• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.12
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• pp.83-90
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• 2004

This paper proposes an efficient scan testing method for compression of test input data and reduction of test power for SOC. The proposed method determines whether some parts of a test response can be reused as a part of next input test data on the analysis of deterministic test data and its response. Our experimental results show that benchmark circuits have a high similarity between un-compacted deterministic input test data and its response. The proposed testing method achieves the average of 29.4% reduction of power dissipation based on the number of test clock and 69.7% reduction of test data for ISCAS'89 benchmark circuits.

• Journal of the Institute of Electronics Engineers of Korea TE
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• v.37 no.5
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• pp.56-61
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• 2000

Silicon semiconductor technology agrees that the number of transistors on a chip will keep growing exponentially, and it is pushing technology toward the System-On-Chip. In SoC Design, Specification at system level is key of success. Executable Specification reduces verification time. This Paper describes the design of IMDCT for MPEG Audio Decoder employing system-level design methodology and Executable Specification Methodology in the VHDL simulator with FLI environment.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.3
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• pp.261-266
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• 2004

Recently, a variety of intelligent robots are developed for the personal purpose beyond the industrial application. These intelligent robots have ranges of sensors, actuators, and control algorithms to their application. In this paper we propose a reconfigurable robot controller, $SR^2$c (The SOPC-based Reconfigurable Robot Controller), based on SOPC (System on a Programmable Chip), that can be reconfigurable easily by software. The proposed robot controller contains not only a processing module but also robot-specific IP's. To show a feasibility of the proposed robot controller, a small entertainment robot, Wizard-4 is implemented with a single chip controller as proposed in this paper.

• Journal of KIISE:Computing Practices and Letters
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• v.8 no.3
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• pp.261-267
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• 2002

In SOC(System On a Chip) designs, reducing time and cast for design verification is the most critical to improve the design productivity. this is mainly because the designs require co-verifying HW together with SW, which results in the increase of verification complexity drastically. In this paper, to cope with the verification crisis in SOC designs, we propose a new verification methodology, so called integrated co-verification, which lightly combine both co-simulation and co-emulation in unified and seamless way. We have applied our integrated co-verification to ARM/AMBA platform-based co-verification environment with a commercial co-verification tool, Seamless CVE, and a physical prototyping board. The experiments has shown clear advantage of the proposed technique over conventional ones.

• Journal of KIISE:Computing Practices and Letters
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• v.11 no.1
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• pp.92-99
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• 2005

In this paper, we present a high-level design methodology applied on a network system-on-a-chip(SOC) using SystemC. The main target of our approach is to get optimum performance parameters for high network address translation(NAT) throughput. The Fast Ethernet media access controller(MAC) and its direct memory access(DMA) controller are modeled with SystemC in transaction level. They are calibrated through the cycle-based measurement of the operation of the real Verilog register transfer language(RTL). The NAT throughput of the model is within $\pm$10% error compared to the output of the real evaluation board. Simulation speed of the model is more than 100 times laster than the RTL. The validated models are used for intensive architecture exploration to find the performance bottleneck in the NAT router.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.91-97
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• 2014

Education equipment for field programmable gate array (FPGA) based multimedia player design is introduced. Using the education equipment, an example of hardware design for color detection and augment reality (AR) game is described, and an example of syllabus for "Digital system design using FPGA" course is introduced. Using the education equipment, students can develop the ability to design some hardware, and to train the ability for the creative capstone design through conceptual, partial-level, and detail designs. By controlling audio codec, system-on-chip (SOC) design skills combining a NIOS II soft microprocessor and digital hardware in one FPGA chip are improved. The ability to apply wireless communication and LabView to FPGA-based digital design is also increased.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.12
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• pp.61-70
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• 2007

The density of Memory has been increased by great challenge for memory technology. Therefore, elements of memory become more smaller than before and the sensitivity to faults increases. As a result of these changes, memory testing becomes more complex. In addition, as the number of storage elements per chip increases, the test cost becomes more remarkable as the cost per transistor drops. Recent development in system-on-chip (SOC) technology makes it possible to incorporate large embedded memories into a chip. However, it also complicates the test process, since usually the embedded memories cannot be controlled from the external environment. Proposed design doesn't need controls from outside environment, because it integrates into memory. In general, there are a variety of memory modules in SOC, and it is not possible to test all of them with a single algorithm. Thus, the proposed scheme supports the various memory testing process. Moreover, it is able to At-Speed test in a memory module. consequently, the proposed is more efficient in terms of test cost and test data to be applied.

• Journal of Korea Multimedia Society
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• v.17 no.3
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• pp.324-332
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• 2014

This paper presents a programmable System-On-a-chip for various embedded applications that need Neural Network computations. The system is fully implemented into Field-Programmable Gate Array (FPGA) based prototyping platform. The SoC consists of an embedded processor core and a reconfigurable hardware accelerator for neural computations. The performance of the SoC is evaluated using real image processing applications, such as optical character recognition (OCR) system.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.7
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• pp.74-80
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• 2002

VLSI intergrated circuits like SOC(system on chip) often require a multi-clock design style for functional or performance reasons. The problems of the clock domain transition due to clock skew and clock ordering within a test cycle may result in wrong results. This paper describes a new BIST(Built-in Self Test) architecture for multi-clock systems. In the new scheme, a clock skew is eliminated by a multi-capture. Therfore, it is possible to perform at-speed test for both clock inter-domain and clock intra-domain.