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Low Cost SOC(System-On-a-Chip) Testing Method for Reduction of Test Data and Power Dissipation  

Hur Yongmin (Department of Computer System Engineering, Dong Seoul College)
Lin Chi-ho (Department of Computer Science, Semyung University)
Publication Information
Abstract
This paper proposes an efficient scan testing method for compression of test input data and reduction of test power for SOC. The proposed method determines whether some parts of a test response can be reused as a part of next input test data on the analysis of deterministic test data and its response. Our experimental results show that benchmark circuits have a high similarity between un-compacted deterministic input test data and its response. The proposed testing method achieves the average of 29.4% reduction of power dissipation based on the number of test clock and 69.7% reduction of test data for ISCAS'89 benchmark circuits.
Keywords
scan testing; compression; test power; test data; SOC;
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1 R. Sankaralingam, R. R. Oruganti and N. A. Touba, 'Static compaction techniques to control scan vector power dissipation,' Proc. VLSI Test Symposium, pp.35-40, 2000   DOI
2 A. Jas., C. V. Krishna, and N. A. Touba, 'Hybrid BIST based on weighted pseudo-random testing: a new test resource parti-tioning scheme,' Proc. VLSI Test Symp., pp. 114-120, 2001   DOI
3 P. Gonciari, B. m. Al-Hashimi, and N. Nicolici, 'Improving compression ratio, area overhead, and test application time for system-on-a-chip test data compression/decompression,' Proc. Design Automation Test Eur., pp. 604-611, 2002   DOI
4 L. Whetsel, 'Adapting scan architecture for low power operation,' Proc. Int. Test Conf., pp. 863-872, 2000
5 P. Gonciari, I. Guiller, C. landrault, S. Pravossoudovitch, H. J. Wunderlich, 'A modified clock scheme for a low power BlST test pattern generator,' Proc. VLSI Test Symp., pp. 302-311, 2001
6 Jas, A., Dasidar, J. G., and Touba, N. A., 'Using an embedded processor for efficient deterministic testing of system-on-a-chip,' Proc. IEEE Int. Conf. on Computer Design(ICCD), pp. 418-423, 1999   DOI
7 C. V. Krishna, A. Jas, and N. A. Touba, 'Test vector encoding using partial LFSR reseeding,' Proc. Int. Test Conf., pp. 885-893, 2001   DOI
8 Rosinger, P., Gonciari, T., Al-Hashimi, B. and Nicolici, N., 'Simultaneous reduction in volume of test data and power dissipation for systems-on-a-chip,' lEE Electronics Letters 37(24): pp. 1434-1436, 2001   DOI   ScienceOn
9 D. Das and N. A. Touba, 'Reducing test data volume using externaI/LBlST hybrid test pa-ttern,' Proc. Int Test Conf., pp. 115-122, 2000
10 Ozgur Sinanolu and Alex Orailoglu, 'A novel scan architecture for power-efficient, rapid Test,' Proc. ICCAD, pp. 299-303, 2002   DOI
11 I. Hamzaoglu and J. H. Patel, 'Reducing test application time for full scan embedded cores,' 29th Int. Symp. Fault-Tolerant Comp., pp. 260-267, June, 1999
12 Chandra, A., and Chakrabarty, K., 'Frequency-directed run-length codes with application to system-on-a-chip test data compression,' Proc. IEEE VLSI Test Symposium, pp. 42-47, 2001   DOI
13 Kedarnath J. Balakrishnan and Touba N, A., 'Matrix-based test vector decompression using an embedded processor,' Proc. IEEE Sympo-sium on Defect and Fault Tolerance, pp. 138-146, 2002   DOI
14 Yamaguchi, T., Tilgner, M., Ishida, M., and Ha, D. S., 'An efficient method for compressing test data,' Proc., International Test Conference, pp. 191-197, 1997   DOI
15 EI-Maleh, A., Al-Zahir, S., and Khan, E., 'A geometric primitives based compression scheme for testing system-on-a-chip,' Proc. IEEE VLSI Test Symposium, pp. 54-59, 2001   DOI
16 Chandra, A., and Chakrabarty, K., 'Test data compression for system-on-a-chip using Golomb codes,' Proc. IEEE VLSI Test Symposium, pp. 113-120, 2000
17 A. Chandra and K. Chakrabarty, 'Combining low-power scan testing and test data compression for system-on-a-chip,' Proc. DAC, pp. 166-169, 2001
18 Jas, A., Dastidar, J. G., and Touba, N. A., 'Scan vector compression/decompression using stati-stical coding,' Proc. IEEE VLSI Test Sympo-sium, pp. 114-120, 1999   DOI