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http://dx.doi.org/10.3807/KJOP.2015.26.3.168

Heat Conduction Analysis and Improvement of a High-Power Optical Semiconductor Source Using Graphene Layers  

Ji, Byeong-Gwan (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
O, Beom-Hoan (School of Information and Communication Engineering, Inha University, LED-Smart Technology Advanced Research Center (LED-STAR))
Publication Information
Korean Journal of Optics and Photonics / v.26, no.3, 2015 , pp. 168-171 More about this Journal
Abstract
The heat flow characteristics of a high-power optical semiconductor source have been analyzed using a 3D CFD commercial tool, and the thermal resistance values for each of the layers revealed the places for thermal bottlenecks to be improved. As the heat source of a LD (Laser Diode) has a small volume and a narrow surface, the effective thermal cross-sectional area near it is also quite small. It was possible to expand the cross-sectional area effectively by using graphene layers on the TIM (Thermal Interface Material) layers of a LD chip. The effective values of heat resistance for the layers are compared to confirm the improvement effect of the graphene layers before and after, which can be considered to expand the thermal cross section of the heat transfer path.
Keywords
LD; Thermal resistance; Graphene; TIM; Heat flow;
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1 R.-H. Horng, K.-C. Shen, Y.-W. Kuo, and D.-S. Wuu, "GaN light emitting diodes with wing-type imbedded contacts," Opt. Express 21, A1-A6 (2013).   DOI
2 C. Tsou and Y.-S. Huang, "Silicon-based packaging platform for light-emitting diode," IEEE Transactions on Advanced Packaging 29, 607-614 (2006).   DOI   ScienceOn
3 L. Yin, L. Yang, W. Yang, Y. Guo, K. Mac, S. Li, and J. Zhang, "Thermal design and analysis of multi-chip LED module with ceramic substrate," Solid-State Electronics 54, 1520-1524 (2010).   DOI   ScienceOn
4 C. Weng, "Advanced thermal enhancement and management of LED packages," International Communications in Heat and Mass Transfer 36, 245-248 (2009).   DOI
5 M. arik, C. Becker, S. Wever, and J. Petroski, "Thermal management of LEDs: package to system," Proc. SPIE 5187, 64-75 (2004).
6 E. Pop, V. Varshney, and A. K. Roy, "Thermal properties of graphene: Fundamentals and applications," MRS BULLETIN 37, 1273-1281 (2012).   DOI
7 D. D. L. Chung, "Materials for thermal conduction," Applied Thermal Engineering 21, 1593-1605 (2001).   DOI