power optical semiconductor source have been analyzed using a 3D CFD commercial tool, and the thermal resistance values for each of the layers revealed the places for thermal bottlenecks to be improved. As the heat source of a LD (Laser Diode) has a small volume and a narrow surface, the effective thermal cross-sectional area near it is also quite small. It was possible to expand the cross-sectional area effectively by using graphene layers on the TIM (Thermal Interface Material) layers of a LD chip. The effective values of heat resistance for the layers are compared to confirm the improvement effect of the graphene layers before and after, which can be considered to expand the thermal cross section of the heat transfer path.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.133-137
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• 2011

Exfoliated graphite oxide (EGO) was prepared by graphite oxide in an aqueous solution of TMAOH. The hybrid graphene/Zn-Al LDH material was fabricated by the hydrothermal reduction of the solution of EGO, $Zn(NO_3)_2{\cdot}6H_2O$, $Al(NO_3)_3{\cdot}9H_2O$, urea, and trisodium citrate. That is, metal ions were absorbed on the surface of EGO, and Zn-Al LDH material was randomly dispersed on the surface of graphene along with a reduction process of EGO to graphene by hydrothermal treatment. The composition, morphology, and thermal property of the obtained graphene-based hybrid material were studied by FE-SEM, EDX, TEM, FT-IR, XRD, TGA, and DSC.